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Boyd

Thermal management and sealing solutions provider

Junior Thermal Research Engineer

Thermal & Fluids EngineeringConfirmed live in the last 24 hours
Full-timeFredericksburg, VA, USANo salary listed

About the Job

Requirements

  • A Master's or PhD degree in Mechanical Engineering or a related field is required.
  • Applicants must not require employment immigration sponsorship or support, including CPT, OPT, STEM OPT, F-1 to H-1B, H-1B cap registration, O-1, E-3, TN status, or I-485 job portability.
  • Applicants must currently be located in the United States.
  • Focus or coursework in heat transfer, fluid dynamics, or thermal systems is required.

Responsibilities

  • Support the design and development of thermal management systems, including liquid cooling, two-phase cooling, and heat exchanger-based architectures.
  • Design cooling systems including cold plates, cooling distribution units, and passive two-phase solutions such as heat pipes and vapor chambers.
  • Develop and apply steady-state and transient thermal-fluid modeling tools for system-level performance prediction, including pressure drop, heat transfer, and coolant distribution.
  • Implement and use machine learning, artificial intelligence, and data-driven methods.
  • Support data center cooling system modeling, including rack-level and component-level thermal architecture analysis.
  • Conduct design of experiments and support experimental testing, including instrumentation, data acquisition, and model validation.
  • Create and maintain computer-aided design models and engineering documentation, including SolidWorks designs, piping and instrumentation diagrams, drawings, and test plans.
  • Assist in developing computational tools and simulation frameworks using Python and MATLAB to support engineering decision-making and research activities.
  • Support prototype development and testbed construction, including integration of thermal systems and measurement capabilities.
  • Collaborate with senior engineers and researchers to evaluate new cooling technologies, improve system efficiency and performance, and identify key design tradeoffs.
  • Contribute to technical documentation, reports, and presentations of results.
  • Support component and material selection for thermal systems, including heat exchangers, sensors, and cooling loops.
  • Assist in manufacturing and assembly support, including prototype builds and testing.

Desired Qualifications

  • Exposure to data center cooling or high-performance electronics thermal management.
  • Experience developing reduced-order or surrogate models for thermal systems.
  • Familiarity with optimization-driven design workflows.
  • Experience integrating modeling and experimental validation.
  • Laboratory experience.
  • Graduate research experience in thermal-fluid sciences or cooling technologies is strongly preferred.

About the Company

Boyd

Thermal management and sealing solutions provider

Boyd Corporation designs and manufactures thermal management and environmental sealing solutions for electronics. Its products help remove heat from components and shield assemblies from dust, moisture, and other elements, enabling reliable operation of systems in data centers, electric vehicles, medical devices, and other high-growth markets. The company achieves this with a global mix of engineered materials, custom heat exchangers and interfaces, seals, and system integration services. Boyd differentiates itself through its scale, broad portfolio, and a history of strategic acquisitions (such as Aavid Thermalloy, GMN, and the Durbin Group) that expand capabilities in liquid cooling, HMIs, and advanced seals, allowing it to serve as a single partner for complex cooling and protection needs. The company's goal is to be a trusted technology partner powering essential systems by delivering tailored thermal management and environmental sealing solutions at scale.

Company size
1,001-5,000
Company stage
Acquired
Total funding
Not listed
Headquarters
Modesto, CA
Founded
1949

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