Introduction

ASML US, including its affiliates and subsidiaries, bring together the most creative minds in science and technology to develop lithography machines that are key to producing faster, cheaper, more energy-efficient microchips. We design, develop, integrate, market and service these advanced machines, which enable our customers - the world’s leading chipmakers - to reduce the size and increase the functionality of their microchips, which in turn leads to smaller, more powerful consumer electronics. Our headquarters are in Veldhoven, Netherlands, and we have 18 office locations around the United States including main offices in Chandler, Arizona, San Jose and San Diego, California, Wilton, Connecticut, and Hillsboro, Oregon.

Job Mission

TheField Service Engineerprovides onsite field service support through the performance of installations, upgrades, repairs, and maintenance of complex capital equipment and systems.  Troubleshoots either to resolve issues directly or through referring advanced issues to technical support resources.  Acts as a customer service advocate, instructing customers in the operation and maintenance of the system. This is a Night Shift position, compressed work week. Candidate must be flexible to work all 4 shifts.

In the Cymer Light Source (CLS) division we design and manufacture Deep Ultraviolet (DUV) lasers, used directly in the chipmaking process.

Job Description

Analyzes, diagnoses, and troubleshoots Cymer equipment problems via telephone or at customer site.

Performs installation, repair, retrofits, upgrades and preventive maintenance on Cymer equipment installed at customer sites.

Maintains an assigned installation equipment base.  This includes providing primary support, forecasting, conducting customer support meetings, and ensuring regular communication with the customer.

Assists customers in the receipt, installation, and testing of company equipment.

Conducts equipment troubleshooting, analysis, and debugging in support of installation or operating activities.

May provide service education to customer’s service and operations staff.

Ensures that parts are available and as specified for service requirements.

Maintains appropriate tools are on hand and as required.

Travels as required for the purposes of performing service activities at customer sites or backfilling for other Cymer Field Service Engineers.

Completes service, expense reports, and other administrative responsibilities in accordance with Cymer’s procedures and with supervisor’s approval.

Uses company technical documentation and provides feedback for improvement.

Performs other duties as assigned.

This position may require access to controlled technology, as defined in the Export Administration Regulations (15 C.F.R. § 730, et seq.). Qualified candidates must belegally authorized to access such controlled technology prior to beginning work. Business demands may require the Company to proceed with candidates who are immediately eligible to access controlled technology.

Education

High School education or equivalent. Some college education preferred or similar Military / vocational experiences.

Experience

Minimum of three (3) years of field service engineering experience required or relevant work related experience is required.

Minimum of one (1) year experience in optics, laser, and/or semiconductor manufacturing equipment experience is preferred.

Laser and vacuum experience preferred.

Has led one installation or significantly contributed to the successful installation of products at multiple sites.

Ability to analyze data and report problems, to complete accurate, comprehensive service reports, and to communicate technical issues to other technical staff.

Ability to collect, translate, and analyze data.

Intermediate level of technical knowledge of electronics.

Excellent customer service skills, with a solid foundation in and an understanding of the importance of relationship building.

Ability to facilitate resolution of technical challenges.

Ability to apply advanced knowledge of installation, maintenance/repair, and troubleshooting at both the module and system level, while seeking expertise of more senior field service engineers where required.

Ability to read and analyze opto-mechanical and electronic schematics.

Protocol, and Computer Networking.

Must be able to successfully meet customer site access requirements such as: background checks, safety training, and cleanroom access (gowning and breathing apparatus).

Excellent written and verbal communications skills.

Requires experience using the following software packages: MS Word, Excel, PowerPoint, and electronic e-mail systems, LabView, Internet.

For regions - oral and written English language skills required.

Personal skills

Effective communication, perseverance, problem solving, customer support focus and team oriented.

Context of the position

Onsite field service support, troubleshooting and resolving issues.  Customer support advocate, guiding customers in operation and maintenance of the system.

PHYSICAL DEMANDS AND WORK ENVIRONMENT

The physical demands described here are representative of those that must be met by an employee to successfully perform the essential functions of this job. Reasonable accommodations may be made to enable individuals with disabilities to perform the essential functions.

While performing the duties of this job, the employee routinely is required to sit; walk; talk; hear; use hands to keyboard, finger, handle, and feel; stoop, kneel, crouch, twist, reach, and stretch.

The employee is occasionally required to move around the campus.

The employee may occasionally lift and/or move up to35pounds.

May require travel dependent on business needs.

