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ASM International

Semiconductor deposition equipment and ALD tech

Senior Process Engineer - Defectivity

Process EngineeringConfirmed live in the last 24 hours
Full-timeSingaporeNo salary listedIn-person

About the Job

Requirements

  • A Master's degree or PhD in Materials Science, Physics, Chemical Engineering, Mechanical Engineering, Semiconductor Engineering, or a related technical discipline.
  • At least 8 years of semiconductor industry experience in process engineering, defectivity engineering, yield engineering, integration engineering, or a related field.
  • Strong experience supporting semiconductor manufacturing, front-end wafer processing equipment, or advanced process technologies.
  • Deep understanding of defect generation mechanisms within semiconductor manufacturing environments.
  • Expertise in contamination control, particle reduction, and defect prevention methodologies.
  • Proficiency in design of experiments (DOE) and statistical data analysis.
  • Experience utilizing defect inspection, metrology, characterization, and failure analysis techniques.
  • Ability to translate process and defect data into actionable root-cause conclusions and sustainable engineering solutions.

Responsibilities

  • Lead investigations into defectivity issues affecting front-end wafer processing equipment and manufacturing processes.
  • Identify and resolve equipment-induced, process-induced, handling-induced, and material-induced defect mechanisms.
  • Analyze defect signatures using defect maps, spatial distributions, wafer trends, process data, and manufacturing performance metrics.
  • Apply structured problem-solving methodologies including design of experiments, statistical analysis, failure analysis, and root-cause investigation techniques.
  • Drive corrective and preventive actions and validate long-term effectiveness through data-driven verification.
  • Investigate contamination, particle generation, material interactions, mechanical sources, environmental influences, and wafer handling-related defects.
  • Develop a deep understanding of defect generation mechanisms throughout wafer movement, process execution, metrology, inspection, and automation systems.
  • Partner with engineering teams to improve defect performance, process robustness, equipment reliability, and manufacturability.
  • Utilize advanced defect characterization and analytical techniques to determine defect origin, composition, transport mechanisms, and generation pathways.
  • Establish defectivity reduction roadmaps and support technology development, qualification, and continuous improvement initiatives.
  • Collaborate with process, hardware, software, manufacturing, supplier quality, and customer-facing teams to solve complex technical challenges.
  • Present technical findings and recommendations to senior stakeholders and support knowledge sharing across engineering organizations.

Desired Qualifications

  • Experience working with semiconductor equipment manufacturers or leading semiconductor fabrication facilities.
  • Experience supporting wafer handling systems, process equipment, metrology, inspection, automation, or integrated manufacturing platforms.
  • Knowledge of advanced logic, DRAM, NAND, or emerging semiconductor device technologies.
  • Experience in equipment qualification, process qualification, supplier quality, or manufacturing readiness programs.
  • Familiarity with machine learning, advanced analytics, or artificial intelligence-enabled approaches for defectivity analysis.
  • Experience mentoring engineers and leading complex cross-functional technical initiatives.
  • Demonstrated success in delivering measurable defectivity reduction and yield improvement outcomes.

About the Company

ASM International

Semiconductor deposition equipment and ALD tech

ASM International designs and supplies equipment and technologies for semiconductor fabrication, focusing on thin-film deposition processes such as chemical vapor deposition (CVD) and atomic layer deposition (ALD). Its products are used in making microchips by depositing ultra-thin material layers with precise control at the atomic level, enabling smaller and more powerful devices. The company built a global footprint through operations in the Netherlands, the US, Hong Kong, and Japan, and separated ASML Lithography (a joint venture with Philips) to focus on deposition while ASML develops photolithography systems. In recent years, ASM has sharpened its strategy around ALD, a process that creates uniformly thin layers one atomic layer at a time, allowing continued scaling of semiconductor devices. The goal is to be a core supplier of deposition technology and tools that enable chip manufacturers to produce smaller, faster, and more energy-efficient semiconductors.

Company size
1,001-5,000
Company stage
IPO
Headquarters
Almere, Netherlands
Founded
1968

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