Overview

Keysight is at the forefront of technology innovation, delivering breakthroughs and trusted insights in electronic design, simulation, prototyping, test, manufacturing, and optimization. Our ~16,800 employees create world-class solutions in communications, 5G, automotive, energy, quantum, aerospace, defense, and semiconductor markets for customers in over 100 countries. Learn more about what we do.

Our award-winningculture embraces a bold vision of where technology can take us and a passion for tackling challenging problems with industry-first solutions. We believe that when people feel a sense of belonging, they can be more creative, innovative, and thrive at all points in their careers.

Responsibilities

Reliability Engineer – Advanced Package, Heterogenous Integration, Interposer Technologies

Join a team at the forefront of semiconductor innovation, enabling the breakthrough technologies that differentiate Keysight's industry-leading design enablement solutions. As a Reliability Engineer, you will work hands-on with some of the world's most high-performance interconnect technologies that power next-generation RF, microwave, millimeter-wave, and high-speed digital products.

In this role, you will play a critical part in ensuring that cutting-edge technologies meet the demanding performance, quality, and lifetime expectations of Keysight customers. You will collaborate closely with device engineers, process technologists, product designers, and manufacturing teams to evaluate, qualify, and continuously improve the technologies that form the foundation of Keysight's product leadership. If you are excited by advanced semiconductor technology, data-driven problem solving, and the challenge of ensuring reliability in products operating at the leading edge of performance, this role offers an opportunity to make a visible and lasting impact.

What You'll Do

Design, develop, and execute reliability qualification strategies for advanced packaging, heterogeneous integration, interposer technologies, and high-performance interconnect solutions.
Evaluate emerging packaging and integration technologies, ensuring they meet the stringent reliability requirements of high-performance Test & Measurement applications.
Investigate package- and interconnect-level degradation mechanisms and develop qualification methodologies that accurately predict field performance and lifetime.
Apply advanced statistical and data analysis techniques to identify reliability risks, understand failure mechanisms, and guide technology development decisions.
Build and expand package reliability characterization infrastructure, enabling rapid assessment of new technologies while supporting future growth in capability and test capacity.
Partner with technology development, product engineering, manufacturing, and supply-chain teams to translate reliability data into action that drives product success.
Communicate results to technical and business stakeholders, influencing technology roadmaps and qualification decisions.

Qualifications

We're looking for a highly motivated engineer or scientist who is excited by the challenge of developing and qualifying the advanced packaging and integration technologies that power Keysight's industry-leading measurement solutions.

This role is ideal for candidates with expertise in advanced packaging, interposer, and interconnect reliability, and a passion for understanding how complex heterogeneous systems perform over long operating lifetimes.

Required Qualifications

This role requires a combination of practical hands-on experience, academic rigor, and analytical skills.

B.S. in Electrical Engineering, Materials Science, Mechanical Engineering, Chemical Engineering, Physics, or a related technical field (or equivalent industry experience).

Candidates must have proven experience in the following areas:

Experience with advanced packaging, interposer, and heterogeneous integration technologies.
Understanding of the physical mechanisms that influence long-term package and interconnect reliability.
Experience developing and executing package reliability qualification plans and accelerated stress methodologies.
Knowledge of degradation mechanisms including: thermomechanical fatigue, intermetallic compound growth, electromigration, stress migration, CTE mismatch-induced failures, delamination, moisture-induced failures, wire bond and flip-chip degradation, TSV, micro-bump, hybrid bond, and interposer failure mechanisms
Experience with environmental and mechanical reliability testing such as: temperature cycling, thermal shock, highly accelerated stress testing (HAST) temperature-humidity-bias (THB), power cycling, mechanical shock and vibration
Familiarity with reliability modeling methods used for package and interconnect lifetime prediction.
Strong background in probability, statistics, and data analysis, with the ability to extract insights from complex reliability datasets.
Excellent analytical and problem-solving skills, including root-cause investigation and failure mechanism identification.
Effective communication and interpersonal skills, enabling productive collaboration across multidisciplinary engineering teams and external suppliers.
A high level of ownership, accountability, initiative, and self-motivation, with a proactive approach to driving technical outcomes.

