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Micron Technology

Makes memory and storage chips for AI and PCs

RDA Equipment Engineer

Inspection & TestPosted on Nov 11
Full-timeHiroshima, JapanNo salary listedIn-person

About the Job

Requirements

  • Good understanding of semiconductor processes, including DRAM manufacturing processes.
  • Strong logical and analytical thinking skills, with the ability to analyze situations, solve problems, optimize processes, and improve efficiency.
  • Ability to collaborate with equipment vendors to improve existing technologies and support the achievement of technology roadmaps.
  • Ability to leverage artificial intelligence tools to improve work efficiency and optimize workflows.
  • Strong communication skills and the ability to collaborate effectively across global teams and organizations.

Responsibilities

  • Perform E-Beam (scanning electron microscope-based) inspection for advanced DRAM development.
  • Develop recipes for E-Beam inspection tools, improve inspection and defect-detection sensitivity, introduce new inspection equipment, and optimize inspection processes for high-volume manufacturing.
  • Support E-Beam inspection requests from TD PI/PD and other organizations; occasionally work overtime to support real-time inspection of high-priority lots.
  • Understand E-Beam inspection principles, DRAM device operation, and new-process structures, and apply E-Beam inspection tools effectively in advanced DRAM development.
  • Develop and evaluate new E-Beam inspection methodologies and test element group structures for E-Beam inspection.
  • Research next-generation inspection technologies and develop understanding of the latest inspection technologies, equipment roadmaps, and technologies required for future DRAM generations; take a technical leadership role in their development and deployment within Micron.
  • Maintain and manage E-Beam inspection tools, and work with equipment vendors to troubleshoot equipment issues and restore tools promptly.
  • Select and pull wafers as needed and coordinate further analysis with YE.
  • Become proficient in RDA systems such as Klarity and YMS, and use inspection data from these systems to identify potential inspection or process issues.
  • Set up and manage Sigma and SPACE charts and perform GCP-related activities.
  • Provide technical support to other fabs as needed.
  • Use artificial intelligence technologies to improve efficiency and optimize inspection-related workflows and processes.

Desired Qualifications

  • Experience in semiconductor processes, RDA, and/or metrology.

About the Company

Micron Technology

Makes memory and storage chips for AI and PCs

Micron Technology designs and manufactures memory and storage chips, mainly DRAM and NAND flash, used in data centers, PCs, phones, cars and industrial equipment. It is one of only three companies that make HBM, the stacked high-bandwidth memory placed beside processors in AI servers, and it is the largest memory chipmaker based in the United States. Unlike chip designers that outsource production, Micron runs its own fabs and assembly sites in the United States and across Asia. It earns money by selling chips, memory modules and solid-state drives to cloud providers, device makers and distributors. Micron was founded in 1978 and is headquartered in Boise, Idaho.

Company size
10,001+
Company stage
IPO
Headquarters
Boise, ID
Founded
1978

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