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GlobalFoundries

Semiconductor foundry delivering specialized chips

Field Application Engineer

Solution EngineeringConfirmed live in the last 24 hours
Full-timeHsinchu, Hsinchu City, TaiwanNo salary listedIn-person

About the Job

Requirements

  • A Bachelor's, Master's, or PhD degree in Electronics or Electrical Engineering; a Master's degree in Electronics or Electrical Engineering or equivalent is also specified.
  • At least 6 years of experience in semiconductor IC design, system design, semiconductor IC testing, or system testing.
  • Relevant semiconductor experience in technology or design.
  • End-to-end experience from concept to silicon validation.
  • Excellent communication skills and a strong sales aptitude.
  • Exposure to IC product design and intellectual property.
  • Exposure to and basic competence in design environment, enablement flows, and tools.
  • A solid understanding of silicon processing and device physics.
  • Strong analytical, technical, project management, and presentation skills.

Responsibilities

  • Take ownership of GlobalFoundries technology demonstrations and drive the design-win acquisition strategy and process.
  • Develop customized technical presentations and proposals to assist customers in evaluating solutions.
  • Represent the strengths and weaknesses of GlobalFoundries technology credibly, internally and externally.
  • Formulate customer requirements, promote a compelling GlobalFoundries design solution, and convey the value proposition.
  • Identify and propose solutions to gaps and bottlenecks in the GlobalFoundries service portfolio to meet customer requirements.
  • Collaborate with product marketing, design solutions, and technology development teams, and provide real-time customer feedback.
  • Understand the competitive design, technology, and product landscape, including emerging technology trends and competitive threats.
  • Continuously learn about customers and products, develop relationships, gather intelligence, and uncover new opportunities.
  • Ensure issues, obstacles, and questions affecting design wins are resolved directly or by engaging internal experts.
  • Gather and summarize technical gaps in offerings that result in design-win losses or missed new-revenue opportunities, and drive the team to close them.
  • Partner with account and sales managers to ensure a smooth post-design-win transition to Customer Engineering teams.
  • Meet design-win, tapeout, and MPW goals.
  • Align customer mature- and advanced-node tapeout-readiness preparation, including export control forms, IP declaration forms, and frame tables.
  • Ensure issues, obstacles, and questions affecting tapeout are resolved directly or by engaging internal process experts.
  • Support Customer Engineers on all post-tapeout activities and requirements.
  • Coordinate with customers on silicon functionality verification, product performance, design margin, and related issues.
  • Lead customer design reviews and mock tapeouts, and identify and align all MPW and test-chip requirements before product design and tapeout.
  • Own or collaborate on all tapeout logistics and execution.
  • Perform all activities safely and responsibly and support Environmental, Health, Safety, and Security requirements and programs.

Desired Qualifications

  • Past participation in roles with exposure to or within a foundry is highly desirable.

About the Company

GlobalFoundries

Semiconductor foundry delivering specialized chips

GlobalFoundries is a semiconductor foundry that manufactures chips for a broad range of customers, focusing on feature-rich, reliable technologies for cars, IoT, 5G, and other high-growth markets. It operates by fabricating silicon wafers for customer designs, offering mature, specialized processes rather than chasing the most advanced nodes. This makes it different from peers that prize the latest process nodes; GlobalFoundries emphasizes diversification across a global manufacturing footprint (U.S., Europe, Singapore) and stable supply for essential applications. Its goal is to be a leading supplier of high-volume, specialty manufacturing that enables reliable chips for everyday devices and growing tech markets.

Company size
10,001+
Company stage
IPO
Headquarters
Town of Malta, New York
Founded
2009

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