Hardware Engineering (1)

Salary Range: 162000 to 218863 (Currency: USD) (Pay period: per-year-salary)

We are seeking a Principal Vacuum Interconnect Architect – Quantum Hardware in our Broomfield, CO location to lead development of scalable interconnect architectures for our next-generation large-scale quantum computers. Future systems such as Lumos will require interconnect solutions that support orders-of-magnitude growth in qubit count, signal density, optical access, thermal performance, vacuum compatibility, and system reliability. This role is intended for a senior technical leader who can operate independently, define requirements, evaluate new technologies, guide prototype development, and make high-impact recommendations that shape the system architecture.

The ideal candidate will have deep expertise in one or more optical interconnects, electrical interconnects, advanced packaging, cryogenic systems, UHV/XHV vacuum systems, photonics, RF/electrical systems, or precision hardware for complex scientific instruments. They should be comfortable working across disciplines and translating high-level architecture goals into practical subsystem requirements, design trades, prototypes, and validation plans.

All applicants for placement in safety-sensitive positions will be required to submit a pre-employment drug test

Key Responsibilities:

Lead the architecture and technical strategy for scalable optical and/or electrical interconnect solutions for next-generation quantum computing systems.
Develop interconnect concepts capable of supporting million-qubit-scale system requirements, including high-channel-count connectivity, cryogenic operation, XHV compatibility, thermal constraints, signal integrity, optical performance, manufacturability, and reliability.
Work closely with system architecture, trap fabrication, cryogenic ASIC, optics, electrical engineering, vacuum, cryogenic, mechanical, and packaging teams to define interconnect requirements and interfaces.
Identify key technical risks and define prototype tests to retire those risks quickly and quantitatively.
Oversee the design, fabrication, assembly, and validation of prototype interconnect hardware and subsystem demonstrators.
Evaluate manufacturability, scalability, reliability, assembly flow, testability, and integration risk for proposed interconnect architectures.
Mentor and develop junior engineers.
Work closely with a small, cross-functional design team to rapidly conceptualize, validate, and deliver high-reliability designs and prototypes that solve key optical and electrical packaging challenges.
Work with subsystem teams to identify potential technology insertions into the architecture.
Partner with fabrication and electrical engineering teams to co-design trap-package, ASIC, and interposer-level packaging solutions.
Communicate findings and design proposals to technical, management, and executive audiences.
Generate and present subsystem design trade studies and analyses.

YOU MUST HAVE:

PhD Required

Minimum of 12 years of experience (PhD inclusive) involving one or more of the following areas: cryogenic system design, optical interconnect, electrical interconnect, vacuum systems, thermal modeling, qubits, atomic physics, spectroscopy, optics, electronics, or laboratory work in the physical sciences.

Due to Contractual requirements, must be a U.S. Person defined as, U.S. citizen permanent resident or green card holder, workers granted asylum or refugee status.

Due to national security requirements imposed by the U.S. Government, candidates for this position must not be a People's Republic of China national or Russian national unless the candidate is also a U.S. citizen.

WE VALUE:

15+ years of experience in scientific research and development, advanced engineering, systems architecture, or technical leadership roles preferred.
Deep expertise in optical interconnects, fiber-optic packaging, photonic interposers, optical feedthroughs, electrical feedthroughs, high-density signal routing, cryogenic interconnects, or advanced hardware packaging.
Experience using simulation and modeling to inform design decisions, including thermal modeling, FEA, optical modeling, signal-integrity modeling, or vacuum/thermal analysis.
Strong written and oral communication skills, including the ability to present complex trade studies and recommendations to technical and non-technical audiences.
Demonstrated ability to lead complex technical design efforts involving multiple engineering or scientific disciplines.
Experience designing, building, testing, or validating complex hardware prototypes.
Ability to operate with a high degree of autonomy and technical ownership.
Experience performing simulation and modeling to inform experiments
Experience with control systems for data collection, signal processing, and analysis
Experience with electrical and fiber optic feedthroughs
Experience with extreme-high vacuum environments
Experience with trapped ions and ion transport
Excellent written and oral communication skills, with published results within their field of research

Quantinuum is a leading quantum computing company delivering a full stack platform designed to make quantum computing deployable in real-world environments. With active engagements spanning pharmaceuticals, material science, financial services, government, industrial sectors, and leading academic and research institutions worldwide, we are helping organizations unlock the transformative potential of quantum computing.

Our global team of more than 800 employees includes many of the world's leading scientists, engineers, and researchers, with more than 70% of our technology team holding advanced degrees at the Master's or PhD level. Headquartered in Broomfield, Colorado, Quantinuum operatesacross the United States, United Kingdom, Germany, Japan, and Singapore.

By joining Quantinuum, you’ll help shape the future of quantum computing, pushing the limits of technology, and making the impossible possible.

What’s in it for you?

We believe our people are our greatest strength and offer a comprehensive rewards package that supports your professional growth, well-being, and long-term success.

Competitive compensation and the opportunity to work on groundbreaking technology
Flexible work arrangements that support work-life balance
Employer-subsidized medical, dental, and vision insurance
401(k) retirement savings plan with company match and student loan repayment benefit
Equity opportunities
Generous paid time off, sick leave, and 12 paid holidays annually
Paid parental leave
Employee discount programs

Equal Opportunity Employer

Quantinuum is proud to be an equal opportunity employer. We are committed to building an inclusive workplace where all employees and applicants are treated with respect and provided equal opportunities regardless of race, color, religion, sex, sexual orientation, gender identity or expression, national origin, age, disability, veteran status, ancestry, marital status, or any other characteristic protected by applicable law.

Know Your Rights: Workplace discrimination is illegal. For more information about Quantinuum, please visit our website.

We are committed to making our recruitment process accessible to all. If you require any reasonable adjustments at any stage of the application or interview process, please let us know use the Lets talk contact form.

Applications will be accepted on an ongoing basis, there is no application deadline for this position.

Principal Vacuum Interconnect Architect

Quantum Hardware

Quantinuum

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