A

Astera Labs

Designs chips that connect data center systems

Packaging Automation & Data Engineering Intern

Spring 2027
$35 - $55/hr+ $500/week housing/relocation stipend
Internship
Bachelor's, Master's
San Jose, CA, USA
In Person
Data & AnalyticsData Engineering

About the job

Requirements
  • The candidate must be working toward a Bachelor of Science or Master of Science in Computer Science, Computer Engineering, Electrical Engineering, Data Science, Mechanical Engineering, or a related technical field.
  • The candidate must have a cumulative GPA of at least 3.2/4.0.
  • The candidate must have coursework or project experience in programming, data structures, databases, software engineering, data analytics, or engineering computation.
  • The candidate must have strong Python programming experience and experience with common data-processing libraries such as pandas, NumPy, or equivalent tools.
  • The candidate must have experience working with structured data and databases, including SQL and relational database concepts.
  • The candidate must have experience developing scripts or software for automation, data processing, file parsing, analysis, or engineering applications.
  • The candidate must demonstrate analytical and problem-solving skills, with attention to data quality, edge cases, validation, and reproducibility.
  • The candidate must be able to prioritize multiple tasks, work with minimal supervision in a fast-paced environment, and communicate and collaborate effectively with engineers from different disciplines to translate requirements into practical software solutions.
Responsibilities
  • Develop Python-based scripts and applications to automate packaging engineering workflows, data processing, file handling, report generation, and repetitive engineering tasks.
  • Collaborate with packaging engineers to understand manual workflows, identify automation opportunities, define requirements, and develop maintainable software solutions.
  • Build tools to extract, clean, transform, validate, and consolidate engineering data from Excel, CSV, TXT, HTML, PDF-derived datasets, and structured design or manufacturing files.
  • Design and maintain structured databases or data repositories for package, substrate, assembly, qualification, supplier, and manufacturing information, ensuring data integrity and traceability.
  • Develop scripts and utilities to compare package design information, bills of materials, design rules, material properties, supplier capability data, and other engineering datasets.
  • Create automated checks and review tools that flag missing information, inconsistencies, out-of-spec conditions, or potential design and manufacturing risks.
  • Develop internal engineering applications or lightweight graphical user interface and web tools that allow engineers to run automation flows, review results, and provide user inputs efficiently.
  • Support data visualization and dashboard development for engineering metrics, new product introduction status, qualification results, supplier capability, manufacturing data, and other packaging-related information.
  • Integrate data from multiple sources and help establish reusable data pipelines, naming conventions, schemas, version control, and documentation practices.
  • Support automation involving package geometry or design data, including processing package drawings, layout exports, DXF files, netlists, or other structured engineering formats when applicable.
  • Apply software-engineering practices such as modular code design, error handling, logging, validation, testing, and source control to improve engineering-tool reliability and maintainability.
  • Improve existing scripts and engineering tools by debugging issues, optimizing performance, refactoring code, and adding capabilities based on user feedback.
  • Prepare documentation for scripts, databases, data structures, workflows, assumptions, and user instructions so solutions can be maintained and reused.
  • Support communication with internal engineering teams, substrate suppliers, and OSAT partners when data collection, standardization, or automation interfaces are required.
  • Present completed projects, technical approach, results, and measurable efficiency or quality improvements at the end of the internship.
  • Learn the packaging team’s engineering workflows and data environment, then take ownership of one or more automation or data-engineering projects with appropriate guidance.
  • Deliver reliable, documented, reusable code or database solutions that reduce manual work, improve data quality, or make engineering information easier to access and analyze.
  • Deploy or demonstrate useful tools for scripting, data processing, database management, engineering review automation, or visualization, and explain the problem, architecture, implementation, validation, and impact.
Desired Qualifications
  • Experience with Python graphical user interface or web-application frameworks such as PyQt/PySide, Streamlit, Flask, FastAPI, or comparable tools.
  • Experience with SQL databases such as SQLite, PostgreSQL, MySQL, or similar platforms, including schema design, queries, and data integration.
  • Experience with Git or other version-control systems and familiarity with collaborative software-development practices.
  • Experience with data visualization or dashboard tools such as Plotly, Power BI, Tableau, Matplotlib, or similar tools.
  • Experience parsing or generating engineering file formats and automating Microsoft Excel or other office workflows using Python, APIs, or similar methods.
  • Familiarity with APIs, ETL/data pipelines, REST services, cloud databases, or data-management platforms.
  • Exposure to machine learning, computer vision, large-language-model applications, or AI-assisted engineering workflows.
  • Understanding of semiconductor packaging, electronics manufacturing, package design, FCBGA/FCCSP, substrate technology, or OSAT workflows.
  • Experience developing software or automation for engineering, laboratory, manufacturing, research, or hardware-related applications.
  • Prior internship, research, coursework, or personal projects demonstrating ownership of a software, database, automation, or data-analysis project from problem definition through implementation.

