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Omni Design Technologies

Licenses high-performance IP cores for SoCs

Head of Asia Sales and Business Development

Business Development & PartnershipsConfirmed live in the last 24 hours
Full-timeTaipei City, TaiwanNo salary listedHybrid

About the Job

Requirements

  • A bachelor's degree in business, Marketing, Engineering, or a related field.
  • At least 10 years of experience in sales and business development, with a proven track record in the semiconductor or related technology industry.
  • A strong understanding of semiconductor IP products and market dynamics.
  • Strong leadership and team management skills.
  • The ability to travel as required, including extensively across the region.
  • A strong network within the semiconductor industry in Asia.

Responsibilities

  • Develop and implement sales strategies to achieve revenue targets, and lead the sales team in identifying, pursuing, and closing high-value deals.
  • Identify new business opportunities in the semiconductor IP market, and develop strategic partnerships and alliances to expand market reach and enhance product offerings.
  • Build and maintain strong customer and partner relationships, understand customer needs, and deliver tailored solutions.
  • Conduct market research to identify trends, challenges, and opportunities in the semiconductor IP industry, and provide insights for product development and innovation.
  • Lead, mentor, and grow the sales and business development team, and foster a culture of excellence and accountability.
  • Collaborate with the executive team on budgeting, forecasting, and resource allocation.
  • Provide regular reports on sales performance, market trends, and business growth strategies to the executive team and board of directors.

Desired Qualifications

  • Fluency in English and Mandarin.

About the Company

Omni Design Technologies

Licenses high-performance IP cores for SoCs

Omni Design Technologies delivers high-performance, ultra-low power IP cores for mixed-signal SoCs that power devices across 5G, LiDAR, automotive networks, AI, image sensing, and IoT. It develops and validates IP blocks and licenses them to chip makers, offering customization and support to ensure seamless integration into customer designs. The cores are designed to work on FinFET processes down to 28nm, with proven silicon such as gigasample low-power ADCs and DACs on TSMC 28nm. The company differentiates itself through validated, silicon-proven IP, deep collaboration with customers and partners (e.g., LeddarTech, MegaChips), and a global design footprint (new Fort Collins design center). Its goal is to enable customers to build sophisticated, power-efficient, mixed-signal SoCs quickly by providing ready-to-license IP plus engineering services that fit their specific needs.

Company size
51-200
Company stage
Series A
Total funding
$35M
Headquarters
Milpitas, CA
Founded
2015

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