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Micron Technology

Makes memory and storage chips for AI and PCs

Films, Metals and Implant Principal Lead Engineer

Process EngineeringConfirmed live in the last 24 hours
Full-timeBoise, ID, USANo salary listedIn-person

About the Job

Requirements

  • A bachelor's degree in Engineering or equivalent experience in the semiconductor industry.
  • Demonstrated technical leadership experience in a semiconductor or manufacturing environment.
  • Experience with films, metals, or implant processes, including chemical vapor deposition (CVD), atomic layer deposition (ALD), physical vapor deposition (PVD), diffusion, or implant technologies.
  • Strong problem-solving, communication, and cross-functional collaboration skills.

Responsibilities

  • Lead multi-shift engineering teams to complete development priorities and ensure consistent 24/7 operational performance.
  • Partner with Process Development, Integration, Equipment, and Manufacturing to accelerate learning cycles and meet roadmap goals.
  • Coordinate wafer execution, ensuring data quality, process monitoring, timely response to customer concerns, and defect reduction.
  • Drive operational excellence by managing important metrics, improving cycle time, and removing execution bottlenecks.
  • Build and improve workflows, systems, and artificial intelligence-enabled practices to improve efficiency and development speed.

Desired Qualifications

  • A master's or PhD in Engineering with at least 5 years of semiconductor process development experience, or a bachelor's degree with at least 10 years of experience.
  • Deep expertise in films and metals deposition or implant technologies.
  • Experience in a shift-based manufacturing or technology development environment.
  • Proven ability to mentor engineers and build high-performing technical teams.

About the Company

Micron Technology

Makes memory and storage chips for AI and PCs

Micron Technology designs and manufactures memory and storage chips, mainly DRAM and NAND flash, used in data centers, PCs, phones, cars and industrial equipment. It is one of only three companies that make HBM, the stacked high-bandwidth memory placed beside processors in AI servers, and it is the largest memory chipmaker based in the United States. Unlike chip designers that outsource production, Micron runs its own fabs and assembly sites in the United States and across Asia. It earns money by selling chips, memory modules and solid-state drives to cloud providers, device makers and distributors. Micron was founded in 1978 and is headquartered in Boise, Idaho.

Company size
10,001+
Company stage
IPO
Headquarters
Boise, ID
Founded
1978

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