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Micron Technology

Makes memory and storage chips for AI and PCs

Distinguished Member of Technical Staff - NAND Advanced Thin Films Process Development

Process EngineeringConfirmed live in the last 24 hours
Full-timeSingaporeNo salary listedIn-person

About the Job

Requirements

  • A PhD or equivalent in Materials Science, Chemical Engineering, Physics, Chemistry, Electrical Engineering, or a related field.
  • Over 20 years of experience in Thin Film research and development for NAND processes, specifically Diffusion, CVD, dielectric, and carbon-based films.
  • Industry recognition through patents, publications, invited talks, and leadership roles in technical committees or consortia.
  • Mastery of ALD/CVD (plasma and thermal) processes, including pioneering new deposition methods, materials, and integration strategies for innovative NAND scaling.
  • Deep expertise in reliability modeling, process-device correlation frameworks, and advanced failure analysis across multiple technology generations.
  • Advanced electrical evaluation of leakage, breakdown, capacitance, and impedance; metrology techniques including atom probe tomography, in-line defect mapping, and Statistical Process Control.
  • Expertise in breakthrough innovation, cross-disciplinary leadership, and external technology benchmarking; influence in shaping industry standards.
  • Expertise in advanced characterization: SIMS, XPS, TEM, EELS, APT, and ML-assisted image analysis for HAR structures and defect mapping.

Responsibilities

  • Shape the technical vision for structural and electrical film processes, ensuring significant impact across top-level organizational boundaries.
  • Lead programs that span the entire engineering group, advancing innovative breakthroughs in process development.
  • Influence industry and cross-disciplinary teams through external collaborations and technical leadership.
  • Mentor senior technical leaders and contribute to roadmap decisions that differentiate Micron’s products.
  • Address challenging technical problems, guiding teams in root cause analysis and resolution.
  • Represent Micron at industry consortia, technical conferences, and collaborative research initiatives.
  • Develop and advocate strategies focused on cost savings, process efficiency, and large-scale yield enhancement.
  • Own and update the structural and electrical film process technology roadmap, aligning it with business objectives and competitive benchmarks.
  • Initiate and lead strategic collaborations with external partners, universities, and research institutes.
  • Prepare and deliver technical presentations, white papers, and patent filings.
  • Assess technical risks and make decisions on process-development priorities and technology investments.
  • Guide strategic technology decisions, mentor senior technical leaders, and direct the long-term progression of structural and electrical film process development, including dielectric, low-K, high-K, and carbon-based films.
  • Lead the conception, development, and implementation of chemistries, materials, and hardware solutions for next-generation NAND.

About the Company

Micron Technology

Makes memory and storage chips for AI and PCs

Micron Technology designs and manufactures memory and storage chips, mainly DRAM and NAND flash, used in data centers, PCs, phones, cars and industrial equipment. It is one of only three companies that make HBM, the stacked high-bandwidth memory placed beside processors in AI servers, and it is the largest memory chipmaker based in the United States. Unlike chip designers that outsource production, Micron runs its own fabs and assembly sites in the United States and across Asia. It earns money by selling chips, memory modules and solid-state drives to cloud providers, device makers and distributors. Micron was founded in 1978 and is headquartered in Boise, Idaho.

Company size
10,001+
Company stage
IPO
Headquarters
Boise, ID
Founded
1978

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