C

Cornelis Networks

High-speed AI/HPC networking fabrics

NIC Kernel Driver Managing Engineer

Engineering LeadershipConfirmed live in the last 24 hours
Full-timeRemote in USANo salary listed

About the Job

Requirements

  • At least 8 years of systems or kernel software engineering experience in C on Linux; a bachelor's degree in Computer Science, Computer Engineering, or a related field, or equivalent experience.
  • At least 2 years of formal or informal leadership experience as a people manager, team lead, or technical lead, with demonstrated interest in people management.
  • Hands-on Linux device driver development experience, including PCIe device enumeration, BAR/MMIO register access, DMA mapping, interrupt handling, locking and concurrency, and kernel debugging using crash/kdump, ftrace, perf, or kgdb.
  • Depth in at least one high-performance networking subsystem, such as the Linux RDMA core stack (uverbs/ib_core, rdma-core, QP/CQ/MR lifecycle), netdev datapath (NAPI, multi-queue, XDP/AF_XDP, ethtool/devlink), or an upstream vendor NIC/fabric driver such as mlx5, irdma, ice, bnxt_re, efa, or hfi1.
  • Ability to diagnose performance and correctness issues in low-latency, high-throughput data paths.
  • Experience contributing to open-source projects and familiarity with upstream Linux patch and review processes.
  • Strong written and verbal communication skills, including the ability to represent the team's work to engineering leadership and customers.

Responsibilities

  • Lead the kernel driver team and own release planning, execution tracking, and delivery of driver features aligned to the product roadmap.
  • Perform code and design reviews, contribute patches, and lead debugging of complex kernel issues, including PCIe/MMIO, DMA, MSI-X and interrupt handling, memory registration and address translation, command/completion ring management, device reset, and error recovery.
  • Drive driver enablement before tapeout using emulation, FPGA prototypes, and virtual PCIe device models to accelerate first-silicon bring-up.
  • Drive patch submission and review cycles on linux-rdma, netdev, and related mailing lists; keep drivers in-tree and supported across RHEL, SLES, and Ubuntu distributions.
  • Partner with ASIC/silicon, firmware, libfabric provider, middleware, and validation teams to define and stabilize the kernel/user-space interface, including ioctls, mmap'd rings, doorbells, and dma-buf for GPU and accelerator memory.
  • Establish and maintain CI, regression, and stress coverage for driver changes; own driver documentation, module packaging, and release readiness.
  • Triage customer escalations, reproduce customer-reported issues, and translate findings into prioritized fixes with clear status communication to stakeholders.
  • Plan team headcount, manage performance, and participate in hiring.
  • Own the Linux kernel drivers for three generations of company silicon: CN5000 at 400 Gbps; CN6000 at 800 Gbps on PCIe Gen6 with a hardware-accelerated RoCEv2 datapath and standard netdev support alongside Omni-Path; and CN7000 at 1.6 Tbps with Ultra Ethernet.

Desired Qualifications

  • Prior experience as a maintainer or reviewer for an upstream Linux driver.
  • Familiarity with HPC fabrics such as Omni-Path, InfiniBand, Slingshot, or other host fabric interface drivers.
  • Experience with RoCEv2, congestion control, or Ethernet-based RDMA deployments.
  • Familiarity with Ultra Ethernet (UEC/UET) specifications.
  • Knowledge of libfabric/OFI provider interfaces and kernel/user-space co-design.
  • Experience with GPUDirect RDMA, dma-buf, and CUDA/ROCm memory interoperability.
  • Experience with driver packaging and distro enablement (RHEL/SLES/Ubuntu), and cluster-scale benchmarking, profiling, and optimization.
  • A master's degree or doctorate.

About the Company

Cornelis Networks

High-speed AI/HPC networking fabrics

Cornelis Networks builds high-performance AI and HPC networking fabrics to help accelerators and servers in data centers exchange data with less idle GPU time. Its open architecture works across different GPUs and accelerators, avoiding vendor lock-in and not relying on a single full-stack solution. The company began shipping products after spinning out of Intel in 2020 and is developing a next-generation fabric. Its current push includes Active Compute Fabric, a networking technology that lets chips process and send information concurrently, aimed at enabling closer integration of compute and communication. The goal is to commercialize the platform, expand adoption, and challenge closed AI networking stacks by offering an open, multi-vendor fabric that improves data movement in AI/HPC clusters.

Company size
201-500
Company stage
Late Stage VC
Total funding
$335.8M
Headquarters
Tredyffrin Township, Pennsylvania
Founded
2019

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