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Micron Technology

Makes memory and storage chips for AI and PCs

Advanced Package Technology Development PI Staff Engineer

Manufacturing & Process EngineeringConfirmed live in the last 24 hours
Full-timeTaichung City, TaiwanNo salary listedIn-person

About the Job

Requirements

  • At least 5 years of experience in the packaging industry, including at least 3 years in the advanced package field.
  • An MS or Ph.D. in Electrical Engineering, Computer Engineering, Chemistry, Physics, Materials, or a related field.
  • Proven ability to lead technology development to industrial-level achievement.
  • Deep knowledge of advanced package process development.
  • Deep understanding of advanced package architecture, including 2.5D, 3DIC, fan-out, and hybrid bonding.
  • High proficiency using artificial intelligence tools, such as large language models or Claude Code, to enhance development skills and workflow efficiency.
  • Excellent data extraction, analysis, and reporting skills, including system data mining and JMP.
  • Understanding of probe, parametric, backend, and reliability testing.
  • In-depth understanding of process flows, process interactions, and how process changes can affect yield, performance, and reliability.
  • Strong understanding of electronic materials and their physical, chemical, and electrical properties, as well as failure analysis and characterization techniques.
  • Excellent data analysis and interpretation skills.
  • Proven ability to troubleshoot problems and address root causes.
  • Ability to adapt job responsibilities and take initiative to assume added responsibilities.
  • Ability to prioritize multiple and complex tasks effectively.
  • Ability to communicate effectively in English.
  • Ability to work effectively with minimal supervision.

Responsibilities

  • Develop and communicate technology development strategic objectives.
  • Understand the impact and implications of technology development strategy on the overall company strategy and direction.
  • Set strategic and long-term technical objectives aligned with department objectives.
  • Demonstrate understanding of technology complexity and make effective technology decisions.
  • Provide technical leadership that may influence company direction.
  • Represent the Assembly team in cross-team and cross-department leadership within the area of responsibility.
  • Collaborate with peers in other teams and departments to develop and drive cross-functional initiatives.
  • Apply knowledge to achieve quality improvements, cost control, and production efficiency.
  • Ensure accuracy, quality, and timeliness of results.
  • Guide effective utilization of resources to achieve end results.
  • Ensure the team meets critical deliverables, milestones, and goals.
  • Provide input to achieve organizational objectives and align the group to support department objectives.
  • Make decisions that directly affect work-unit and sub-function objectives.
  • Mentor, develop, and motivate leaders.
  • Build new skills through development goals and learning events.
  • Seek cross-functional opportunities, build a network, and gain competency across domains.

About the Company

Micron Technology

Makes memory and storage chips for AI and PCs

Micron Technology designs and manufactures memory and storage chips, mainly DRAM and NAND flash, used in data centers, PCs, phones, cars and industrial equipment. It is one of only three companies that make HBM, the stacked high-bandwidth memory placed beside processors in AI servers, and it is the largest memory chipmaker based in the United States. Unlike chip designers that outsource production, Micron runs its own fabs and assembly sites in the United States and across Asia. It earns money by selling chips, memory modules and solid-state drives to cloud providers, device makers and distributors. Micron was founded in 1978 and is headquartered in Boise, Idaho.

Company size
10,001+
Company stage
IPO
Headquarters
Boise, ID
Founded
1978

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