Specific vision abilities required by this job include close vision, color vision, peripheral vision, depth perception, and ability to adjust focus.

Can work under deadlines.

The environment generally is moderate in temperature and noise level.

Must be able to read and interpret data, information, and documents.

Can observe and respond to people and situations and interact with others encountered in the course of work.

Can learn and apply new information or skills.

Responsibilities include periodic travel to regional and overseas sites for product technical support and special support projects.

Work may include onsite technical support involving heavy lifting of equipment & modules.

Position will require technical work activity in a clean-room production environment and/or laboratory setting.

The environment generally is moderate in temperature and noise level.

Occasionally may be exposed to loud noise bursts and may be exposed to toxic gases (fluorine).

Must be able to work in small, confined spaces.

Other information

We offer competitive salaries and benefits including medical, dental, vision, 401(K), and FSAs.

We are committed to leveraging the diverse backgrounds, perspectives, and experiences of our workforce to create opportunities for our people and the business. EOE

The current base annual hourly range for this role is currently:

$0-0

Pay scales are determined by role, level, location and alignment with market data. Individual pay is determined through interviews and an assessment of several factors that that are unique to each candidate, including but not limited to job-related skills, relevant education and experience, certifications, abilities of the candidate and pay relative to other team members.

The Company offers employees and their families, medical, dental, vision, and basic life insurance. Employees are able to participate in the Company’s 401k plan. Employees will also receive eight (8) hours of vacation leave every month and (13) paid holidays throughout the calendar year. For more information, please contact the Recruiter or click on this link Compensation & Benefits in the US.

All new ASML jobs have a minimum application deadline of 10 days.

This position requires access to controlled technology, as defined in the United States Export Administration Regulations (15 C.F.R. § 730, et seq.). Qualified candidates must be legally authorized to access such controlled technology prior to beginning work. Business demands may require ASML to proceed with candidates who are immediately eligible to access controlled technology.

Inclusion and diversity

ASML is an Equal Opportunity Employer that values and respects the importance of a diverse and inclusive workforce. It is the policy of the company to recruit, hire, train and promote persons in all job titles without regard to race, color, religion, sex, age, national origin, veteran status, disability, sexual orientation, or gender identity. We recognize that inclusion and diversity is a driving force in the success of our company.

Need to know more about applying for a job at ASML? Read our frequently asked questions.

Request an Accommodation

ASML provides reasonable accommodations to applicants for ASML employment and ASML employees with disabilities. An accommodation is a change in work rules, facilities, or conditions which enable an individual with a disability to apply for a job, perform the essential functions of a job, and/or enjoy equal access to the benefits and privileges of employment. If you are in need of an accommodation to complete an application, participate in an interview, or otherwise participate in the employee pre-selection process, please send an email to [email protected] to initiate the company’s reasonable accommodation process.

Please note: This email address is solely intended to provide a method for applicants to initiate ASML’s process to request accommodation(s). Any recruitment questions should be directed to the designated Talent Acquisition member for the position.

About the company

ASML designs and manufactures photolithography systems for semiconductor manufacturing. Its main products are deep ultraviolet (DUV) and extreme ultraviolet (EUV) lithography machines that print circuit patterns on silicon wafers, with EUV enabling smaller features. The company sells these systems to leading chipmakers and earns substantial revenue from installation, maintenance, and upgrades over the machines’ lifetimes. Its goal is to help continue scaling semiconductors by leading in high-end lithography and maintaining strong relationships with customers like TSMC, Samsung, and Intel.

Company Size

10,001+

Company Stage

IPO

Headquarters

Veldhoven, Netherlands

Founded

1984

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Simplify's Take

What believers are saying

Q2 2026 sales hit €9.3 billion, and full-year guidance rose to €43-45 billion.
Management said 2028 EUV output could exceed 110 tools, unlocking AI wafer capacity.
India launched ASML operations with Tata Electronics support, opening a new customer frontier.

What critics are saying

Europe bought zero ASML lithography tools in 2026, exposing a dead domestic demand base.
Chinese DUV entrants in Shanghai threaten ASML's 29% 2025 China revenue by 2027.
ASML cut 1,700 jobs in 2026; continued restructuring signals execution strain and morale damage.

What makes ASML unique

ASML alone ships EUV systems; no advanced chip node exists without Veldhoven tools.
High-NA EUV expands into Nvidia-scale data-center chips, extending ASML's moat through 2033.
Installed Base Management generated €2.8 billion in Q2 2026, deepening recurring revenue.

