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Synopsys

EDA software for chip design

Director – Product Sales Solutions - 3DIC

Account ManagementConfirmed live in the last 24 hours
Full-timeTaiwanNo salary listed

About the Job

Requirements

  • At least 15 years of experience in electronic design automation sales, Applications Engineering, or Product Specialist roles, with a strong technical foundation in semiconductor design or advanced packaging technologies.
  • Direct experience in the 3DIC market segment, including knowledge of chiplet integration, heterogeneous die stacking, and advanced packaging workflows.
  • Proven ability to manage enterprise sales engagements and lead long-term technical campaigns involving multiple stakeholders and complex evaluation cycles.
  • A track record of building and maintaining executive and technical relationships across customer organizations.
  • Ability to collaborate effectively with Product Management, research and development, and Applications Engineering, and translate between technical and business priorities.
  • Willingness and ability to travel up to 30% to customer sites, industry events, and internal meetings.
  • Experience navigating complex technical and business situations, aligning stakeholders on solutions, and advancing deals through ambiguity.
  • Ability to manage multiple accounts with overlapping timelines, competing priorities, and different stages of maturity.
  • Ability to challenge customer requests that do not align with product capabilities while preserving relationships and redirecting discussions toward feasible options.

Responsibilities

  • Lead technical sales campaigns for 3DIC solutions across strategic semiconductor accounts in Taiwan, managing complex, multi-quarter engagements from discovery through close.
  • Drive customer discovery and qualification to identify business opportunities, map technical requirements, and align solution fit with customer roadmaps.
  • Develop and execute account engagement strategies aligned with long-term customer design cycles and company revenue objectives.
  • Serve as the primary business and sales focal point for 3DIC opportunities, coordinating sales teams, Applications Engineering, Product Management, and research and development to deliver cohesive customer engagements.
  • Build and maintain executive and technical relationships across customer organizations, including engineering leadership, architecture teams, and business stakeholders.
  • Identify, prioritize, and expand opportunities within strategic accounts to grow adoption of 3DIC solutions and drive business expansion.
  • Track campaign progress, customer success criteria, and business outcomes in customer relationship management systems, providing accurate forecasts and executive-level visibility on key engagements.
  • Channel market requirements, competitive intelligence, and customer feedback to Product Management and research and development teams to influence product roadmaps.
  • Provide Applications Engineering teams with business context, customer priorities, and campaign strategy to support effective technical engagements.
  • Provide leadership with actionable intelligence on pipeline health, customer sentiment, and market dynamics in the 3DIC space.
  • Identify new use cases, stakeholders, and design programs within accounts where 3DIC solutions can expand adoption.

About the Company

Synopsys

EDA software for chip design

Synopsys provides software tools and services for electronic design automation (EDA), helping engineers design, simulate, verify, and optimize semiconductor chips and systems. Its products cover the full design flow, including RTL-to-gating synthesis, place-and-route, timing analysis, verification, and silicon validation, as well as software integrity solutions and hardware-assisted verification. Engineers use these tools to model, simulate, and validate complex chip designs before manufacturing, reducing bugs and improving performance. Compared with many competitors, Synopsys differentiates itself through its broad, end-to-end design toolchain, large ecosystem of IP and integration with simulation and modeling capabilities gained from its 2025 merger with ANSYS, and its global scale and support. The company aims to help designers push the boundaries of chip and system performance, accelerate time-to-market, and enable silicon-to-systems design across a wide range of industries.

Company size
10,001+
Company stage
IPO
Headquarters
Sunnyvale, CA
Founded
1986

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