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Micron Technology

Makes memory and storage chips for AI and PCs

Product Management Director/DMTS

Technical Product ManagementConfirmed live in the last 24 hours
Full-timeIn-person

About the Job

Requirements

  • A bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, Physics, or a related technical field is required.
  • At least 12 years of experience in semiconductor product management, system architecture, engineering, business strategy, or related technical leadership roles is required.
  • Strong knowledge of DRAM technologies, High Bandwidth Memory (HBM), AI accelerators, advanced packaging technologies, and the semiconductor ecosystem is required.
  • Demonstrated ability to define product strategy, influence roadmap decisions, and develop business cases based on customer and market insights is required.
  • Experience leading and influencing cross-functional teams and executive stakeholders without direct authority, and willingness to travel domestically and internationally, are required.

Responsibilities

  • Develop and drive product strategy, roadmap planning, and requirements definition for next-generation HBM solutions targeting AI, HPC, and cloud infrastructure markets.
  • Partner with customers, hyperscalers, AI accelerator providers, and ecosystem partners to translate future memory needs into product requirements and business plans.
  • Analyze market trends, customer workloads, competitive dynamics, and system architectures to influence product direction and technology investments.
  • Lead cross-functional execution across engineering, operations, and marketing teams to deliver products aligned with business objectives, timelines, and specifications.
  • Create executive presentations, business cases, roadmap reviews, and strategic recommendations to support leadership decisions and customer engagements.
  • Assist the Product Management team in defining the strategy and vision of the product portfolio and drive execution-focused Stage Gates when necessary.

Desired Qualifications

  • A master's degree in a technical discipline or an MBA is preferred.
  • Experience working directly with hyperscalers, strategic customers, and ecosystem partners in AI, cloud computing, or HPC markets is preferred.
  • Strong understanding of system-level tradeoffs involving memory bandwidth, capacity, performance, power, packaging complexity, and total cost of ownership is preferred.
  • Experience conducting competitive intelligence, technology assessments, and long-range portfolio planning within the semiconductor industry is preferred.
  • Demonstrated success presenting strategic recommendations, product roadmaps, and market insights to executive audiences and customers is preferred.

About the Company

Micron Technology

Makes memory and storage chips for AI and PCs

Micron Technology designs and manufactures memory and storage chips, mainly DRAM and NAND flash, used in data centers, PCs, phones, cars and industrial equipment. It is one of only three companies that make HBM, the stacked high-bandwidth memory placed beside processors in AI servers, and it is the largest memory chipmaker based in the United States. Unlike chip designers that outsource production, Micron runs its own fabs and assembly sites in the United States and across Asia. It earns money by selling chips, memory modules and solid-state drives to cloud providers, device makers and distributors. Micron was founded in 1978 and is headquartered in Boise, Idaho.

Company size
10,001+
Company stage
IPO
Headquarters
Boise, ID
Founded
1978

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