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Benefits

Flexible Work Hours
Remote Work Options

Growth & Insights and Company News

6 month growth

1 year growth

2 year growth

Business Insider

Oct 23rd, 2026

ASML's CEO ties his pay to employee satisfaction after engagement drops to 73.5%

ASML chief executive officer Christophe Fouquet will tie executive pay to employee satisfaction, according to a memo seen by Business Insider. The move follows a drop in the Dutch chip equipment maker's employee engagement index from 78% to 73.5%, as it reorganises. Fouquet called it a "disruptive and emotional year." The survey polled more than 38,000 of ASML's roughly 44,000 employees. A new Workplace Experience Index, built from six survey questions, will join the long-term incentive plan. "In the coming years, it will directly influence the remuneration of senior leaders, including the Board of Management," Fouquet wrote. ASML announced in January that it could cut 1,700 jobs to reduce management layers, though it later said it expected fewer cuts. Its shares are up 45% this year on AI-driven demand.

Yahoo Finance

Oct 20th, 2026

Apple vs ASML: $416.2B revenue against 15.6% growth and a 29.4% margin

Apple and ASML offer two ways to bet on tech: one sells devices to billions of users, the other makes the lithography machines that chipmakers need to produce advanced semiconductors. In fiscal 2025, Apple's revenue reached nearly $416.2 billion, up about 6.4%. Net income was close to $112 billion, a 26.9% margin, and free cash flow was roughly $98.8 billion. Its debt-to-equity ratio was about 1.5. ASML reported revenue of nearly $36.8 billion, up 15.6%. Net income was $10.8 billion, a margin of about 29.4%, with free cash flow of roughly $12.5 billion. ASML's debt-to-equity ratio was about 0.2, and its current ratio was nearly 1.3, against Apple's 0.9.

Neoteo

Oct 16th, 2026

SemiAnalysis says ASML may be developing a hybrid-bonding tool.

SemiAnalysis says ASML may be developing a hybrid-bonding tool. A patent-based analysis describes a possible die-to-wafer process; ASML had not announced a tool as of October 15, 2026. October 16, 2026 Key points * 01 SemiAnalysis inferred that ASML may be developing a die-to-wafer hybrid-bonding tool; ASML had not announced it as of October 15, 2026. * 02 SemiAnalysis counted 27 ASML bonding patent families filed from December 2022 through November 2024, mostly related to D2W bonding. * 03 The proposed track-based process and its potential technical advantages are SemiAnalysis's interpretation, not measured tool results. * 04 SemiAnalysis expects advanced logic could be the first application; it forecasts D2W adoption in HBM no earlier than 2029, if it happens at all. SemiAnalysis says ASML may be developing a die-to-wafer hybrid-bonding tool. Its proposed process and potential impact on Besi remain unconfirmed. SemiAnalysis said on October 15, 2026, that ASML may be developing a die-to-wafer (D2W) hybrid-bonding tool, drawing that inference from patent filings, roadmap material and earlier reporting. ASML had not announced the tool as of the analysis. Read SemiAnalysis's analysis. Reuters reported on October 16 that ASML did not confirm the development and declined to comment on the report. Read the Reuters report. What the reporting says about ASML. SemiAnalysis counted 27 ASML bonding patent families filed between December 2022 and November 2024, most related to D2W bonding. It also cited The Elec reporting that ASML had begun architecture design with Prodrive Technologies and VDL ETG. These reports inform SemiAnalysis's inference; they do not amount to an ASML product announcement. The proposed tool is specifically a die-to-wafer bonder: individual semiconductor dies would be bonded to a wafer. The central claim in the coverage traces to SemiAnalysis's analysis. Investing.com summarized that analysis, while Reuters reported on it; those accounts do not constitute separate technical confirmation. How SemiAnalysis describes the proposed process. In SemiAnalysis's interpretation of patent material, each die would travel on an individual holder along a track, passing through inspection, cleaning, plasma activation, metrology and alignment before bonding to a wafer. The analysis suggests that independent shuttles could let stations work concurrently, that adding stations could increase capacity, and that recipes could accommodate different die types. Those are proposed design possibilities, not measured results. SemiAnalysis identifies alignment accuracy and particle control as potential advantages, while also pointing to engineering challenges involving feed-forward metrology, die-to-wafer contact, adapting non-bonding tools to the track and keeping the process loop clean. Why a possible tool could matter to Besi. SemiAnalysis describes Besi as the only supplier with D2W tools in volume production and says its logic-bonding business is concentrated at TSMC and Intel. If ASML develops a competing tool, Besi could face a new rival in that segment. SemiAnalysis expects advanced logic to be the likeliest first application for a prospective ASML tool. Its forecast for D2W bonding in high-bandwidth memory (HBM) is no earlier than 2029, if adoption happens at all. Other Languages Read this article in another available language.

