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Micron Technology

Makes memory and storage chips for AI and PCs

TF Section Manager/Engineer Lead

Engineering LeadershipConfirmed live in the last 24 hours
Full-timeTaichung City, TaiwanNo salary listedIn-person

About the Job

Requirements

  • Proven experience in thin film deposition processes and semiconductor manufacturing.
  • A bachelor's degree in Engineering, Materials Science, or a related field.
  • At least 5 years of experience in thin film process development and management.
  • A demonstrated track record of implementing process improvements in a high-tech manufacturing environment.
  • Knowledge of commonly used techniques and standards in thin film deposition.
  • Proficiency in leveraging AI-enabled tools to improve team productivity, operational decision making, workforce development, and continuous improvement.
  • Ability to guide and encourage a team of engineers.
  • Ability to collaborate effectively with diverse teams.
  • Ability to adhere to timelines and deliver results under pressure.

Responsibilities

  • Lead and manage the thin film process team to determine and implement advanced process strategies.
  • Develop, optimize, and coordinate thin film deposition processes to achieve product quality and consistency.
  • Collaborate with cross-functional teams to integrate thin film processes into manufacturing workflows.
  • Monitor and analyze process data to identify areas for improvement and implement changes.
  • Ensure compliance with industry standards and regulations while maintaining safety and efficiency.
  • Drive adoption of AI-assisted ways of working within the organization to enhance efficiency and business outcomes.

Desired Qualifications

  • Experience working in a global company.

About the Company

Micron Technology

Makes memory and storage chips for AI and PCs

Micron Technology designs and manufactures memory and storage chips, mainly DRAM and NAND flash, used in data centers, PCs, phones, cars and industrial equipment. It is one of only three companies that make HBM, the stacked high-bandwidth memory placed beside processors in AI servers, and it is the largest memory chipmaker based in the United States. Unlike chip designers that outsource production, Micron runs its own fabs and assembly sites in the United States and across Asia. It earns money by selling chips, memory modules and solid-state drives to cloud providers, device makers and distributors. Micron was founded in 1978 and is headquartered in Boise, Idaho.

Company size
10,001+
Company stage
IPO
Headquarters
Boise, ID
Founded
1978

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