M

Micron Technology

Makes memory and storage chips for AI and PCs

APTD Integrator

Process EngineeringConfirmed live in the last 24 hours
Full-timeTaichung City, TaiwanNo salary listedIn-person

About the Job

Requirements

  • A PhD, Master's, or Bachelor's degree in Electrical & Electronic Engineering, Material Engineering, Mechanical Engineering, Physics, or Applied Physics, or equivalent work experience is required.
  • At least 8 years of experience in the semiconductor industry is required.
  • Experience in frontend fab process integration or module process, with technical knowledge of wafer- and die-level process technology, is required.
  • Understanding of Micron silicon and its interaction with backend processes and packaging through CPI is required.
  • Strong project management skills to ensure execution to timelines are required.
  • Strong communication and presentation skills are required.
  • Understanding of business needs and customer requirements is required.
  • Ability to integrate and cooperate with people from cross-functional teams is required.
  • Ability to integrate AI-assisted tools and insights into daily work responsibly and in compliance with organizational standards and legal requirements is required.
  • Ability to apply baseline digital fluency and role-appropriate AI literacy for research, analysis, content creation, problem-solving, operational tasks, and achieving business objectives is required.

Responsibilities

  • Develop advanced packaging process solutions and ensure the success of new process, new equipment, new material, and path-finding activities for advanced packaging products.
  • Lead new technology-node process readiness and improve yield, quality, and reliability through process characterization and optimization and the introduction of new materials, machines, and technologies.
  • Understand frontend processes, packaging requirements, chip-package interaction, equipment, and process technology to enable technology solutions that meet packaging requirements.
  • Drive and collaborate with cross-functional teams to resolve process-related problems.
  • Ensure smooth transition from new process development through first qualification success to small-volume production launch.
  • Develop and qualify new packaging processes, materials, equipment, and technology solutions to meet new technology-node requirements and schedules.
  • Perform CPI NUDD, process TRA, and risk mitigation; ensure process recipe readiness before silicon arrives and first-pass rate.
  • Qualify new processes, technologies, equipment, and materials.
  • Identify path-finding opportunities for technology leadership, time-to-market, continuous yield improvement, cost efficiency, and touchpoint optimization.
  • Integrate process knowledge between upstream and downstream silicon and assembly/packaging processes.
  • Understand future trends, technologies, and capabilities for future packaging solutions, and work with teams to establish capabilities that enhance process performance.
  • Provide new solutions on time to meet company and customer needs.
  • Define, develop, and establish process capabilities, strategy, and roadmap.
  • Develop and engage creative solutions for new capabilities or to overcome identified process constraints ahead of product requirements.
  • Identify, test, and share AI-enabled enhancements within the role's scope of work.

About the Company

Micron Technology

Makes memory and storage chips for AI and PCs

Micron Technology designs and manufactures memory and storage chips, mainly DRAM and NAND flash, used in data centers, PCs, phones, cars and industrial equipment. It is one of only three companies that make HBM, the stacked high-bandwidth memory placed beside processors in AI servers, and it is the largest memory chipmaker based in the United States. Unlike chip designers that outsource production, Micron runs its own fabs and assembly sites in the United States and across Asia. It earns money by selling chips, memory modules and solid-state drives to cloud providers, device makers and distributors. Micron was founded in 1978 and is headquartered in Boise, Idaho.

Company size
10,001+
Company stage
IPO
Headquarters
Boise, ID
Founded
1978

Recently Posted Jobs

Explore more opportunities at Micron Technology

See more jobs