MarketScreener

Oct 16th, 2026

Besi shares fall on report ASML is working on rival hybrid bonding product.

Besi shares fall on report ASML is working on rival hybrid bonding product. Published on 10/16/2026 at 06:54 am EDT - Modified on 10/16/2026 at 06:55 am EDT AMSTERDAM, Oct 16 (Reuters) - Shares in computer chip packaging equipment maker BE Semiconductor Industries (Besi) fell 3% on Friday after influential semiconductor research firm SemiAnalysis reported that one of the company's main growth products will face competition from bigger rival ASML. The SemiAnalysis report analysed 27 patent filings by ASML, which it said indicated ASML was developing a hybrid bonding product. Besi is a fraction of the size of ASML, the biggest maker of equipment used to make semiconductors, but Besi is a leader in hybrid bonding, an advanced packaging technology being used to create a new generation of more powerful three-dimensional chips. ASML has not confirmed it is developing such a tool. Besi did not respond to requests for comment. Besi shares were down 3% at EUR158.50, while ASML was up 1.1% at EUR1,480 in midday Amsterdam trading. A spokesperson for ASML declined to comment on the SemiAnalysis report but pointed to the company's launch of its first advanced packaging tool last year. "We continue to look at which directions the 3D integration industry will evolve... and where ASML's expertise can be of additional value," the company said in a statement at that time. In March, Reuters reported that ASML was planning additional packaging tools, citing Chief Technical Officer Marco Pieters in an interview. "The semiconductor market has already signalled that packaging is one of those next frontiers where performance gains can be unlocked, and ASML seems to be building next-gen tools headed in the same direction," said Nick Rossolillo, co-founder of Chip Stock Investor. "We see the new batch of packaging tools, beyond an EUV pipeline, as critical to pulling off the growth needed to justify (ASML's) elevated valuation." (Reporting by Toby Sterling; Editing by Susan Fenton) (C) Reuters - 2026

Channel NewsAsia

Oct 16th, 2026

Besi shares fall on report ASML is working on rival hybrid bonding product.

Besi shares fall on report ASML is working on rival hybrid bonding product. 16 Oct 2026 06:51PM (Updated: 16 Oct 2026 06:54PM) Add CNA as a trusted source to help Google better understand and surface our content in search results. AMSTERDAM, Oct 16: Shares in computer chip packaging equipment maker BE Semiconductor Industries (Besi) fell 3 per cent on Friday after influential semiconductor research firm SemiAnalysis reported that one of the company's main growth products will face competition from bigger rival ASML. The SemiAnalysis report analysed 27 patent filings by ASML, which it said indicated ASML was developing a hybrid bonding product. Besi is a fraction of the size of ASML, the biggest maker of equipment used to make semiconductors, but Besi is a leader in hybrid bonding, an advanced packaging technology being used to create a new generation of more powerful three-dimensional chips. ASML has not confirmed it is developing such a tool. Besi did not respond to requests for comment. Besi shares were down 3 per cent at €158.50, while ASML was up 1.1 per cent at €1,480 in midday Amsterdam trading. A spokesperson for ASML declined to comment on the SemiAnalysis report but pointed to the company's launch of its first advanced packaging tool last year. "We continue to look at which directions the 3D integration industry will evolve... and where ASML's expertise can be of additional value," the company said in a statement at that time. In March, Reuters reported that ASML was planning additional packaging tools, citing Chief Technical Officer Marco Pieters in an interview. "The semiconductor market has already signalled that packaging is one of those next frontiers where performance gains can be unlocked, and ASML seems to be building next-gen tools headed in the same direction," said Nick Rossolillo, co-founder of Chip Stock Investor. "We see the new batch of packaging tools, beyond an EUV pipeline, as critical to pulling off the growth needed to justify (ASML's) elevated valuation."

ASML

Field Service Engineer

About the job

Inclusion and diversity

Request an Accommodation

About the company

Get referred to ASML

Simplify's Take

What believers are saying

What critics are saying

What makes ASML unique

Benefits

Growth & Insights and Company News

6 month growth

1 year growth

2 year growth