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Micron Technology

Makes memory and storage chips for AI and PCs

Engineer – HIG HBM Product Engineering - Media Health Reliability

Hardware Validation & TestingConfirmed live in the last 24 hours
Full-timeSingaporeNo salary listedIn-person

About the Job

Requirements

  • A bachelor's or master's degree in Electrical and Electronics Engineering or a related field.
  • A solid understanding of problem-solving methodologies, including identifying root causes and exploring solution spaces.
  • Familiarity with CMOS technology, DRAM architecture, and basic device physics.
  • Exposure to data analysis, statistics, and scripting tools such as Python or JMP.
  • Clear and effective written and spoken English communication, especially when articulating technical concepts and findings.

Responsibilities

  • Define and develop reliability stress, test flows, and test plans to cover all product reliability aspects.
  • Work with the Global Quality team to define qualification plans, review and manage qualification execution progress, and resolve qualification-gating issues.
  • Drive reductions in extrinsic reliability (Time 0 and field DPM) and improve intrinsic reliability through optimized manufacturing test flows and test strategy to meet quality, cost, and cycle-time KPIs.
  • Debug reliability-test failures and identify root causes for qualification and RMA device issues related to defectivity and intrinsic reliability using electrical failure analysis (EFA) and physical failure analysis (PFA); drive resolution and improvement through cross-functional collaboration.
  • Provide recommendations to fab teams for new process conversions that reduce cost and increase yield, supporting HBM product yield, quality, reliability, and performance.
  • Communicate with Product Managers and Leads to manage risks associated with DPM process conversions and balance the pace of conversion with stability and reliability.
  • Promote innovation and drive changes that provide Micron with a technical advantage.
  • Develop project management skills within the team to support efficient execution and timely delivery of technological solutions.
  • Make final decisions on risk analysis and project prioritization.
  • Collaborate with Fab, HBM Technology Development, HBM Design, System Development, and Quality/Reliability teams to develop and ship end products.

Desired Qualifications

  • Coursework or internship experience in semiconductor devices, circuit design, or product validation.

About the Company

Micron Technology

Makes memory and storage chips for AI and PCs

Micron Technology designs and manufactures memory and storage chips, mainly DRAM and NAND flash, used in data centers, PCs, phones, cars and industrial equipment. It is one of only three companies that make HBM, the stacked high-bandwidth memory placed beside processors in AI servers, and it is the largest memory chipmaker based in the United States. Unlike chip designers that outsource production, Micron runs its own fabs and assembly sites in the United States and across Asia. It earns money by selling chips, memory modules and solid-state drives to cloud providers, device makers and distributors. Micron was founded in 1978 and is headquartered in Boise, Idaho.

Company size
10,001+
Company stage
IPO
Headquarters
Boise, ID
Founded
1978

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