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Lumilens

Photonic interconnects for AI infrastructure

Modelling Lead - SystemC / Virtual-Platform Architect

Systems Software EngineeringConfirmed live in the last 24 hours
Full-timeSan Jose, CA, USANo salary listedIn-person

About the Job

Requirements

  • At least 8 years of experience in architecture/performance modeling or virtual-platform development for complex systems-on-chip.
  • Strong SystemC and Transaction-Level Modeling 2.0 skills and solid modern C++ skills.
  • Experience building or leading a virtual platform or Electronic System-Level model that real firmware ran on for pre-silicon bring-up.
  • Experience integrating a third-party instruction set simulator, such as Arm or RISC-V, into a SystemC/Transaction-Level Modeling platform and modeling buses, memory maps, and peripherals.
  • Architecture and performance modeling judgment, including knowing what to abstract and what to model faithfully.
  • Ability to span hardware microarchitecture and embedded software.

Responsibilities

  • Build a SystemC/Transaction-Level Modeling 2.0 virtual platform comprising an instruction-set-simulator-backed microcontroller, peripherals, memory map, UCIe transactor, and host stub for firmware execution before register-transfer-level design.
  • Develop architecture and performance models for architectural trade studies, end-to-end datapath throughput and latency, FIFO and buffer sizing, and design-space or configuration exploration.
  • Deliver golden reference models to the design verification team as scoreboards.
  • Develop behavioral models of analog and control circuits.
  • Partner with the front-end architect and firmware lead to keep model, register-transfer-level, and firmware views coherent.

Desired Qualifications

  • Familiarity with high-speed serial links and die-to-die or chiplet interconnects, including link-layer concepts such as forward error correction and equalization, for example PCIe, UALink, Ethernet, or memory-semantic interconnects such as CXL.
  • Experience feeding golden models into a Universal Verification Methodology and design verification flow.
  • Experience modeling mixed-signal or optical/SerDes systems, including control-loop and plant modeling.
  • Experience with high-throughput datapath modeling.

About the Company

Lumilens

Photonic interconnects for AI infrastructure

Lumilens designs and manufactures optical interconnect products to accelerate AI infrastructure. It provides high-density photonic interconnects—such as high-density pluggable, near-packaged, and co-packaged optics—built with in-house silicon photonics to scale GPU clusters in AI data centers. Its products include 800G and 1.6T optical transceivers for AI networking, and it is pursuing broader integration like Electrical-Optical Interposers through a strategic partnership with POET Technologies. The company differentiates itself through vertical integration, custom robotics-driven manufacturing, and AI-optimized production processes that aim to improve yield and supply chain stability. Lumilens targets hyperscalers and large AI providers, seeking to move interconnect bottlenecks from compute to scalable, efficient data-center networks. Its goal is to enable faster, denser GPU connectivity to support growing AI workloads and models.

Company size
51-200
Company stage
Series C
Total funding
$839.5M
Headquarters
San Jose, CA
Founded
2024

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