Preferred Qualifications

Knowledge of high-frequency packaging and interconnect technologies used in RF, microwave, and millimeter-wave products.
Experience with finite element analysis (FEA), thermomechanical modeling, or reliability simulation tools.
Familiarity with materials used in advanced packaging, including underfills, molding compounds, die attach materials, substrates, and interconnect metallurgies.
Hands-on experience applying Statistical Process Control (SPC) and Design of Experiments (DOE) methodologies.
Experience with package failure analysis techniques including cross-sectioning, SAM, SEM, FIB, dye-and-pry, X-ray, and related methods.

What Sets Exceptional Candidates Apart

Deep expertise in advanced package, interposer, and interconnect reliability.
The ability to connect materials science, mechanical behavior, reliability physics, and statistical analysis to solve complex engineering problems.
Experience qualifying emerging heterogeneous integration technologies.
Curiosity and enthusiasm for working on technologies operating at the forefront of RF, microwave, millimeter-wave, and advanced package integration performance.
A passion for understanding how advanced packages and interconnect architectures work and why they fail.
A desire to influence the qualification and deployment of the technologies that directly enable Keysight's next generation of differentiated products.

This role is ideal for engineers who enjoy combining deep technical analysis, cutting-edge packaging technologies, and data-driven decision making to ensure the long-term success of breakthrough products. You will have the opportunity to evaluate the reliability of technologies that directly contribute to Keysight's product differentiation and performance leadership in the Test & Measurement industry.

Careers Privacy Statement***Keysight is an Equal Opportunity Employer.***

Qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, protected veteran status, disability or any other protected categories under all applicable laws.

The level of role will be based on applicable experience, education and skills; Most offers will be between the minimum and the midpoint of the Salary Range listed below.

Santa Rosa, CA MIN $138,960.00- MID $185,280.00- MAX $231,600.00

Note: For other locations, pay ranges will vary by region

This role is eligible for Keysight Results Bonus Program

US Employees may be eligible for the following benefits:

Medical, dental and vision
Health Savings Account
Health Care and Dependent Care Flexible Spending Accounts
Life, Accident, Disability insurance
Business Travel Accident and Business Travel Health
401(k) Plan
Flexible Time Off, Paid Holidays
Paid Family Leave
Discounts, Perks
Tuition Reimbursement
Adoption Assistance
ESPP (Employee Stock Purchase Plan)

#LI-MED1

About the company

Keysight Technologies sells test and measurement hardware and software for electronics design and deployment. Its products combine precise instruments with software to measure, analyze, and validate designs, supporting work from prototyping to production in areas like electronic design, e-mobility, network monitoring, and 5G. The company differentiates itself with a wide range of industry-grade instruments, integrated software for end-to-end test workflows, and ongoing services and support, including involvement in 6G development. Its goal is to help customers digitalize and speed up the design, testing, and deployment of electrical and telecommunications technologies.

Company Size

10,001+

Company Stage

IPO

Headquarters

Santa Rosa, California

Founded

1939

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Simplify's Take

What believers are saying

Q3 2026 orders rose 56% to $2.09 billion, signaling broad demand.
Fiscal Q4 2026 guidance implies 37% revenue growth at the midpoint.
September 2026 India and York partnerships expand semiconductor, automotive, and AI validation demand.

What critics are saying

Supply shortages will constrain revenue conversion for several quarters, management warned August 18, 2026.
Keysight faces Centripetal appeals litigation and a July 2, 2026 tax refund fight.
A 51x trailing P/E leaves Keysight vulnerable if AI, 6G, or semiconductor spending stalls.

