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Qnity

Publicly-traded provider of semiconductor materials

Application Engineer

Solution EngineeringUpdated on Nov 14
Full-timeHsinchu, North District, Hsinchu City, TaiwanNo salary listed

About the Job

Requirements

  • A Master's degree or higher in Engineering or a science-related field is required.
  • At least 3 years of experience in semiconductor-related CMP applications is required.
  • Fluent English is required for effective communication.
  • The candidate must be able to work independently and demonstrate interpersonal skills.
  • The candidate must have project-management orientation and prioritization skills, with a sense of urgency to meet commitments.
  • The candidate must be able to handle difficult and stressful situations professionally.

Responsibilities

  • Facilitate the development of CMPT process applications and technology to meet emerging semiconductor fabrication needs.
  • Maximize the performance merits of CMPT products through application engineering and understanding of the existing and emerging CMPT product portfolio to achieve business goals.
  • Partner with marketing, sales, and field service teams on CMPT product and technology introductions, and provide real-time technical customer troubleshooting during engagements.
  • Provide precise and efficient application expertise to support engagements and facilitate the development of new methodology and metrology in the internal lab.
  • Own technical training and knowledge sharing for internal organizations, demonstrating product stewardship and providing technical insights to internal stakeholders.
  • Travel frequently within Taiwan and the APR region.

Desired Qualifications

  • Knowledge of experimental design and data analysis using Six Sigma concepts is a plus.

About the Company

Qnity

Publicly-traded provider of semiconductor materials

Qnity will be an independent, publicly traded electronics materials company spun off from DuPont, serving the semiconductor and electronics industries. It offers materials and solutions for chip manufacturing and high-speed data transmission, with brands such as Pyralux laminates for flexible circuits, Laird thermal interface materials, Kalrez sealants, and Circuposit copper for interconnects. As a standalone company, it aims to differentiate itself through focused strategies, scale (about 10,000 employees, roughly 40 manufacturing sites, and 20 labs) and a broad global reach to support AI, high-performance computing, and advanced connectivity. Its goal is to become a leading global provider of electronic materials across sectors like data centers, automotive, aerospace, consumer electronics, and healthcare.

Company size
11-50
Company stage
IPO
Headquarters
Wilmington, DE
Founded
2024

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