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Renesas Electronics

Automotive-focused MCUs, SoCs, analog devices

Graduate Process Engineer

Manufacturing EngineeringConfirmed live in the last 24 hours
Full-timeBayan Lepas, Penang, MalaysiaNo salary listedIn-person

About the Job

Requirements

  • A bachelor's degree in Engineering, with Materials, Mechanical, or a related field accepted.
  • At least 2 years of experience in semiconductor back-end assembly.
  • Strong knowledge of die bonding and wire bonding processes.
  • Familiarity with back-end materials such as leadframes, substrates, adhesives, and bonding wires.
  • Good problem-solving, communication, and teamwork skills.

Responsibilities

  • Develop, optimize, and sustain die bond and wire bond processes to meet quality, yield, and reliability requirements.
  • Troubleshoot processes and perform root cause analysis for yield loss, defects, and equipment issues.
  • Support new product introduction, process qualification, and transfer to mass production.
  • Establish and maintain process parameters, work instructions, and control plans.
  • Analyze process data using statistical methods such as statistical process control, process capability indices, and trend analysis.
  • Collaborate with Production, Quality, Equipment, and R&D teams.
  • Drive continuous improvement in cost, yield, cycle time, and reliability.

Desired Qualifications

  • Experience with process characterization, design of experiments, and data analysis.
  • Experience with QFN or similar packages.
  • Knowledge of yield improvement, reliability testing, and failure analysis.
  • Exposure to automation, equipment setup, and process optimization.

About the Company

Renesas Electronics

Automotive-focused MCUs, SoCs, analog devices

Renesas manufactures and sells MCUs, SoCs, and analog/power semiconductor devices to OEMs, focusing on automotive, industrial, infrastructure, and IoT markets. Its chips are building blocks that run embedded software and manage power and signals, and its Winning Combinations offer pre-tested system architectures to speed up design. It differentiates itself by growing through acquisitions to offer a broad, integrated portfolio and by moving toward a unified digital design platform to reduce integration work. Its goal is to become a leading supplier of these components and provide a single platform for electronics design that speeds time-to-market.

Company size
10,001+
Company stage
IPO
Headquarters
Tokyo, Japan
Founded
2002

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