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Lumilens

Photonic interconnects for AI infrastructure

Senior/Principal Analog & Mixed Signal Design Engineer

Silicon & ASIC DesignConfirmed live in the last 24 hours
Full-timeSan Jose, CA, USAHybrid

About the Job

Requirements

  • A Master of Science or PhD in Electrical Engineering or a related field.
  • At least 7 years of hands-on analog or mixed-signal integrated-circuit design experience.
  • Strong fundamentals in feedback and stability analysis, noise and jitter modeling, high-speed analog, SerDes or millimeter-wave circuit design, power integrity, and substrate isolation.
  • Experience taking driver, transimpedance amplifier, or other data-path analog/mixed-signal blocks through tape-out and laboratory validation.
  • Proficiency with industry-standard analog design and simulation tools.

Responsibilities

  • Architect and design high-speed analog and mixed-signal circuits, including high-speed SerDes transmit and receive circuits using 112G, 224G, or 448G PAM4 and/or NRZ signaling; clocking and timing circuits such as PLLs, DLLs, CDRs, and ultra-low-jitter references; linear and DAC-based transmit drivers; transimpedance amplifiers and receiver front-ends; equalization circuits including CTLE, FFE, and DFE; and biasing networks, bandgaps, and on-chip power regulation.
  • Perform transistor-level design, simulation, and optimization across process, voltage, and temperature corners.
  • Analyze and optimize bandwidth, noise, linearity, jitter, stability, and power.
  • Work closely with layout engineers on floorplanning, matching, isolation, and parasitic management.
  • Define and support silicon bring-up, characterization, and debug, including correlation to simulations.
  • Contribute to design methodology, IP reuse, and best practices across programs.

Desired Qualifications

  • Experience with advanced or scaled CMOS process nodes.
  • High-speed SerDes experience using 112G, 224G, or 448G PAM4 and/or NRZ, or closely related I/O-adjacent analog circuits.
  • Experience with process scaling and technology trade-offs.
  • Exposure to co-packaged optics (CPO), on-board optics, or pluggable optical module integration.
  • Exposure to silicon debug, failure analysis, and yield learning.

About the Company

Lumilens

Photonic interconnects for AI infrastructure

Lumilens designs and manufactures optical interconnect products to accelerate AI infrastructure. It provides high-density photonic interconnects—such as high-density pluggable, near-packaged, and co-packaged optics—built with in-house silicon photonics to scale GPU clusters in AI data centers. Its products include 800G and 1.6T optical transceivers for AI networking, and it is pursuing broader integration like Electrical-Optical Interposers through a strategic partnership with POET Technologies. The company differentiates itself through vertical integration, custom robotics-driven manufacturing, and AI-optimized production processes that aim to improve yield and supply chain stability. Lumilens targets hyperscalers and large AI providers, seeking to move interconnect bottlenecks from compute to scalable, efficient data-center networks. Its goal is to enable faster, denser GPU connectivity to support growing AI workloads and models.

Company size
51-200
Company stage
Series C
Total funding
$839.5M
Headquarters
San Jose, CA
Founded
2024

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