Full-Time
Hardware Board Designer/PCB Design Engineer
Eliyan
51-200 employees
Develops chiplet connectivity technologies
No salary listed
Senior
Oakland, CA, USA
- 5+ years of PCB design experience
- Expertise in system architecture and block diagram development
- Strong background in power supply design (switching and linear regulators)
- Proficiency in high-speed digital interfaces (DDR, PCIe, Ethernet)
- Knowledge of common interfaces: I2C, JTAG, USB, GPIO
- Experience with microcontroller and FPGA integration
- Proficiency with PCB design software (Allegro PCB or equivalent)
- Bachelor's degree in Electrical Engineering or related field
- Design and develop PCBs from concept to production, including block diagram creation, schematic capture, and PCB layout
- Create and optimize power distribution systems including switching/linear power supplies and hot-swap circuits
- Implement high-speed interfaces including DDR, PCIe, Ethernet, and various control interfaces (I2C, JTAG, USB, GPIO)
- Work with microcontroller and FPGA-based designs
- Ensure designs meet signal integrity, EMI/EMC, and thermal requirements
- Collaborate with manufacturers for successful product development
- Skills in firmware, embedded, and scripting is a plus
Eliyan focuses on improving the way chiplets, which are small integrated circuits, connect with each other. Their technology aims to enhance the performance of smart systems, such as computers and other electronic devices, by allowing these chiplets to communicate more effectively. Unlike traditional methods of chiplet connectivity, Eliyan seeks to push the boundaries of what is possible, offering solutions that can lead to faster and more efficient systems. The goal of Eliyan is to enable the next generation of smart technology by providing superior connectivity solutions that maximize performance.
Company Size
51-200
Company Stage
Series B
Total Funding
$100M
Headquarters
Santa Clara, California
Founded
2021
Simplify's Take
What believers are saying
- Eliyan raised $100M to commercialize its chiplet interconnect technology.
- The rise of generative AI increases demand for Eliyan's advanced interconnect solutions.
- Dr. Jason Taylor's appointment enhances Eliyan's strategic direction in AI and tech sectors.
What critics are saying
- Emerging competition from Ayar Labs' optical I/O technology could challenge Eliyan's solutions.
- Rapid technological advancements may render Eliyan's current technologies obsolete.
- Supply chain vulnerabilities could impact Eliyan's production capabilities.
What makes Eliyan unique
- Eliyan's Bunch of Wires technology offers high-performance, power-efficient interconnect solutions.
- Eliyan is the first to demonstrate compliance with BoW 2.0 in a working chip.
- Eliyan's NuLink PHY addresses memory and IO wall constraints in advanced packaging.
Help us improve and share your feedback! Did you find this helpful?
Benefits
Health Insurance
Paid Vacation
Flexible Work Hours
Growth & Insights and Company News
6 month growth
↑ 0%1 year growth
↓ -2%2 year growth
↑ 2%Eliyan has raised over $100 million for its chiplet interconnect technology, following a $60 million Series B round in March. The new funding from VentureTech Alliance will support the commercialization of Eliyan's Bunch of Wires technology and expand its product line for die-to-die, die-to-memory, and chip-to-chip interconnects. CEO Ramin Farjadrad highlighted the growing demand for their high-performance, power-efficient interconnect solutions in multi-die architectures.
Eliyan (“Eliyan”) Corporation, credited for the invention of the semiconductor industry’s highest-performance and most efficient chiplet interconnect, today announced the closing of its latest funding round, totaling $60 million. The funding was co-led by Samsung Catalyst Fund and Tiger Global Management and includes participation from existing investors, including Intel Capital, as well as SK hynix, Cleveland Avenue and Mesh Ventures, amongst others.
Join Gen AI enterprise leaders in Boston on March 27 for an exclusive night of networking, insights, and conversations surrounding data integrity. Request an invite here. Eliyan has raised $60 million in funding for its chiplet interconnect technology that speeds up the processing for AI chips.Samsung Catalyst Fund and Tiger Global Management both led the round to help the team address the challenges of development of generative AI chips. Driven by demand for AI chips, industry forecasters are calling for robust growth in the high-bandwidth memory (HBM) sector, as much as 331% increase this year, followed by 124% in 2025, according to market researcher Arete Research.Eliyan’s UCIe-, BoW-, or UMI-compliant PHY (dubbed NuLink PHY) addresses memory and IO wall constraints on either advanced or standard packaging material. A PHY is a physical layer of the OSI model. An instantiation of PHY connects a link layer device (often called a MAC) to a physical medium such as an optical fiber or copper cable
Eliyan raises $60M for chiplet interconnects that speed up AI chips.
Chiplet interconnect pioneer Eliyan closes $60 million series B funding round, co-led by Samsung Catalyst Fund and Tiger Global Management to address most pressing challenge in development of generative AI chips.