What makes Keysight Technologies unique

Keysight absorbed Spirent on June 1, 2026, pairing test gear with PNT emulation.
September 24, 2026 UC Berkeley collaboration ties Keysight directly to 6G OTA research.
Keysight's software and services reached 33% of Q3 2026 revenue, deepening recurring exposure.

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Benefits

Health Insurance
Dental Insurance
Vision Insurance
Health Savings Account/Flexible Spending Account
Life Insurance
Disability Insurance
401(k) Retirement Plan
Flexible Time Off
Paid Holidays
Paid Family Leave
Tuition Reimbursement
Employee Stock Purchase Plan

Company News

The New Arab

Oct 19th, 2026

UK defence bosses' homes targeted by pro-Palestinian group.

UK defence bosses' homes targeted by pro-Palestinian group. UK police are investigating vandalism claims by pro-Palestinian group The List targeting homes linked to Leonardo, Ultra and Keysight executives. 19 October, 2026 Police Scotland confirmed officers were called on 11 October to a "report of vandalism to a property and cars" in Dunfermline [getty] UK police said they were probing vandalism incidents after a pro-Palestinian group appeared to claim attacks on properties belonging to executives and employees at defence industry firms. The group, called "The List", claimed on a website to have carried out three attacks in recent weeks, including one on the home of someone they said was a "key engineer" at defence contractor Leonardo. "We are aware of an incident which targeted the property of a Leonardo employee last weekend," a company spokesperson said in a statement sent to AFP on Monday. "We are also assisting Counter Terrorism Police with their ongoing investigation into this incident," they added. Police Scotland confirmed officers were called on 11 October to a "report of vandalism to a property and cars" in Dunfermline, north of Edinburgh, where Leonardo has a site. A video on the group's website appears to show someone tagging vehicles and a building wall with red paint. The Sunday Times reported that The List had targeted three locations, including in Hampshire in southern England, where they reportedly slashed the tyres of a car belonging to an executive at Ultra Intelligence & Communications. The List claimed on its website that it targeted Ultra's chief operating officer, whom it accused of working with Israeli arms company Elbit. "We were called on Saturday, October 10, to a report of a criminal damage incident in Fleet," Hampshire police said in a statement quoted by the Times. "It was reported that red paint had been thrown across the front of the house and two car tyres had been damaged," the police force added. The group also said it targeted the home of Keysight's director of technology manufacturing. The Palestine Action group was proscribed as a "terrorist" organisation by the UK government last year after a series of attacks targeting defence companies, including Elbit and Leonardo. On its website, The List said it "escalated our actions against the home addresses of some of the most highly complicit companies in the ongoing genocide of our brothers and sisters in Palestine." "Our list of complicit actors remains long, compiled through leaks, hacking and whistleblowers. If you work with Elbit, expect us," the group added.

Yahoo Finance

Oct 14th, 2026

Keysight launches 16-channel system to validate 1.6T copper and optical interconnects

Keysight Technologies (NYSE: KEYS) has launched FITS-16CH, a system that validates digital-layer error performance in optical and copper interconnects. It has 16 transmit and 16 receive channels, twice the density of the FITS-8CH. The platform combines bit error ratio and forward error correction measurements to show how complete interconnect assemblies perform in real-world conditions. It supports 106G and 212G lane rates for 800G interconnects and emerging 1.6T technologies. An automated tuning tool can cut transmit tuning from hours, days, or weeks to a few minutes. The system works with Keysight analyzers, bit error ratio testers, and oscilloscopes. Credo Technologies' Ameet Suri said the tool lets the company test active electrical cables at system level during development and qualification.

Compound Semiconductor

Oct 14th, 2026

Simplifying device testing from DC to 250GHz.