About the company

A

Astera Labs

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Astera Labs designs chips and hardware modules that move data between processors, memory and accelerators in data centers. Its customers include cloud providers, chip vendors and equipment makers building servers and large computing clusters for AI and other workloads. Retimers restore signal quality, switches connect devices and memory controllers expand the memory available to computing systems, while COSMOS software monitors and manages these links. The company sells its products directly and through distributors, using outside manufacturers to fabricate and assemble its hardware. Astera Labs was founded in 2017 and is headquartered in San Jose, California.

Company Size

501-1,000

Company Stage

IPO

Headquarters

Santa Clara, California

Founded

2017

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Simplify Jobs

Simplify's Take

What believers are saying

  • Revenue grew rapidly: Astera's August 2026 release reported preliminary Q2 revenue of $392.4 million, up 104% yearly.
  • Memory products broadened: Astera announced three new Leo controllers in September 2026, with the family sampling to hyperscalers.
  • Managers have a published pay band: Astera's live San Jose Ethernet applications role lists base pay of $158,400 to $230,000.

What critics are saying

  • Revenue is concentrated: Astera's February 2026 filing says three end customers generated 86% of fiscal 2025 revenue.
  • Chip production has one foundry: Astera's annual filing says TSMC fabricates all its integrated circuits.
  • Customer support involves travel: Astera's live San Jose Ethernet applications manager role requires travel within the US and Asia.

What makes Astera Labs unique

  • Hardware health is visible: Astera's COSMOS software monitors link performance, temperature and signal quality across systems.
  • Switches connect large clusters: Astera's Scorpio X-Series supports up to 80 accelerators per switch across 320 data lanes.
  • Integration gets tested early: Astera's Cloud-Scale Interop Lab checks switches against diverse PCIe hosts and endpoints.

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Benefits

  • 401(k) Retirement Plan
  • Flexible Work Hours

Growth & Insights and Company News

Headcount

6 month growth

5%

1 year growth

2%

2 year growth

2%
Yahoo Finance
Oct 20th, 2026
Astera Labs, valued at $50B, doubles revenue but trades at 178x earnings: S&P 500 ready?

Astera Labs, which makes chips and hardware that move data inside AI data centres, is emerging as a contender for the S&P 500 Index. The company, valued at roughly $50 billion, went public in March 2024 and is now profitable. Revenue rose about 104.5% over the past year as hyperscalers spent heavily on AI infrastructure. The company recently launched its Aries 7 portfolio of high-speed links. The stock trades near 178 times trailing earnings and about 56 times expected profit next year. Northland downgraded it on valuation, and the shares sit well below their $499 high. Astera also relies on a small group of hyperscale buyers. Hedge fund holders rose to 73 at the end of the second quarter of 2026, from 53 the quarter before.

Yahoo Finance
Oct 20th, 2026
Micron up 350%, but SK Hynix, Sandisk and Astera Labs may offer faster growth

Micron's stock has risen about 350% in a year, but three rival memory stocks may offer better value, according to one analyst view. SK Hynix posted second-quarter revenue of 79.3 trillion Korean won (about $54.9 billion), up 257% year over year and 51% sequentially. Micron grew 31% sequentially. SK Hynix also has a lower market cap and a more attractive P/E ratio. Sandisk shares have surged more than 800% in a year. It expects fiscal 2027 first-quarter revenue of up to $10.8 billion, or 20.4% sequential growth. Astera Labs, which builds rack-scale AI infrastructure, more than doubled its second-quarter sales. It guides to $550 million in third-quarter sales at the midpoint, a 40.2% sequential rise.

Yahoo Finance
Oct 17th, 2026
Northland downgrades Astera Labs on valuation despite $540M–$560M Q3 revenue guidance

Northland Capital Markets downgraded Astera Labs to "Market Perform" from "Outperform" on October 9, citing valuation concerns, even though it expects earnings to rise. Analyst Gus Richard said shares had passed Northland's earlier target, but he still sees estimates climbing as the Scorpio X AI switch ramps up. Astera expects third-quarter revenue of $540 million to $560 million, up from a record $392.4 million in the second quarter. Non-GAAP earnings per share are guided to $1.16 to $1.21, against $0.80 in the previous quarter. The growth leans on one lead customer, though more than 10 customers are engaged on Scorpio X. Shares closed at $285.82 on October 16, about 43% below their June peak of $499.48. Fubon Securities recently began coverage with a "Buy" rating and a $500 price target.

Converge! Network Digest
Oct 12th, 2026
Astera Labs' Orion rack supports Up to 160 accelerators.

