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Micron Technology

Makes memory and storage chips for AI and PCs

Principal Physical Design Engineer

Silicon & ASIC DesignConfirmed live in the last 24 hours
Full-timeBoise, ID, USANo salary listedIn-person

About the Job

Requirements

  • A Master's degree in Electrical Engineering or equivalent with 8+ years of experience, or a Bachelor's degree with 10+ years of experience in application-specific integrated circuit physical design.
  • Strong expertise in physical design implementation flows, including floorplanning, place and route, clock tree synthesis, timing closure, and design signoff.
  • Hands-on experience with static timing analysis, signal integrity, power integrity, physical verification, and advanced process technologies.
  • Proficiency with Synopsys IC Compiler II, Fusion Compiler, PrimeTime, PrimePower, RedHawk, or equivalent industry-standard physical design and signoff tools.
  • Strong scripting and automation skills using Python, Tcl, or similar languages.
  • Ability to drive multifunctional technical initiatives and influence engineering organizations.

Responsibilities

  • Lead physical design implementation of complex dynamic random-access memory digital designs, including floorplanning, place and route, clock tree synthesis, timing closure, and tapeout activities.
  • Drive power integrity strategies and signoff methodologies, including power delivery network planning, IR drop analysis, electromigration verification, and EMIR signoff.
  • Collaborate with multifunctional teams to resolve timing, congestion, power, signal integrity, and reliability challenges at block and full-chip levels.
  • Develop and deploy methodology improvements, automation solutions, and guidelines to improve build quality, efficiency, and scalability.
  • Mentor engineers and provide technical leadership while influencing future memory products through innovation in physical design and signoff methodologies.

Desired Qualifications

  • Experience developing physical design, power delivery network, or EMIR methodologies for large-scale application-specific integrated circuit, system-on-chip, or memory products.
  • Expertise in power integrity signoff, including static and dynamic IR drop analysis, electromigration verification, current profiling, and IDD modeling.
  • Experience driving methodology transformation, tool deployment, and engineering process improvements across organizations.
  • Demonstrated technical leadership, mentoring, and ownership of projects across multiple product generations.
  • Experience using artificial intelligence-assisted technologies and generative artificial intelligence tools to improve engineering efficiency and innovation.

About the Company

Micron Technology

Makes memory and storage chips for AI and PCs

Micron Technology designs and manufactures memory and storage chips, mainly DRAM and NAND flash, used in data centers, PCs, phones, cars and industrial equipment. It is one of only three companies that make HBM, the stacked high-bandwidth memory placed beside processors in AI servers, and it is the largest memory chipmaker based in the United States. Unlike chip designers that outsource production, Micron runs its own fabs and assembly sites in the United States and across Asia. It earns money by selling chips, memory modules and solid-state drives to cloud providers, device makers and distributors. Micron was founded in 1978 and is headquartered in Boise, Idaho.

Company size
10,001+
Company stage
IPO
Headquarters
Boise, ID
Founded
1978

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