Staff/Senior Staff Physical Design Floorplan & Power Delivery Network Lead

EnCharge AI is a leader in advanced AI hardware and software systems for edge-to-cloud computing. EnCharge’s robust and scalable next-generation in-memory computing technology provides orders-of-magnitude higher compute efficiency and density compared to today’s best-in-class solutions. The high-performance architecture is coupled with seamless software integration and will enable the immense potential of AI to be accessible in power, energy, and space constrained applications. EnCharge AI launched in 2022 and is led by veteran technologists with backgrounds in semiconductor design and AI systems.

Staff/Senior Staff Physical Design Floorplan & PDN Lead

Experience: 10–14 Years

Location:  Bangalore/2 days to work

Department: RTL-to-GDSII / Physical Implementation

Role Overview

We are seeking a high-caliber Staff or Senior Staff Physical Design Engineer with a specialized mastery of Floorplanning and Power Delivery Network (PDN) design. You won’t just be pushing buttons; you will be the architectural bridge between RTL/Systems and the final GDSII. This role requires a visionary who understands how a single floorplan decision ripples through the entire PPA (Power, Performance, Area) spectrum.

As a technical lead, you will own the chip-top floorplan for complex, large-scale SoCs or Sub-chips, driving strategies that balance aggressive performance targets with robust power integrity.

Key Responsibilities

• Architectural Floorplanning: Lead chip-level floorplanning, including macro placement, pin assignment, and partition definition for multi-million gate designs.
• Strategic PDN Design: Architect and implement complex Power Delivery Networks. You will define the metal stack usage and grid density to support high-performance cores while minimizing routing congestion.
• EMIR Mastery: Perform exhaustive IR-drop (Static/Dynamic) and Electromigration (EM) analysis. You must be able to diagnose root causes and propose architectural or physical fixes that don't compromise timing.
• Cross-Functional PPA Trade-offs: Collaborate directly with RTL and Architecture teams. You will use "Design Thinking" to influence the micro-architecture, suggesting changes to bus widths, pipeline stages, or memory configurations to optimize physical outcomes. 
• Methodology Development: Establish best practices and automated flows for floorplanning and PDN synthesis to be used by the wider implementation team.

Technical Requirements

• Core Experience: 10+ years in Physical Design with a proven track record of multiple successful tape-outs at advanced nodes (7nm, 5nm, or 3nm).
• PDN Expertise:Ability to model complex power-up sequences and multi-voltage domains.
• Floorplanning Savvy: Deep proficiency in hierarchical physical design and top-level integration using industry-standard tools (Innovus or IC Compiler II).
• Analysis Skills: Strong understanding of thermal-aware PDN and the physical implications of high-current density paths.
• Scripting: Advanced proficiency in Tcl, Python, or Perl to automate complex floorplanning tasks and data analysis.

Behavioral Attributes

• Critical Thinker: You don't just follow a recipe. You question constraints and look for "hidden" PPA gains.
• Design Thinking: Ability to empathize with the challenges of upstream (RTL) and downstream (Sign-off) teams to create a holistic solution.
• Influence: You can articulate technical trade-offs to stakeholders, 

Education

• B.Tech/M.Tech in Electrical/Electronic Engineering or equivalent.