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Micron Technology

Makes memory and storage chips for AI and PCs

OMT Dry Etch Member of Technical Staff

Process EngineeringConfirmed live in the last 24 hours
Full-timeTaichung City, TaiwanNo salary listed

About the Job

Requirements

  • A master's degree or higher in Engineering, Materials Science, Physics, Chemistry, or a related scientific field.
  • At least 15 years of industry experience in semiconductor dry etch process development or closely related technical domains.
  • A demonstrated track record of technical excellence, innovation, and problem-solving in advanced process technologies.
  • A strong reputation in the semiconductor industry, with the ability to influence stakeholders, lead major initiatives, or drive key technology inflections.
  • Deep understanding of plasma physics, etching chemistry, thin-film interactions, reactor design, and statistical process control.
  • Proven success in high-volume manufacturing environments and advanced technology node ramp phases.
  • Ability to communicate complex technical concepts clearly to technical and executive audiences.
  • Ability to lead without authority, mentor others, and build collaborative partnerships across teams and organizations.

Responsibilities

  • Lead development, optimization, and qualification of advanced dry etching processes for leading-edge technology nodes, ensuring performance in critical-dimension control, profile engineering, selectivity, and defectivity.
  • Drive technology breakthroughs in plasma etch mechanisms, chamber performance, and equipment capability to support technology scaling and yield improvement.
  • Collaborate with integration, module, equipment engineering, and manufacturing teams to ensure robust process transfer, stability, and high-volume manufacturability.
  • Serve as a senior technical authority, guide junior engineers, and influence strategic direction for long-term module development.
  • Identify and drive continuous improvement initiatives across process stability, cost efficiency, and inline yield metrics.
  • Lead cross-site or cross-functional task forces addressing complex technical issues that require deep domain knowledge and advanced analytical methodologies.
  • Benchmark emerging technologies, collaborate with equipment suppliers, and evaluate next-generation plasma etch platforms.
  • Present technical findings, proposals, and roadmaps to executive stakeholders, customers, and engineering leadership teams.
  • Represent the company as a technical expert in external forums, technical committees, or supplier engagements when appropriate.

About the Company

Micron Technology

Makes memory and storage chips for AI and PCs

Micron Technology designs and manufactures memory and storage chips, mainly DRAM and NAND flash, used in data centers, PCs, phones, cars and industrial equipment. It is one of only three companies that make HBM, the stacked high-bandwidth memory placed beside processors in AI servers, and it is the largest memory chipmaker based in the United States. Unlike chip designers that outsource production, Micron runs its own fabs and assembly sites in the United States and across Asia. It earns money by selling chips, memory modules and solid-state drives to cloud providers, device makers and distributors. Micron was founded in 1978 and is headquartered in Boise, Idaho.

Company size
10,001+
Company stage
IPO
Headquarters
Boise, ID
Founded
1978

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