R

Robert Bosch Venture Capital

Venture capital funding deep tech startups

Embedded Software Specialist

Full-TimeUpdated on 10/15/2026
No salary listed
Senior
Bachelor's
Shanghai, China
In Person
Software EngineeringEmbedded Engineering

About the job

Requirements
  • A bachelor's degree or above, majoring in Electronics, Communication, Computer Science, or a related field.
  • At least 5 years of embedded or IoT development experience, including end-to-end IoT connectivity development for at least two mass-produced smart hardware products.
  • In-depth understanding of Matter specifications and application-layer protocols, with hands-on Matter device development or certification experience; familiarity with Thread and Border Router networking principles.
  • Proficiency in Wi-Fi, BLE, and Zigbee, with practical integration experience preferred; familiarity with access specifications for mainstream third-party smart home platforms.
  • Skill in ARM Cortex-M and RTOS development, including FreeRTOS or RT-Thread; familiarity with UART, SPI, and I2C peripheral drivers, MQTT and CoAP protocols, TLS encrypted communication, OTA solution design, and Wi-Fi/BLE/Thread module selection.
  • Basic knowledge of PCBA production processes and DFM design principles.
  • Proven experience managing external technical teams and driving project delivery while maintaining the correctness and independence of technical solutions.
Responsibilities
  • Lead selection of IoT connectivity solutions for smart home products, prioritize implementation of the Matter protocol, and establish product Matter access roadmaps and timelines.
  • Collaborate with technical experts to define device-cloud communication architecture, data models, and OTA upgrade solutions.
  • Liaise with suppliers as the technical interface and facilitate development and debugging of IoT connectivity solutions.
  • Review technical proposals, schematic diagrams, and firmware designs; establish test plans and acceptance criteria to control delivery quality.
  • Own module integration, protocol adaptation, network configuration, OTA implementation, and other core modules.
  • Troubleshoot communication anomalies, disconnection and reconnection failures, abnormal power consumption, and other issues; identify root causes.
  • Drive product integration with in-house IoT platforms and third-party platforms, including Mi Home, Tuya, and Apple HomeKit; build Matter-centered cross-platform interoperability.
  • Coordinate with cloud platform engineers to jointly debug device-side and cloud-side interfaces.
  • Establish milestone schedules for IoT connectivity development, track project milestones, identify risks, and drive their resolution.
  • Coordinate internal and external teams and organize technical reviews and problem-solving workshops.
  • Track developments in smart home IoT protocols and updates to mainstream third-party platforms; accumulate technical specifications and best practices for IoT connectivity.
Desired Qualifications
  • Practical integration experience with Wi-Fi, BLE, and Zigbee.
  • Prior experience with Matter cross-platform interoperability.
  • Experience in low-power hardware product design and wireless product certification.

About the company

R

Robert Bosch Venture Capital

View

RBVC (Robert Bosch Venture Capital) is a global venture capital firm that backs early-stage deep tech startups in areas like energy efficiency, medical devices, and virtual/augmented reality. It supports companies with funding and access to Bosch’s network and resources to help them scale and bring innovations to market. Unlike traditional VCs, RBVC may purchase solutions for a proof-of-concept while allowing startups to keep their intellectual property, which speeds up development and lowers upfront costs. The firm earns money through equity investments and the eventual success of its portfolio. RBVC’s goal is to accelerate technological advances across multiple industries by connecting startups with Bosch’s ecosystem, customers (from medical centers to data centers), and global reach.

Company Size

201-500

Company Stage

N/A

Total Funding

$3.8B

Headquarters

Frankfurt, Germany

Founded

2007

Get referred to Robert Bosch Venture Capital

See people who can refer or advise you

Simplify Jobs

Simplify's Take

What believers are saying

  • Quantum Motion raised $160 million in May 2026 with Bosch Ventures participating.
  • Qdrant closed a $50 million Series B in March 2026, signaling strong AI infrastructure demand.
  • Nauta named Bosch Ventures a lead investor in August 2026, expanding industrial AI reach.

What critics are saying

  • Bosch Mobility announced 13,000 cuts in 2025 and more restructurings through 2027.
  • Bosch closed France's Moulins-Yzeure plant in 2026, showing pressure on industrial cash generation.
  • If Bosch's margin recovery fails, corporate venture budgets face direct contraction by 2027.

What makes Robert Bosch Venture Capital unique

  • Bosch Ventures launched Fund VI in May 2025, committing about €250 million globally.
  • It buys Bosch proof-of-concept access while startups keep IP, accelerating enterprise adoption.
  • Its portfolio spans mobility, AI, quantum, and energy, with 60-plus active investments.

Help us improve and share your feedback! Did you find this helpful?

Benefits

Health Insurance

Dental Insurance

Vision Insurance

Life Insurance

Disability Insurance

401(k) Retirement Plan

401(k) Company Match

Paid Vacation

Paid Parental Leave

Wellness Program

Company News

Pulse 2.0
Jan 22nd, 2026
Neurophos: $110 Million Series A Raised To Bring Exaflop-Scale Photonic AI Chips To Data Centers

Neurophos has raised $110 million in an oversubscribed Series A round to accelerate the commercialization of its photonic AI chip technology, positioning the Austin-based company to push beyond the power and scalability limits facing today’s AI infrastructure. The financing brings Neurophos’ total funding to $118 million and was led by Gates Frontier, with participation from M12 (Microsoft’s Venture Fund), Carbon Direct Capital, Aramco Ventures, Bosch Ventures, Tectonic Ventures, Space Capital, and additional investors.

Bloomberg
Jan 22nd, 2026
Gates' VC fund leads $110M funding for AI chip startup Neurophos

Neurophos Inc., a chip startup developing technology to outperform AI accelerators, has raised $110 million in funding led by Gates Frontier, Bill Gates' venture capital fund. Microsoft's M12 and Aramco Ventures, the investment arm of Saudi Arabia's state-owned oil producer, also participated. Additional investors in the round included Bosch Ventures, Tectonic Ventures and Space Capital. The company aims to develop new chip technology capable of surpassing current accelerators used to run AI models.

Trending Topics
Jan 21st, 2026
Berlin's Cloover secures $1.22B financing to make home energy upgrades affordable at €100-150 monthly

Berlin-based Cloover has raised $1.22 billion in combined funding to accelerate Europe's energy transition. The financing includes $22 million in Series A equity led by QED and MMC, with participation from Bosch Ventures and others, plus $1.2 billion in debt facilities and a €300 million guarantee from the European Investment Fund. Founded two years ago, Cloover has built an AI-powered operating system that helps installation companies offer renewable energy systems to households for €100-150 monthly over 25 years, eliminating high upfront costs. The platform combines workflow tools, financing, energy management and procurement. The company uses AI-based credit assessment that considers future energy savings alongside traditional metrics, achieving higher approval rates than banks. Cloover partners with installation businesses rather than competing with them, taking a B2B2C approach. The company aims to reach €500 million revenue run rate by end-2026.

Calcalist Tech
Nov 19th, 2025
TULU adds $17 million to Series A to expand AI-driven product access platform globall | Ctech

The platform serves 500,000 residents across 60 cities and leverages AI to drive engagement and insights.

Presseportal
Nov 14th, 2025
Semiconductor pioneer FMC raises €100 million to set new standards for memory chips

Dresden (ots) - - Oversubscribed financing round consisting of €77 million in Series C equity capital, led by HV Capital and DTCF, and €23 million in public funding, marking...