Simplifying device testing from DC to 250GHz. Wednesday 14th October 2026 Keysight, Glasgow University, NPL and MPI develop single-sweep method for continuous on-wafer InP HEMT characterisation Keysight Technologies has collaborated with the University of Glasgow, the National Physical Laboratory (NPL), and MPI to develop a new approach to broadband characterisation of next-generation sub-terahertz (sub-THz) semiconductor devices. Together, the organisations demonstrated continuous on-wafer characterisation of InP HEMTs from near DC to 250 GHz in a single sweep, simplifying broadband measurements for advanced semiconductor research and design. As semiconductor technologies move into mmWave and sub-terahertz frequencies for next-generation applications, engineers need to accurately characterise transistor performance across increasingly broad frequency ranges. Conventional approaches can require multiple measurement setups and calibrations, adding complexity and making it more difficult to obtain consistent data for broadband device modeling. The four organisations combined Keysight instrumentation, University of Glasgow semiconductor devices, MPI Corporation on-wafer probing technology, and NPL metrology expertise to create the broadband measurement solution. The Keysight tools included the PNA-X Vector network analyser; the Single-Sweep 250 GHz frequency extender; and its Precision Source/Measure Unit (SMU). Together, these technologies enabled continuous measurement from near DC to 250 GHz with a single probe touchdown, eliminating the need for multiple setup changes and providing consistent broadband S-parameter measurements. Built-in source filtering and broadband source power calibration also helped ensure signal purity of the applied mmWave signal at the probe-tip. Thierry Locquette, VP of sales, Europe, Middle East & Africa at Keysight said: "Characterising devices continuously from near DC to 250 GHz in a single sweep can significantly simplify the measurement process for researchers developing next-generation semiconductor technologies. By bringing together expertise in instrumentation, devices, probing, and metrology, this collaboration demonstrates a practical approach to generating the consistent broadband data engineers need to accelerate device development." Xiaobang Shang, principal scientist and On-wafer Measurement Lead at NPL, said: "Accurate on-wafer measurement is essential for developing reliable semiconductor devices, particularly as technologies move further into the millimetre-wave and sub-terahertz frequency ranges. We were pleased to contribute NPL's high-frequency on-wafer metrology and calibration expertise to this collaboration, helping demonstrate a practical route to consistent broadband device measurements using the state-of-the-art single sweep system." Matthew White, director of Business Development at MPI, said: "Extending on-wafer characterisation to 250 GHz requires the probing, calibration, and measurement platform operating as one seamlessly integrated system. This collaboration demonstrates a practical approach to achieving consistent broadband measurements from near DC to 250 GHz with a single probe touchdown, helping researchers simplify characterisation and accelerate device development with great confidence." SPONSOR MESSAGE Unifying software and semiconductor development. Software-defined workflows are reshaping the way smart, connected products are designed. The merging of software functionality and hardware intricacies is pushing traditional workflows beyond their capabilities, leaving teams at a developmental crossroads. With this fundamental shift comes the critical need for end-to-end traceability and robust collaboration tools that easily integrate into existing workflows to unify hardware and software development. In this new software-defined era, how can companies break down the silos that have historically defined software and silicon development workflows?

MarketScreener

Oct 13th, 2026

Keysight Technologies, Inc. announces two new 1.6T Ethernet test platforms SERT 1600ge and AresONE Plus 1600ge.

