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Micron Technology

Makes memory and storage chips for AI and PCs

Principal Foundry Interface Design Engineer - HBM

Silicon & ASIC DesignConfirmed live in the last 24 hours
Full-timeIn-person

About the Job

Requirements

  • A BS, MS, or PhD in Electrical Engineering, Computer Engineering, or a related field, or equivalent experience.
  • At least 6 years of semiconductor industry experience and a solid understanding of advanced semiconductor technology development.
  • A strong grasp of advanced CMOS technology nodes, FinFET devices, and process integration.
  • Hands-on experience with HSPICE simulations, device characterization, standard cell benchmarking, PPA analysis, parasitic extraction, and physical verification.
  • Experience driving AI-enabled engineering practices and automation to improve the efficiency of DTCO analysis, foundry collateral evaluation, PDK enablement, benchmarking, and collaboration across build teams.

Responsibilities

  • Act as the primary technical interface between foundry partners and Micron design organizations.
  • Drive closure of design-process gaps through collaborative engagement with foundry process teams.
  • Influence foundry roadmaps related to TSV, BEOL, reliability, and design enablement.
  • Define technology requirements for future HBM and custom memory products.
  • Perform HSPICE simulations for technology evaluation and design optimization.
  • Evaluate compact models, PDK SPICE models, and process corners.
  • Conduct pre-layout and post-layout circuit analysis.
  • Support BEOL optimization and routing studies through simulation.
  • Develop methodologies for evaluating design sensitivity to process variations.
  • Plan and implement technology evaluation test chips.
  • Define process monitor structures and benchmark vehicles.
  • Analyze post-silicon data and correlate results with simulations.
  • Collaborate with product engineering and foundry/Fab teams on silicon learning and technology qualification.
  • Evaluate foundry PDKs and IP collateral.
  • Support design teams by providing technology guidelines and best-known methods.
  • Drive creation of design recommendations, analog guidelines, and digital PPA evaluation methodologies.
  • Collaborate with CAD teams on flow enablement and validation.
  • Identify and implement AI-enabled workflows, automation opportunities, and knowledge-management practices to improve engineering productivity, decision quality, and execution efficiency across DTCO, foundry interface, PDK evaluation, and design enablement activities.

Desired Qualifications

  • Experience working directly with leading foundries such as TSMC, Samsung, Intel Foundry Services, or GlobalFoundries.
  • Experience with memory products including DRAM, HBM, or SRAM.
  • Knowledge of TSV technologies, advanced packaging, reliability modeling and aging simulations, advanced BEOL technologies, and PDK development and validation.
  • Ability to apply AI tools to summarize, analyze, and extract insights from PDK documentation, Design Rule Manuals (DRMs), reliability reports, foundry collateral, and silicon characterization data.
  • Experience leading technology pathfinding and node selection activities.

About the Company

Micron Technology

Makes memory and storage chips for AI and PCs

Micron Technology designs and manufactures memory and storage chips, mainly DRAM and NAND flash, used in data centers, PCs, phones, cars and industrial equipment. It is one of only three companies that make HBM, the stacked high-bandwidth memory placed beside processors in AI servers, and it is the largest memory chipmaker based in the United States. Unlike chip designers that outsource production, Micron runs its own fabs and assembly sites in the United States and across Asia. It earns money by selling chips, memory modules and solid-state drives to cloud providers, device makers and distributors. Micron was founded in 1978 and is headquartered in Boise, Idaho.

Company size
10,001+
Company stage
IPO
Headquarters
Boise, ID
Founded
1978

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