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PDF Solutions

End-to-end analytics platform for semiconductors

Layout (FIRE) Extraction Engineer - Extraction Engineer

Silicon & ASIC DesignConfirmed live in the last 24 hours
Full-timeTokyo, Japan¥10M - ¥13M /yrIn-person

About the Job

Requirements

  • A Bachelor's degree or higher in electrical engineering; statistics or an IT-related discipline may be acceptable depending on work experience.
  • Theoretical and practical experience in OPC/RET (Resolution Enhancement Technology).
  • Comprehensive understanding of CMOS process flow.
  • Knowledge of mask fabrication and design rules (DRC).
  • Experience with OPC/mask simulation tools including Mentor Graphics Calibre OPC/ILT, Synopsys Sentaurus/Litho, or ASML Brion Tachyon.
  • Experience with layout processing tools such as Cadence, Synopsys, or KLayout.
  • Hands-on experience with Linux and Python, Perl, Tcl, and shell scripting.
  • Experience in large-scale data processing and automation.
  • Understanding of pattern matching, shape transformation, and data optimization.
  • Experience analyzing SEM/e-beam inspection data.
  • Experience optimizing process window (PW) and depth of focus (DOF).
  • Ability to read and understand English technical papers and datasheets and write reports.
  • Strong initiative and communication skills.

Responsibilities

  • Run Layout (FIRE) Extraction on client sites to support onsite inspection application development.
  • Provide remote Layout (FIRE) Extraction support for R&D and demo application development in the PDF Milpitas lab.
  • Analyze and improve discrepancies between layout and actual pattern.
  • Collaborate with Design, Lithography, and Fab Process teams.
  • Modify and optimize designs based on customer and internal feedback.

Desired Qualifications

  • Experience optimizing OPC using machine learning or artificial intelligence.

About the Company

PDF Solutions

End-to-end analytics platform for semiconductors

PDF Solutions offers an end-to-end analytics platform for the semiconductor industry, combining software tools and engineering services to help fabs boost yields and efficiency. Its software collects data from manufacturing processes, analyzes it, and visualizes results for engineers and data scientists, while its engineering services cover process control, yield management, and failure analysis; revenue comes from software licensing and service fees. The company differentiates itself by its semiconductor-focused, integrated data-collection and analytics platform paired with specialized services delivered globally under a licensing-and-services model. Its goal is to help semiconductor customers raise yields, reduce waste, and improve overall manufacturing performance through data-driven insights.

Company size
1,001-5,000
Company stage
IPO
Headquarters
Santa Clara, CA
Founded
1992

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