Sr. Failure Analysis Engineer

Job Req ID: 28962

Essential Duties and Responsibilities:

1. Support and participate in the repair of production defective PCBA boards, following established procedures and guidance.
2. Assist with NPI build activities, including basic debugging, analysis, and repair of defective boards, as part of cross-functional support.
3. Work closely with the product engineering team to help identify and resolve production-related issues, including those arising from SMT and PCBA assembly processes.
4. Support failure analysis activities for defective boards and collaborate with R&D on critical non-conformance (NG) symptoms where required.
5. Assist in preparing failure analysis reports, repair records, and related documentation, contributing to traceability and continuous improvement efforts.
6. Perform other related duties or technical support tasks as assigned by the supervisor, based on operational needs.
7. Exposure to PCBA schematics, test points, and debugging tools (e.g., multimeter, oscilloscope) will be an added value.
8. Familiarity with SMT processes, soldering, rework techniques, or IPC standards is preferable and considered an advantage to the candidate.
9. Ability or willingness to support NPI ramp-up activities, pilot runs, or engineering builds is desirable.
10. Willingness to learn and adapt to new products, technologies, and repair methodologies is viewed as an added value.
11. Ability to perform effectively under pressure and meet work demands.
12. Willingness to support company assignments, including overtime and overseas travel (e.g., the U.S., Taiwan) for short-term missions of up to one month.

Qualifications:

1. Bachelor’s degree or higher in Electrical Engineering (BSEE), Mechanical Engineering (BSME), or a related field, with at least 3~5 years of repair experience in the PCBA industry.
2. Excellent communication and interpersonal skills, with the ability to collaborate effectively across departments and with external stakeholders, including customers.
3. Language Skills: Mandarin, English,
4. Working knowledge or exposure to computer or server operations and common electronic components or devices is preferable and considered an advantage to the candidate.
5. Basic understanding of electronic circuit fundamentals is desirable and viewed as an added value.
6. Experience or familiarity with soldering and desoldering techniques is preferred; exposure to BGA rework will be an added advantage.
7. Understanding or hands-on exposure to computer or server testing and inspection processes is preferable.
8. Comfortable operating common software environments such as Windows; basic exposure to Linux is considered an added value.
9. Ability to support electronic circuit analysis and troubleshooting activities, under guidance when required, is desirable.
10. Demonstrates teamwork, self-motivation, and a positive working attitude, with the willingness to contribute to team objectives and continuous improvement.
11. Experience with Fortune 500 EMS/ODM/OED electronics manufacture companies is highly preferred.