Astera Labs' Orion rack supports Up to 160 accelerators. Astera Labs introduces Orion, a compute-agnostic rack-scale AI inference architecture supporting up to 160 accelerators per pod through a 320-lane PCIe fabric, modular reference designs, and COSMOS management software. Astera Labs (Nasdaq: ALAB) introduced Orion, a compute-agnostic rack-scale reference architecture designed to support AI inference deployments with up to 160 accelerators per pod. Announced at the 2026 Open Compute Project Global Summit in San Jose, Orion combines a high-radix, 320-lane PCIe switching fabric with modular compute, memory and connectivity subsystems. Operators can select GPUs, CPUs and other accelerators based on workload requirements, availability and cost rather than committing to a single compute platform. Orion comprises six production-grade reference designs covering the complete rack, compute trays, fabric trays, memory trays, link boards and compute boards. The designs aim to reduce integration and validation work for OEMs and ODMs while allowing different accelerator configurations within a common infrastructure. COSMOS Rack Manager and COSMOS Fabric Manager provide orchestration, telemetry, diagnostics and fabric management. Astera Labs will design and validate the reference architecture and subsystems rather than manufacture complete racks. OEM and ODM partners are expected to offer Orion-based systems beginning in Q1 2027. At OCP Global Summit October 12-15, Astera Labs is demonstrating a powered Orion rack with interchangeable, pre-validated compute trays. | ORION - KEY FACTS | | - Compute-agnostic architecture with interchangeable CPU/GPU options | | - Up to 160 accelerators per pod; 320-lane PCIe switch fabric | | - Six reference designs: rack, compute tray, fabric tray, memory tray, link board and compute board | | - COSMOS Rack Manager and Fabric Manager | | - UALink on roadmap; OEM/ODM availability targeted Q1 2027 | Analysis: Orion extends Astera Labs beyond individual connectivity components toward defining how those components are integrated into AI infrastructure. Its existing portfolio includes Scorpio Smart Fabric Switches, Aries signal conditioners, Leo Smart Memory Controllers, Taurus Ethernet connectivity and COSMOS management software. The announcement does not specify that every Orion configuration uses every product family. The PCIe fabric is intended to accommodate heterogeneous inference workloads. Actual throughput will depend on PCIe generation, topology, aggregate bandwidth, accelerator and memory configurations, software and workload characteristics. Astera Labs has not disclosed independently verified benchmarks establishing improvements in tokens per second or tokens per dollar against specific competing systems. Dedicated memory trays could help operators configure memory resources separately from compute, relevant to model weights and key-value caches. Benefits depend on memory access mechanisms, accelerator compatibility, latency and bandwidth. For neoclouds, modular infrastructure may reduce exposure to accelerator procurement constraints, although actual capital savings depend on configuration, utilization and integration costs. UALink is on Orion's future interconnect roadmap, not a confirmed feature of the initial release. Key commercial milestones include naming OEM and ODM partners, supported accelerators, customer deployments, pricing and measured inference performance. | ASTERA LABS | COMPANY PROFILE | | Headquarters | San Jose, California | | Ticker | NASDAQ: ALAB | | Products | Scorpio, Aries, Leo, Taurus, COSMOS, Orion | | Technology | PCIe, CXL, Ethernet, NVLink Fusion; UALink roadmap | | Markets | Hyperscalers, neoclouds, enterprise AI | | Website | asteralabs.com | | RELATED CONVERGE DIGEST COVERAGE | | For related reporting on Astera Labs PCIe, CXL, Scorpio, Aries and Leo technologies, see the Converge Digest archive: Astera Labs coverage. Individual article links from the draft have not been independently verified. | Converge Digest is tracking AI infrastructure developments. Follow ongoing coverage at Converge Digest AI Infrastructure. Help others discover this reporting. Editorial responsibility Jim Carroll. Editor & Publisher Every article published by Converge Digest is researched, curated, fact-checked and editorially reviewed by Jim Carroll, Editor & Publisher. AI-assisted drafting may be used to accelerate production, but all content is reviewed, refined and approved prior to publication. Builders & Visionaries The people who opened the doors to the networks Converge Digest run today. Which of these co-founded Astera Labs? On this day. October 12 From 25 years of the Converge Digest archive.

Yahoo Finance
Oct 12th, 2026
Astera Labs unveils Orion, a GPU-agnostic rack design scaling to 160 accelerators per pod

Astera Labs (Nasdaq: ALAB) has unveiled Orion, a modular rack-scale reference design that lets customers choose their own GPUs and CPUs. The designs target neoclouds and enterprises building AI inference capacity. Orion's PCIe switch fabric scales from 8 to 160 accelerators per pod. It includes six reference designs, covering the rack, compute tray, fabric tray, memory tray, link board, and compute board, all managed by Astera's COSMOS software. Astera Labs will not build the racks. Original design manufacturer and original equipment manufacturer partners will make and sell them, with availability expected from Q1 2027. The company will show a powered Orion rack at the Open Compute Project Global Summit in San Jose, October 12-15. It plans to extend Orion to other open interconnects, including UALink.