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Sine Engineering

GPS-denied, spectrum-resilient UAV connectivity solutions

Physical Design Engineer

Silicon & ASIC DesignConfirmed live in the last 24 hours
Full-timeTampere, FinlandNo salary listedIn-person

About the Job

Requirements

  • Background in SoC physical design, ranging from recent graduates with strong fundamentals and relevant project experience to senior engineers with multiple successful tape-outs.
  • Working knowledge of the complete RTL-to-GDSII flow, appropriate to experience level, including synthesis, place-and-route, static timing analysis, and physical verification.
  • Familiarity with industry-standard electronic design automation tools such as Synopsys Design Compiler, Fusion Compiler, IC Compiler, Cadence Genus, Innovus, Siemens Calibre, or equivalent solutions.
  • Solid understanding of timing analysis, clock-domain crossing, low-power design methodologies, and design-for-test concepts.
  • Scripting proficiency in Tcl, Python, or Perl for flow automation and analysis.
  • Strong debugging skills and a structured approach to resolving complex implementation challenges.
  • A proactive attitude, strong ownership mindset, and eagerness to learn and grow with the team.

Responsibilities

  • Drive the physical implementation flow, from synthesis through place-and-route, timing closure, and GDSII sign-off.
  • Contribute to synthesis and constraint development using SDC, including handoff between front-end and back-end teams.
  • Contribute to floorplanning, power planning, placement, clock tree synthesis, and routing for SoC blocks and full-chip integration.
  • Contribute to timing closure across PVT corners and operating modes, including static timing analysis, ECO planning, and sign-off.
  • Contribute to physical verification, including DRC, LVS, ERC, antenna checks, and electromigration and IR-drop analysis.
  • Contribute to DFT integration and implementation, including scan insertion, compression, MBIST, boundary scan, and ownership of test pattern generation flows.
  • Contribute to low-power implementation, including UPF/CPF co-design flows, power domains, level shifters, isolation, and retention strategies.
  • Contribute to package definition and co-design, including pinout planning, bump/ball assignment, package-aware signal and power integrity, and collaboration with package and board teams.
  • Prepare tape-out and sign-off, including GDSII generation, foundry deliverables, and DRC/LVS-clean handoff.

Desired Qualifications

  • Experience with package definition, pinout optimization, and package/PCB co-design.
  • Experience with mixed-signal or RF SoC implementation and analog-to-digital integration.
  • Knowledge of signal integrity, power integrity, and electromigration analysis.
  • Experience with hierarchical implementation methodologies and large-block partitioning.

About the Company

Sine Engineering

GPS-denied, spectrum-resilient UAV connectivity solutions

Sine Engineering provides resilient connectivity solutions for unmanned aerial vehicles in GPS-denied and spectrum-challenged environments, aiming to keep drones controllable and connected in harsh conditions. Its products combine software-first capabilities with modular hardware that can be upgraded via over-the-air updates and easily replaced in production lines. The company differentiates itself by focusing on affordability and mass production, building on counter-UAS experience and serving multiple UAV manufacturers rather than end-user drones. Its goal is to enable widespread, low-cost deployment of capable drones in defense and aerospace, even when signals are limited or jammed.

Company size
51-200
Company stage
Not listed
Total funding
Not listed
Headquarters
Lviv, Ukraine
Founded
2022

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