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Micron Technology

Makes memory and storage chips for AI and PCs

Design Architecture Intern - HBM

Silicon & ASIC DesignConfirmed live in the last 24 hours
InternshipRichardson, TX, USANo salary listed

About the Job

Requirements

  • Currently pursuing a Master's degree or PhD in Electrical Engineering, Computer Engineering, Computer Science, Applied Physics, or a related field.
  • Must be able to work onsite for six months and cannot graduate prior to the end of the internship.
  • Strong fundamentals in one or more areas including computer or memory architecture, analog or mixed-signal circuits, high-speed I/O, signal or power integrity, semiconductor packaging, or electrical modeling.
  • Experience with modeling, programming, simulation, or data analysis using tools such as Python, C/C++, MATLAB, SPICE, or similar environments.
  • Ability to learn new tools and work across different levels of hardware and system abstraction.

Responsibilities

  • Research emerging trends in AI systems, memory, high-speed interconnects, and advanced packaging relevant to future HBM.
  • Support HBM architecture analysis across bandwidth, latency, power, energy efficiency, and system-level memory requirements.
  • Develop models and simulation frameworks spanning AI workloads, memory subsystems, high-speed I/O, and electrical interconnects.
  • Analyze HBM I/O and channel behavior, including signaling, jitter, signal and power integrity, and link margins.
  • Explore package and interposer technologies, including RDL, TSVs, chiplets, and 2.5D/3D integration, and their impact on HBM performance.
  • Collaborate across circuit, package, signal-integrity/power-integrity, memory, and system architecture teams to identify opportunities for next-generation HBM.

Desired Qualifications

  • Exposure to AI workloads, computer or memory architecture, or HBM/DRAM systems.
  • Experience with analog or mixed-signal circuits, high-speed I/O, or SerDes.
  • Familiarity with signal or power integrity, channel/interposer modeling, or electromagnetic simulation.
  • Exposure to advanced packaging, silicon interposers, TSV/RDL, chiplets, or 2.5D/3D integration.
  • Experience with modeling or simulation tools such as Python, MATLAB, SPICE, or signal-integrity/power-integrity/electromagnetic tools.
  • Ability to connect circuits, interconnect/package, memory, and system-level performance.
  • Experience using artificial intelligence.
  • Prior experience in one or more of these areas is preferred; prior experience specifically with HBM is not required.

About the Company

Micron Technology

Makes memory and storage chips for AI and PCs

Micron Technology designs and manufactures memory and storage chips, mainly DRAM and NAND flash, used in data centers, PCs, phones, cars and industrial equipment. It is one of only three companies that make HBM, the stacked high-bandwidth memory placed beside processors in AI servers, and it is the largest memory chipmaker based in the United States. Unlike chip designers that outsource production, Micron runs its own fabs and assembly sites in the United States and across Asia. It earns money by selling chips, memory modules and solid-state drives to cloud providers, device makers and distributors. Micron was founded in 1978 and is headquartered in Boise, Idaho.

Company size
10,001+
Company stage
IPO
Headquarters
Boise, ID
Founded
1978

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