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Mesh Optical Technologies

Designs and mass-produces high-speed optical transceivers

Lead Mechanical Engineer

Design EngineeringConfirmed live in the last 24 hours
Full-timeGardena, CA, USA

About the Job

Requirements

  • A bachelor's or master's degree in mechanical engineering or a related discipline is required.
  • At least 4 years of experience designing complex hardware systems, with demonstrated ownership of major subsystems or full products through production ramp.
  • A strong first-principles foundation in mechanics of materials, heat transfer, and tolerance analysis is required.
  • Experience designing tight-tolerance precision assemblies with multi-domain interfaces, including optical, electrical, thermal, or mechanical interfaces, is required.
  • Proficiency in professional 3D computer-aided design tools such as NX, SolidWorks, Creo, or equivalent is required.
  • Proficiency in structural analysis tools such as ANSYS Mechanical or equivalent finite element analysis is required.
  • Experience working directly with suppliers and contract manufacturers to drive production readiness and component qualification is required.
  • Experience leading technical efforts across cross-functional hardware teams is required.
  • Experience mentoring engineers or leading small technical teams is required.
  • Willingness to work extended hours and weekends as needed is required.

Responsibilities

  • Lead mechanical execution from concept through production ramp, personally designing and analyzing high-impact components and assemblies.
  • Translate product architecture into mechanical system strategy, defining the packaging approach and tolerance architecture across optical, electrical, and mechanical interfaces.
  • Architect electro-mechanical assemblies for highly automated, scalable manufacturing, ensuring designs enable autonomous assembly, precision placement, micron-scale metallurgical processes, and robust design-for-manufacturability execution.
  • Lead structural, thermal, and reliability analysis and decision-making; identify mechanical risks early and define validation strategies to retire them.
  • Drive design-for-manufacturability, design-for-assembly, and design-for-test across the mechanical subsystem; own supplier readiness from prototyping through production ramp.
  • Interface with optical, electrical, firmware, and process engineering teams to define system-level interfaces, integration constraints, and co-design trade-offs.
  • Provide day-to-day technical leadership to a small and growing team of mechanical engineers who own scoped subsystems.
  • Lead design reviews and ensure subsystem designs align with system-level requirements, schedule, and quality targets.
  • Establish mechanical design standards, documentation discipline, and review rigor across the team.
  • Mentor engineers, raise the technical bar, and contribute to hiring and growth of the mechanical function.

Desired Qualifications

  • Experience in optical, photonic, semiconductor, or high-performance computing hardware development.
  • Experience with high-density packaging, advanced thermal management, or chip-on-carrier/module-level mechanical integration.
  • Thermal simulation experience using tools such as ANSYS Mechanical, Icepak, Fluent, or equivalent computational fluid dynamics tools.
  • Experience designing for highly automated assembly environments, including familiarity with robotic pick-and-place, precision alignment, and in-line inspection constraints.
  • Experience with optomechanical design, including kinematic mounting, athermalization, or fiber-to-chip alignment fixturing.
  • Familiarity with materials selection for photonic or semiconductor-adjacent applications, including coefficient-of-thermal-expansion matching, outgassing, and cleanliness requirements.
  • Experience with reliability qualification methodologies such as HALT, HASS, or Telcordia-style environmental testing.
  • Familiarity with configuration management, engineering change processes, and product lifecycle management tools.

About the Company

Mesh Optical Technologies

Designs and mass-produces high-speed optical transceivers

Mesh Optical Technologies designs and mass-produces high-performance optical transceivers in the United States for data centers and AI infrastructure. Its flagship product, the Alpha C1, is an optical transceiver that converts electrical signals to light at 1.6 terabits per second. The device uses flip-chip die bonding in its optical engine and removes a power-hungry component to boost energy efficiency by about 3–5%, delivering lower latency and higher reliability for GPU clusters. Production is geared toward scalable manufacturing in the U.S. to reduce reliance on Chinese suppliers, with a plan to reach 1,000 units per day by the end of 2026 and begin bulk orders in 2027. The company aims to scale production, expand its integrated optical manufacturing capabilities, and become a key supplier for hyperscale computing and AI data centers.

Company size
11-50
Company stage
Early VC
Total funding
$50M
Headquarters
Los Angeles, CA
Founded
2025

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