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Micron Technology

Makes memory and storage chips for AI and PCs

Process Engineer New Grad - Diffusion/Implant/Rapid Thermal Process

Process EngineeringConfirmed live in the last 24 hours
Full-timeManassas, VA, USAIn-person

About the Job

Requirements

  • A Master's degree in Materials Science, Chemical Engineering, Physics, Electrical Engineering, or a related engineering field.
  • Zero to two years of semiconductor process engineering or related experience, which may include internships, co-ops, or academic research.
  • Demonstrated understanding of semiconductor fabrication processes and semiconductor device physics through coursework, research, or professional experience.
  • Experience designing experiments and analyzing engineering data through academic coursework, research, internships, or professional experience, including exposure to statistics and Statistical Process Control (SPC).
  • Demonstrated technical communication, documentation, organization, and time-management skills, with the ability to work hands-on in a cleanroom and manufacturing environment.

Responsibilities

  • Own and sustain assigned Diffusion, Implant, and/or Rapid Thermal Processing (RTP) processes, including monitoring SPC, FDC, process parameters, recipes, specifications, and established reaction plans; respond to abnormalities and escalate potential yield or quality risks appropriately.
  • Investigate process excursions and manufacturing issues using structured problem-solving and data-analysis methods such as root cause analysis, 5-Why, 8D, and Design of Experiments (DOE); partner with Process Integration, Yield, Defect/Metrology, Equipment Engineering, and Manufacturing on corrective actions.
  • Improve process capability, uniformity, yield, throughput, productivity, and cost by designing and executing experiments, analyzing process and equipment data, implementing best known methods (BKMs), and supporting continuous-improvement projects.
  • Support new equipment installations and qualifications, tool-to-tool matching, preventive-maintenance recovery, hardware and material evaluations, supplier activities, and formal process or hardware change-control documentation.
  • Maintain accurate process and training documentation and use Micron-approved AI and AI-enabled workflows to improve productivity, efficiency, data analysis, and decision quality while following applicable company requirements.

Desired Qualifications

  • Academic, research, internship, or professional experience with Diffusion, Ion Implantation, RTP, or related semiconductor manufacturing processes.
  • Experience applying DOE, SPC, 5-Why, 8D, or other structured statistical and root-cause-analysis methods to technical problems.
  • Experience analyzing manufacturing or engineering data to identify trends, process variation, yield issues, or improvement opportunities.
  • Experience with semiconductor manufacturing equipment, equipment qualification, process recipes, FDC, or other manufacturing control systems.
  • Experience collaborating across engineering disciplines on technical projects, equipment/process changes, or continuous-improvement activities.

About the Company

Micron Technology

Makes memory and storage chips for AI and PCs

Micron Technology designs and manufactures memory and storage chips, mainly DRAM and NAND flash, used in data centers, PCs, phones, cars and industrial equipment. It is one of only three companies that make HBM, the stacked high-bandwidth memory placed beside processors in AI servers, and it is the largest memory chipmaker based in the United States. Unlike chip designers that outsource production, Micron runs its own fabs and assembly sites in the United States and across Asia. It earns money by selling chips, memory modules and solid-state drives to cloud providers, device makers and distributors. Micron was founded in 1978 and is headquartered in Boise, Idaho.

Company size
10,001+
Company stage
IPO
Headquarters
Boise, ID
Founded
1978

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