Mechanical Engineer, Electronics Packaging & RF Components

As an Astranis Mechanical Engineer focused on Electronics Packaging and RF Components, you will design, analyze, build, and test enclosures for critical spacecraft electronics and RF components. You will contribute across the complete hardware lifecycle from requirements definition and concept development through detailed design, supplier coordination, assembly, and environmental testing.

Working at the intersection of mechanical, thermal, electrical, and RF engineering, you will solve challenging problems involving EMI/EMC isolation, high-power-density thermal management, and survivability in the launch environment. You will own the enclosure’s physical architecture, interfaces, manufacturability, and environmental robustness while partnering closely with RF and electrical engineers to verify electromagnetic and electrical performance.

This role requires strong problem-solving skills, sound mechanical judgment, hands-on hardware experience, and enthusiasm for developing novel design solutions

Role

• Design, analyze, build, and test space-grade electronics enclosures, RF housings, and PCBA mounts.
• Implement effective RF isolation and EMI shielding techniques, including gasketing, cavity design, and precision machining interface controls.
• Collaborate closely with RF, Electrical, and Systems engineering teams to develop requirements for mechanical constraints, connector interfaces, signal integrity, and environmental loads.
• Integrate electronics units into the spacecraft design, developing procedures to optimize assembly, wire routing, and thermal interface material application.

Requirements

• B.S. or M.S in mechanical, aerospace engineering or equivalent
• 2+ years of experience in mechanical design with a focus on electronics packaging, RF packaging, or enclosure design.
• Proficiency in mechanical 3D CAD (e.g., SolidWorks, NX, or Creo).
• Strong fundamentals in mechanical design, structural design, and thermal management for printed circuit board assemblies (PCBAs) and their enclosures.
• Practical knowledge of RF isolation techniques and EMI/EMC mitigation strategies in mechanical enclosures.
• Experience with GD&T, tolerance analysis, engineering drawings, and design for manufacturability.
• Hands-on experience with hardware prototyping, thermal interface materials, precision machining, and assembly processes.
• Don't meet them all? Not a problem. Please apply even if you do not meet all these criteria.

Bonus 

• Experience designing high-frequency (Ku-Band or higher) RF/microwave enclosures, waveguides, or filter housings.
• Experience with mechanical and/or thermal FEA (e.g., ANSYS, Femap/NX Nastran, Thermal Desktop).
• Experience designing electronics enclosures for radiation and vacuum environments.
• Experience designing hardware to withstand severe launch vibration, shock, and thermal cycling environments.
• Hands-on experience with environmental testing (TVAC, vibration/shaker tables, thermal chambers, and EMI/EMC chambers).
• Experience designing chip and wire RF housings for integrated antenna feed systems.