Keysight Technologies, Inc. announces two new 1.6T Ethernet test platforms SERT 1600ge and AresONE Plus 1600ge. Published on 10/13/2026 at 02:20 pm EDT S&P Capital IQ Keysight Technologies, Inc. announced two new 1.6T Ethernet test platforms, Switch and Edge Router Tester (SERT) 1600GE and AresONE Plus 1600GE, designed to help customers validate next-generation AI data center and hyperscale networking infrastructure. AresONE Plus 1600GE sets a new benchmark by delivering eight 1.6T Ethernet ports in a single 2U appliance while providing stateful, realistic AI workload generation with mix-of-experts emulation. SERT 1600GE targets data center switch fabric and edge router validation, while AresONE Plus 1600GE adds AI workload emulation and high-density switch fabric testing. The combined platforms provide a consistent test foundation for device qualification, routing, and AI fabric validation. They also enable performance, interoperability, and control-plane evaluation as networks scale. AresONE Plus 1600GE packs eight OSFP1600 ports into a single 2U chassis, delivering 12.8T of line-rate traffic at 64 bytes. It supports 1600GE PAM4 signaling over 224G SerDes with backward compatibility to 112G, plus flexible port breakout of 1x1600GE, 2x800GE, 4x400GE, or 8x200GE. SERT 1600GE is available in eight-port 2U configuration for switch fabric scale testing. In common with the AresONE Plus 1600GE platform, it is capable of being time synchronized using Precision Time Protocol (PTP), for larger topologies, offering flexibility to scale test environments as network configurations grow. Both platforms support Border Gateway Protocol (BGP), Equal-Cost Multipath (ECMP), Virtual Extensible LAN (VXLAN), and SONiC validation across routing, bridging, and access use cases. AresONE Plus 1600GE also provides core routing scale for control-plane testing. AresONE Plus 1600GE integrates with Keysight AI Data Center Builder software for mix-of-experts emulation, RoCEv2, Priority Flow Control (PFC), Explicit Congestion Notification (ECN), and Ultra Ethernet Consortium (UEC) support. These capabilities let customers exercise both network protocols and AI traffic behavior in the same validation environment to identify performance and congestion issues before deployment. Both platforms support DAC, ACC, AEC, AOC, and coherent optics in both IHS and RHS form factors. AresONE Plus 1600GE can dynamically switch between an eight-port mode for data center switch qualification and a four-port mode for AI benchmarking on the same chassis, helping teams use one appliance across multiple test scenarios and gain more value from their test infrastructure. Through collaboration with NVIDIA, Keysight AresONE Plus 1600GE provides the high-performance validation platform needed to stress these capabilities with 1.6T/800GE traffic throughput, 224G SerDes, routing-scale validation, and realistic AI workload emulation, enabling rigorous performance and congestion testing before deployment. Keysight is showcasing the new platforms at Open Compute Project (OCP) Global Summit booth #C83 in San Jose Convention Center, October 12-15. (C) S&P Capital IQ - 2026

MarketScreener

Oct 13th, 2026

Keysight expands 1.6T Ethernet validation across edge routing, high-density switching, and AI workload emulation.

