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Micron Technology

Makes memory and storage chips for AI and PCs

DRAM Pathfinding & Process Integration Engineer

Process EngineeringPosted on Nov 9
Full-timeNew York, NY, USARemote

About the Job

Requirements

  • A master’s degree or equivalent experience in Electrical Engineering, Physics, Materials Science, Chemical Engineering, or a related technical field.
  • At least 5 years of semiconductor industry experience in process integration, process development, device engineering, or advanced research and development.
  • Strong understanding of memory technologies, semiconductor device physics, and process integration.
  • Experience with design of experiments methodologies, statistical analysis, and technical problem-solving.
  • Demonstrated ability to influence and collaborate across multidisciplinary engineering teams.

Responsibilities

  • Lead pathfinding investigations of next-generation DRAM concepts, materials, process architectures, and advanced patterning solutions, including High-NA EUV.
  • Develop and integrate process flows across lithography, dry etch, thin films, chemical mechanical planarization, metrology, device engineering, and manufacturing while balancing performance, yield, reliability, manufacturability, and cost.
  • Design and implement design of experiments and technology-learning experiments, using statistical and AI-assisted analytics to evaluate electrical, defectivity, metrology, reliability, and yield data.
  • Collaborate with NY CREATES, equipment suppliers, research partners, and Micron teams to evaluate emerging capabilities and influence technology priorities while protecting Micron intellectual property.
  • Support the transition of successful pathfinding concepts into technology development and production by documenting key learning, technical assumptions, risks, and recommendations.

Desired Qualifications

  • A Ph.D. or equivalent experience in Electrical Engineering, Physics, Materials Science, or a related field.
  • Experience with DRAM technology development, advanced memory scaling, EUV or High-NA EUV lithography, technology scouting, or advanced process integration.
  • Experience working with semiconductor consortia, equipment suppliers, research institutions, or other external technology partners.
  • Familiarity with Python, JMP, SQL, machine learning, and advanced analytics tools.
  • Experience using AI-assisted analytics to enhance data interpretation, anomaly detection, and yield improvement initiatives.

About the Company

Micron Technology

Makes memory and storage chips for AI and PCs

Micron Technology designs and manufactures memory and storage chips, mainly DRAM and NAND flash, used in data centers, PCs, phones, cars and industrial equipment. It is one of only three companies that make HBM, the stacked high-bandwidth memory placed beside processors in AI servers, and it is the largest memory chipmaker based in the United States. Unlike chip designers that outsource production, Micron runs its own fabs and assembly sites in the United States and across Asia. It earns money by selling chips, memory modules and solid-state drives to cloud providers, device makers and distributors. Micron was founded in 1978 and is headquartered in Boise, Idaho.

Company size
10,001+
Company stage
IPO
Headquarters
Boise, ID
Founded
1978

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