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GlobalFoundries

GlobalFoundries

Semiconductor foundry delivering specialized chips

PMTS ASIC Digital Design Engineer - IP Engineering

Full-Time
$167k - $275k/yr
Expert
Bachelor's, Master's
Santa Clara, CA, USA
In Person
Company Does Not Provide H1B Sponsorship

About the job

Requirements
  • A bachelor's or master's degree in Electrical Engineering, Computer Engineering, or a related field.
  • At least 12 years of experience in processor, central processing unit, digital signal processor, or complex system-on-chip digital design.
  • Deep understanding of processor microarchitecture, including pipeline design, cache architectures, branch prediction, memory hierarchy, memory management unit and translation lookaside buffer designs, interrupt and exception handling, and coherency protocols.
  • Expert-level RTL design experience using Verilog and SystemVerilog.
  • Strong understanding of synthesis, timing analysis, clock-domain crossing, reset-domain crossing, and low-power design techniques.
  • Experience with industry-standard electronic design automation tools and design flows.
  • Strong debugging and problem-solving skills.
Responsibilities
  • Develop and implement microarchitecture for CPU cores, cache subsystems, memory management units, interconnects, and system controllers.
  • Translate architectural specifications into RTL designs using Verilog and SystemVerilog.
  • Define and review detailed design specifications, block-level architectures, and implementation strategies.
  • Drive performance optimization, power reduction, and area-efficient design methodologies.
  • Analyze and resolve design trade-offs involving latency, throughput, and scalability.
  • Lead critical processor design initiatives across multiple functional blocks.
  • Mentor junior and senior engineers on microarchitecture, RTL coding practices, and design methodologies.
  • Conduct architecture, microarchitecture, and RTL design reviews.
  • Establish design guidelines and best practices across the organization.
  • Influence roadmap and technology decisions for future processor generations.
  • Partner with architects to evaluate new features and enhancements.
  • Work with verification teams to define verification plans and close coverage.
  • Support synthesis, timing closure, low-power implementation, and physical design activities.
  • Collaborate with design-for-test teams to ensure manufacturability and testability.
  • Support silicon bring-up, debug, characterization, and production ramp activities.
  • Conduct design performance analysis and bottleneck identification.
  • Drive microarchitectural enhancements to improve instructions per cycle, memory latency, and system efficiency.
  • Analyze workload behavior and benchmark performance.
  • Participate in power-performance-area optimization efforts.
  • Support Environmental, Health, Safety, and Security requirements and programs.
Desired Qualifications
  • Experience with RISC-V, ARM, MIPS, ARC, or custom CPU architectures.
  • Knowledge of multi-core and heterogeneous computing systems.
  • Experience in AI or machine-learning acceleration, vector processing, or advanced computing architectures.
  • Experience with performance modeling and architectural simulation.
  • Silicon bring-up and post-silicon debug experience.
  • Exposure to safety-critical designs using ISO 26262 or DO-254.

About the company

GlobalFoundries is a semiconductor foundry that manufactures chips for a broad range of customers, focusing on feature-rich, reliable technologies for cars, IoT, 5G, and other high-growth markets. It operates by fabricating silicon wafers for customer designs, offering mature, specialized processes rather than chasing the most advanced nodes. This makes it different from peers that prize the latest process nodes; GlobalFoundries emphasizes diversification across a global manufacturing footprint (U.S., Europe, Singapore) and stable supply for essential applications. Its goal is to be a leading supplier of high-volume, specialty manufacturing that enables reliable chips for everyday devices and growing tech markets.

Company Size

10,001+

Company Stage

IPO

Headquarters

Town of Malta, New York

Founded

2009

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Simplify's Take

What believers are saying

  • GlobalFoundries won a $375 million CHIPS award on September 8, 2026.
  • Communications infrastructure and data-center revenue grew 62% year over year in Q2 2026.
  • Monolithic Power Systems and Navitas partnerships expand 2027 domestic manufacturing demand.

What critics are saying

  • Smart mobile remains 36% of revenue, and management expects low-teens decline in 2026.
  • GlobalFoundries sued Tower Semiconductor in March 2026, signaling costly IP warfare and distraction.
  • If silicon photonics and quantum programs miss milestones, CHIPS-linked growth narratives evaporate quickly.

What makes GlobalFoundries unique

  • GlobalFoundries owns geographically diverse fabs across U.S., Europe, Singapore for supply security.
  • Its specialty focus on silicon photonics, SiGe, RF, and power separates it from leading-edge foundries.
  • GF's 2026 UX, GCRAM, and advanced packaging launches deepen its niche platform portfolio.

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Benefits

Professional Development Budget

Growth & Insights and Company News

Headcount

6 month growth

-2%

1 year growth

-1%

2 year growth

-1%
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Kepler Computing has raised $468 million from investors including GlobalFoundries, Intel Capital, AMD Ventures, and Bill Gates to develop memory chips that bypass expensive extreme ultraviolet lithography. The San Jose startup uses ferroelectric materials and 3D stacking to increase high-bandwidth memory and SRAM density whilst working with existing semiconductor fabs. The company claims it can convert a fab to next-generation capability in eight months versus the typical 24-month timeline. However, the technology faces contamination challenges because its composite material includes iron, requiring dedicated equipment or encapsulation. Kepler has been testing at GlobalFoundries facilities in Singapore and Vermont, producing chips on approximately 2,000 wafers. The US Department of Commerce committed up to $245 million in July to support domestic development. First HBM samples are planned for late 2025, with US production targeted for 2028.

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