Keysight expands 1.6T Ethernet validation across edge routing, high-density switching, and AI workload emulation. New platforms help accelerate performance validation for AI and data center infrastructure under realistic conditions before production or deployment Published on 10/13/2026 at 11:01 am EDT Business Wire Keysight Technologies, Inc. (NYSE: KEYS) today announced two new 1.6T Ethernet test platforms, Switch and Edge Router Tester (SERT) 1600GE and AresONE Plus 1600GE, designed to help customers validate next-generation AI data center and hyperscale networking infrastructure. AresONE Plus 1600GE sets a new benchmark by delivering eight 1.6T Ethernet ports in a single 2U appliance while providing stateful, realistic AI workload generation with mix-of-experts emulation. Keysight's SERT 1600GE enables 1.6T Ethernet validation for data center switches and edge routers. SERT 1600GE targets data center switch fabric and edge router validation, while AresONE Plus 1600GE adds AI workload emulation and high-density switch fabric testing. The combined platforms provide a consistent test foundation for device qualification, routing, and AI fabric validation. They also enable performance, interoperability, and control-plane evaluation as networks scale. Key capabilities include: * AresONE Plus 1600GE for testing high-density switching: Packs eight OSFP1600 ports into a single 2U chassis, delivering 12.8T of line-rate traffic at 64 bytes. It supports 1600GE PAM4 signaling over 224G SerDes with backward compatibility to 112G, plus flexible port breakout of 1x1600GE, 2x800GE, 4x400GE, or 8x200GE. * SERT 1600GE for switch and edge router validation: Available in eight-port 2U configuration for switch fabric scale testing. In common with the AresONE Plus 1600GE platform, it is capable of being time synchronized using Precision Time Protocol (PTP), for larger topologies, offering flexibility to scale test environments as network configurations grow. * Protocol and control-plane validation: Both platforms support Border Gateway Protocol (BGP), Equal-Cost Multipath (ECMP), Virtual Extensible LAN (VXLAN), and SONiC validation across routing, bridging, and access use cases. AresONE Plus 1600GE also provides core routing scale for control-plane testing. * AI workload emulation: AresONE Plus 1600GE integrates with Keysight AI Data Center Builder software for mix-of-experts emulation, RoCEv2, Priority Flow Control (PFC), Explicit Congestion Notification (ECN), and Ultra Ethernet Consortium (UEC) support. These capabilities let customers exercise both network protocols and AI traffic behavior in the same validation environment to identify performance and congestion issues before deployment. * Optics and test flexibility: Both platforms support DAC, ACC, AEC, AOC, and coherent optics in both IHS and RHS form factors. AresONE Plus 1600GE can dynamically switch between an eight-port mode for data center switch qualification and a four-port mode for AI benchmarking on the same chassis, helping teams use one appliance across multiple test scenarios and gain more value from their test infrastructure. NVIDIA Spectrum-6 Ethernet Switch is setting the foundation for next-generation AI Ethernet fabrics with unprecedented bandwidth, scale, and AI-optimized networking. Through collaboration with NVIDIA, Keysight AresONE Plus 1600GE provides the high-performance validation platform needed to stress these capabilities with 1.6T/800GE traffic throughput, 224G SerDes, routing-scale validation, and realistic AI workload emulation, enabling rigorous performance and congestion testing before deployment. Gilad Shainer, Senior Vice President of Networking, NVIDIA, said: "AI factories require an Ethernet fabric designed for accelerated computing, and NVIDIA Spectrum-X provides the performance, predictability and control needed to keep large-scale AI workloads running efficiently. Keysight's validation capabilities help engineering teams emulate realistic AI traffic and test Spectrum-X-based fabrics before deployment, reducing time to market." Ram Periakaruppan, Vice President and General Manager, Network Test & Security Solutions, Keysight, said: "The AI era breaks the rules for hyperscale infrastructure. We have moved beyond fault-tolerant commodity scaling to highly synchronized, specialized AI clusters where every packet, link, node, and nanosecond counts. As engineering teams and operators race to upgrade AI infrastructure to 1.6T Ethernet, they need to emulate the broader AI system throughout the development process - from early design and device qualification to system-level validation and AI rack deployment. These new platforms give our customers the flexibility to test at scale while using the same test foundation across the entire design-to-deployment continuum." Keysight is showcasing the new platforms at Open Compute Project (OCP) Global Summit booth #C83 in San Jose Convention Center, October 12-15. * Product Page: SERT 1600GE * Data Sheet: SERT 1600GE * Product Page: AresONE Plus 1600GE * Data Sheet: AresONE Plus 1600GE * Product Page: Keysight AI Data Center Builder About Keysight Technologies Keysight (NYSE: KEYS) serves technology innovators as a mission-critical design enablement partner for the world's most complex engineering challenges. By connecting market-leading design, emulation, and test solutions across the full life cycle, Keysight helps engineering teams accelerate innovation, reduce risk, and bring new technologies to market faster. Customers across AI infrastructure, communications, industrial automation, aerospace and defense, automotive, semiconductor, and general electronics rely on Keysight to bridge virtual design and physical reality, enabling confident decisions earlier. Learn more at www.keysight.com. View source version on businesswire.com: https://www.businesswire.com/news/home/20261013556282/en/ (C) Business Wire - 2026

Keysight Technologies

Reliability Engineer - Multiple Teams

About the job

About the company

Get referred to Keysight Technologies

Simplify's Take

What believers are saying

What critics are saying

What makes Keysight Technologies unique

Benefits

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