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Micron Technology

Makes memory and storage chips for AI and PCs

HBM Product Yield Enhancement Failure Analysis Engineer New Grad - HBM PYE Product Development Failure Analysis Engineer

Quality EngineeringConfirmed live in the last 24 hours
Full-timeBoise, ID, USANo salary listedIn-person

About the Job

Requirements

  • A bachelor's degree in Electrical Engineering, Computer Engineering, Physics, Materials Science, or a related technical field, or equivalent experience.
  • Experience or coursework in semiconductor device physics, semiconductor manufacturing processes, or VLSI design.
  • Demonstrated knowledge of statistical analysis techniques and data-driven problem solving.
  • Experience using Python or similar programming languages for data analysis and engineering applications.
  • Ability to analyze complex technical data and communicate findings effectively in a collaborative engineering environment.

Responsibilities

  • Perform electrical, physical, and statistical failure analysis to identify and understand component failure mechanisms.
  • Analyze characterization and manufacturing data to determine root causes of fabrication, assembly, and test-related failures.
  • Collaborate with Product, Process, Quality, and Test Engineering teams to resolve yield, reliability, and process defect issues.
  • Leverage AI-enabled tools and statistical methods to evaluate large datasets, identify trends, and improve component performance.
  • Communicate findings, corrective actions, and risk assessments to multi-functional partners to support successful product qualification and production ramp.

Desired Qualifications

  • A master's degree in Electrical Engineering, Computer Engineering, Physics, Materials Science, or a related field.
  • Academic or industry experience in semiconductor failure analysis, yield enhancement, reliability engineering, or product characterization.
  • Experience applying AI, Generative AI, or AI-assisted analytical tools to support engineering investigations and data analysis.
  • Knowledge of test methodologies, process integration, and advanced memory technologies, including HBM products.
  • Experience working with large datasets and applying statistical software or machine learning techniques to identify failure trends and process improvements.

About the Company

Micron Technology

Makes memory and storage chips for AI and PCs

Micron Technology designs and manufactures memory and storage chips, mainly DRAM and NAND flash, used in data centers, PCs, phones, cars and industrial equipment. It is one of only three companies that make HBM, the stacked high-bandwidth memory placed beside processors in AI servers, and it is the largest memory chipmaker based in the United States. Unlike chip designers that outsource production, Micron runs its own fabs and assembly sites in the United States and across Asia. It earns money by selling chips, memory modules and solid-state drives to cloud providers, device makers and distributors. Micron was founded in 1978 and is headquartered in Boise, Idaho.

Company size
10,001+
Company stage
IPO
Headquarters
Boise, ID
Founded
1978

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