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Hewlett Packard Enterprise

Builds servers, networking and private cloud

Mechanical/Hardware Engineer - Thermal

Thermal & Fluids EngineeringConfirmed live in the last 24 hours
Full-timeChippewa Falls, WI, USA

About the Job

Requirements

  • A Bachelor's or Master's degree in Mechanical Engineering is required.
  • Typically, 4–6 years of experience is required.
  • Proficiency with ProEngineer, Solidworks, or other 3D computer-aided design software as a mechanical design tool.
  • Strong analytical and problem-solving skills.
  • Strong understanding and experience in electronics packaging.
  • Experience designing sheet metal and plastic parts and associated production tooling and processes.
  • Experience using computational fluid dynamics and thermal mockups to validate thermal solutions.
  • Excellent written and verbal communication skills, with mastery in English and the local language.
  • Ability to effectively communicate product architectures and design proposals and negotiate options at management levels.
  • Ability to learn risk management skills, understand and assess risk qualitatively, and use techniques to measure subcontractor and vendor performance.

Responsibilities

  • Lead multiple project teams of mechanical hardware engineers and internal and outsourced development partners responsible for all stages of mechanical and thermal development for complex products and platforms, including solution design, validation, tooling, and testing.
  • Manage and expand relationships with internal and outsourced development partners on mechanical and thermal design and development.
  • Review and evaluate designs and project activities for compliance with technology and development guidelines and standards, and provide tangible feedback to improve product quality.
  • Provide domain-specific expertise and overall mechanical and thermal leadership and perspective to cross-organization projects, programs, and activities.
  • Drive innovation and integration of new technologies into projects and activities in the mechanical and thermal design organization.
  • Provide guidance and mentoring to less-experienced staff members.
  • Design, analyze, develop, modify, and evaluate materials, mechanical systems, equipment, and packaging.
  • Conduct feasibility, design margin, and validation analysis and empirical testing on new and modified designs.
  • Lead or assist in architecture development and assessment.
  • Evaluate the reliability of materials, properties, designs, and production techniques.
  • Address thermal challenges in support of server designs and develop cost-effective cooling solutions with thermal and acoustic performance.
  • Perform system-level thermal design focused on fan and heatsink technology, materials science, chemistry, fluid flow, and system-level control logic.
  • Perform initial concept work, mechanical design, thermal simulation oversight, and creation of mockups with dummy heat loads, followed by solution validation.
  • Interface with vendors on technical issues.
  • Travel internationally as necessary.

Desired Qualifications

  • Excitement about technology and a desire to learn new tasks and technologies.

About the Company

Hewlett Packard Enterprise

Builds servers, networking and private cloud

Hewlett Packard Enterprise sells servers, storage, networking and hybrid cloud software to large companies, governments and service providers. Its GreenLake platform lets customers run on-premises hardware as a metered cloud service, and its Cray supercomputers run national lab and AI training workloads. The networking business, built on Aruba and Juniper Networks, supplies campus, data-center and routing equipment. Revenue comes from hardware sales, multiyear support contracts, financing and subscriptions. The company traces its roots to Hewlett-Packard, founded in 1939, became a separate public company in 2015 and is headquartered in Houston, Texas.

Company size
10,001+
Company stage
IPO
Headquarters
Houston, TX
Founded
1939

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