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Renesas Electronics

Automotive-focused MCUs, SoCs, analog devices

Equipment Technician

Equipment MaintenancePosted on Nov 12
Full-timeBayan Lepas, Penang, MalaysiaNo salary listedIn-person

About the Job

Requirements

  • A diploma in Mechatronics, Electrical, Electronic, or a related Engineering discipline, with at least 3 years of equipment experience.
  • Strong knowledge of Smart Power Stage (SPS) package assembly, equipment functions, and process flow.
  • Hands-on experience with Cu wire bonding equipment, including setup, troubleshooting, and preventive maintenance; experience with SHINKAWA models is preferred.
  • Hands-on experience with die attach and solder printing equipment; experience with CANON, 3S, or ASMPT models is preferred.
  • Troubleshooting, parameter adjustment, root-cause analysis, safety, SOP, and shift-support skills.

Responsibilities

  • Perform preventive maintenance, diagnose equipment failures, and safely and efficiently restore SHINKAWA wire bonders, CANON die attach machines, and 3S or ASMPT solder printers.
  • Support machine setup, changeover, alarm recovery, parameter verification, process trials, and production ramp-up while maintaining equipment and process specifications.
  • Follow safety and SOP requirements, maintain accurate equipment records, perform root-cause analysis, manage critical spare readiness, and support continuous improvement actions.
  • Work with engineers on process and equipment improvements.

Desired Qualifications

  • Experience with SHINKAWA models of Cu wire bonding equipment.
  • Experience with CANON, 3S, or ASMPT models of die attach and solder printing equipment.

About the Company

Renesas Electronics

Automotive-focused MCUs, SoCs, analog devices

Renesas manufactures and sells MCUs, SoCs, and analog/power semiconductor devices to OEMs, focusing on automotive, industrial, infrastructure, and IoT markets. Its chips are building blocks that run embedded software and manage power and signals, and its Winning Combinations offer pre-tested system architectures to speed up design. It differentiates itself by growing through acquisitions to offer a broad, integrated portfolio and by moving toward a unified digital design platform to reduce integration work. Its goal is to become a leading supplier of these components and provide a single platform for electronics design that speeds time-to-market.

Company size
10,001+
Company stage
IPO
Headquarters
Tokyo, Japan
Founded
2002

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