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Micron Technology

Makes memory and storage chips for AI and PCs

Staff/Principal Engineer - CMP Advanced NAND

Process EngineeringConfirmed live in the last 24 hours
Full-timeSingaporeNo salary listedIn-person

About the Job

Requirements

  • A PhD with at least 5 years, a Master's degree with at least 7 years, or a Bachelor's degree with at least 10 years of relevant experience in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or a related field, with demonstrated expertise in semiconductor experience and Chemical Mechanical Planarization (CMP) process in 300 mm wafer fabrication.
  • Hands-on experience operating CMP equipment such as AMAT (LKP), EBARA-300X, and next-generation CMP equipment, as well as experience with optical metrology, profilometry, polishing slurries, conditioners, and polishing pads.
  • Experience developing dielectrics/metals CMP processes on 3D NAND or other memory technology.
  • Understanding of integration and structural impacts and constraints related to film deposition and other upstream and downstream processes.
  • Understanding of general process steps and process flow for planar and vertical NAND memory processing.
  • Strong interest in data science and modeling, and willingness to use or adopt AI to optimize workflows.
  • Excellent oral and written communication skills, with the ability to communicate concisely and effectively in local and remote settings.
  • Ability to manage multiple projects and take calculated risks to execute novel solutions.
  • Recognized ability to mentor, collaborate as a team member, solicit and accept feedback, and analyze successes and failures.
  • Adherence to Micron's Intellectual Property Protection policy.

Responsibilities

  • Develop and optimize chemical mechanical planarization procedures to improve the quality and reliability of next-generation memory products.
  • Understand and improve process margins needed to meet mature yield goals for 3D NAND parts.
  • Conduct advanced 3D NAND CMP process development, including fundamental research, consumables development, hardware evaluation, and testing processes for novel applications.
  • Initiate and manage experiments to widen process margins and evaluate the manufacturability of next-node solutions.
  • Collaborate extensively with vendors to develop processes that meet integration requirements for current and next-generation 3D NAND nodes.
  • Incorporate best-known manufacturing methods into the early development phase of upcoming nodes.
  • Design and implement advanced process monitoring and control methodologies.
  • Provide a strategic roadmap for N+, N++, and future NAND nodes.
  • Contribute as a technical expert to technical projects that improve processes, procedures, and equipment.
  • Define and lead complex, multifunctional projects of critical importance and help define strategic direction.
  • Advise management on significant technical issues and lead and initiate innovation projects through patents and technical papers.
  • Communicate and collaborate with partners locally and globally.
  • Mentor new hires and less experienced team members on CMP fundamentals, process development, and Micron systems.
  • Engage with Procurement and Operations Central Teams and other local and global partners to drive breakthrough solutions.
  • Lead or drive teams or sites on complex, multidisciplinary projects in quality-focused, process and yield improvement, cost, and productivity improvement meetings.
  • Integrate AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness while exercising sound judgment and complying with organizational standards and legal requirements.
  • Identify, test, and share AI-enabled enhancements within the scope of work to contribute to continuous improvement.

About the Company

Micron Technology

Makes memory and storage chips for AI and PCs

Micron Technology designs and manufactures memory and storage chips, mainly DRAM and NAND flash, used in data centers, PCs, phones, cars and industrial equipment. It is one of only three companies that make HBM, the stacked high-bandwidth memory placed beside processors in AI servers, and it is the largest memory chipmaker based in the United States. Unlike chip designers that outsource production, Micron runs its own fabs and assembly sites in the United States and across Asia. It earns money by selling chips, memory modules and solid-state drives to cloud providers, device makers and distributors. Micron was founded in 1978 and is headquartered in Boise, Idaho.

Company size
10,001+
Company stage
IPO
Headquarters
Boise, ID
Founded
1978

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