Failure Analysis Technician

Primary Duties & Responsibilities

• Operate a Helios Dual-Beam Focused Ion Beam (DBFIB) system to perform precision cross-sectioning, defect localization, delayering, circuit editing support, and structural characterization of semiconductor and photonic devices. 
• Prepare high-quality TEM lamella specimens using in-situ and ex-situ lift-out techniques, including thinning and final polishing suitable for high-resolution TEM analysis. 
• Perform SEM imaging and EDS elemental analysis to characterize materials, contamination, defects, interfaces, and failure mechanisms. 
• Operate a Transmission Electron Microscope (TEM) to evaluate device structures, material interfaces, process defects, contamination, and failure sites. 
• Analyze and document microscopy results, generating clear reports containing images, measurements, observations, and technical conclusions. 
• Support root-cause investigations by providing detailed physical characterization of product, process, and reliability failures. 
• Perform sample preparation activities including cleaving, polishing, mounting, coating, and other techniques required to support advanced analytical investigations. 
• Assist Failure Analysis Engineers in developing analytical approaches and selecting appropriate characterization techniques for complex failure investigations. 
• Maintain laboratory equipment, fixtures, consumables, and documentation to ensure safe and reliable operation. 
• Follow established procedures while identifying opportunities to improve laboratory efficiency, sample preparation methods, and analytical workflows. 
• Train and assist other technicians and engineers on sample preparation methods, microscopy techniques, and laboratory best practices as assigned. 
• Support new product introductions, reliability studies, yield improvement initiatives, and customer return investigations through advanced microscopy and materials characterization.

Education & Experience

• Requires an Associate Degree in Electronics, Materials Science, Engineering Technology, Physics, Chemistry, Microscopy, or a related technical field with 2+ years of relevant experience; or 4+ years of directly applicable experience in semiconductor failure analysis, microscopy, materials characterization, or a related laboratory environment.

Skills

• Hands-on experience operating Focused Ion Beam (FIB) or Dual-Beam FIB (DBFIB) systems required. 
• Experience with TEM lamella preparation using in-situ lift-out techniques strongly preferred. 
• Experience operating Scanning Electron Microscopes (SEM) and performing EDS elemental analysis preferred. 
• Experience operating or supporting Transmission Electron Microscopes (TEM) preferred. 
• Working knowledge of semiconductor device structures, thin-film materials, metallization systems, and failure mechanisms preferred. 
• Ability to interpret SEM, TEM, EDS, and FIB-generated data and communicate observations clearly. 
• Strong mechanical aptitude and manual dexterity for handling delicate samples and performing precision sample preparation. 
• Ability to work with sub-micron features and maintain high attention to detail when preparing and analyzing specimens. 
• Proficiency with Microsoft Office applications and technical report generation. 
• Experience with image processing and annotation software such as Photoshop, ImageJ, or equivalent preferred. 
• Self-motivated with the ability to manage multiple investigations simultaneously and prioritize work effectively. 
• Strong written and verbal communication skills. 
• Experience working in cleanroom, laboratory, or semiconductor manufacturing environments preferred.

• Strong interpersonal skills to be able to effectively collaborate with others including within department and cross-functional teams in order to achieve business unit and organizational objectives.

Working Conditions

• Work in a class 10,000 clean room for extended periods.
• Wear cleanroom attire (smock, frocks, mask, etc.)

• Work with and/or around chemicals (such as IPA and Acetone).

Physical Requirements

• Manual dexterity sufficient to grasp, manipulate, and position very small objects (approximately 85 µm in diameter) using tweezers and other precision tools.

• Close visual acuity, with or without corrective lenses, required for activities including preparing and analyzing data; reading and interpreting figures; focusing and viewing microscopic images; visual inspection of small parts and defects; operating precision positioning probes; using measurement devices; and performing assembly or destructive analysis at close viewing distances.

• Ability to distinguish colors to identify defects, features, or conditions on parts and materials.

• Ability to communicate effectively in spoken English, including clearly conveying detailed or important instructions to others in person or in group settings.

• Ability to hear and interpret sounds at normal speaking levels, with or without correction, and to receive detailed information through oral communication.

• Ability to work at a microscope, which may require bending forward at the waist or spine for periods of up to one hour at a time.

• Ability to perform sedentary work, involving sitting and/or standing for up to four hours at a time while working at a workstation, microscope, or solvent hood.

• Ability to walk within the facility, including distances of up to approximately 500 meters, sometimes while wearing required protective footwear or shoe covers.

• Ability to perform light physical work, including lifting, carrying, or moving objects weighing up to 25 pounds over short distances.

• Ability to ascend and descend stairs and ladders as required.

• Ability to occasionally kneel or crouch to reach items below workstations or within equipment enclosures.

• Ability to perform precision manual probing, using both hands and arms, for periods of up to one hour at a time.

• Ability to work safely in environments with potential hazards, including proximity to moving mechanical parts that may present pinch hazards and exposure to chemicals.

• Ability and willingness to wear required cleanroom attire, including gowns and personal protective equipment, for periods of up to four hours at a time.

Safety Requirements

All employees are required to attend scheduled training, follow the site EHS procedures and Corporate EHS standards.  This includes the use of proper protective equipment (PPE) as required by the job responsibilities.

Managers will ensure that all safety and environmental procedures are followed consistently.  They will ensure that risk assessments are performed, proper training, work instructions, required PPE is available, and will monitor compliance.

The below additional safety precautions are required. 

• Nitrile gloves for handling the following: IPA (Isopropyl Alcohol), acetone and wafers, die or any other parts submitted for analysis. 
• Laser safety glasses for testing high power parts.
• Safety glasses or goggles (prescription or standard) to be used when handling the following: Die punch tool, pouring liquid nitrogen and cleaning with IPA or Acetone.
• Thermal Gloves for handling liquid nitrogen.
• Sharps gloves for handling sharp parts. 
• Face shield for handling liquid nitrogen or cleaning parts with chemicals.
• Apron and chemical gloves for pouring chemicals.

Quality and Environmental Responsibilities

Depending on location, this position may be responsible for the execution and maintenance of the ISO 9000, 9001, 14001 and/or other applicable standards that may apply to the relevant roles and responsibilities within the Quality Management System and Environmental Management System.

Culture Commitment

Ensure adherence to company’s values (ICARE) in all aspects of your position at Coherent Corp.:

Integrity – Create an Environment of Trust

Collaboration – Innovate Through the Sharing of Ideas

Accountability – Own the Process and the Outcome

Respect – Recognize the Value in Everyone

Enthusiasm – Find a Sense of Purpose in Work

Coherent Corp. is an equal opportunity/affirmative action employer. All qualified applicants will receive consideration for employment without regard to sex, gender identity, sexual orientation, race, color, religion, national origin, disability, protected Veteran status, age, or any other characteristic protected by law.