Senior Wet Cleaning Process Development Engineer
Black Semiconductor
Senior Wet Cleaning Process Development Engineer
Black Semiconductor
Graphene photonics enable optical chip interconnects
About us
We see the semiconductor industry as a realm of possibility. We see opportunity. We see the profound impact that our graphene solutions will have in transforming the industry. We invite you to join us in driving change with our fundamentally human-centered approach, uniting bright minds around a shared vision. The vision is: Prove to everybody that you can make a fundamental change. Prove with your knowledge and skills how things can be done differently. Together, we can change the paradigm of how the world connects
About our technology
The semiconductor industry’s growing demand for more powerful chips with higher bandwidth and lower power finds its solution in our technology. We connect chips to high-throughput, low-delay computing networks. The key lies in harnessing the physical properties of graphene to combine electronic computing with photonic communication, allowing countless chips to interact almost as if they were one. Our graphene photonic innovation increases computing power and efficiency to a new order of magnitude
In short, we connect chips to create powerful and energy-efficient networks, overcoming connectivity limitations in the semiconductor industry. We deliver the graphene solution
The Role
Black Semiconductor is seeking a Senior Wet Cleaning Process Engineer (f/m/d) to support and lead the initial buildout of our Black FabONE semiconductor fabrication facility. This role is instrumental in developing, implementing, and scaling cutting-edge wet clean processes, especially focused on 2D material preparation and advanced device integration. You’ll play a key role in shaping the future of our wet clean module during both pilot and high-volume production phases.
The successful candidate will play a key role in advancing our wet clean capabilities, making a direct impact on the growth and success of our semiconductor manufacturing operations.
To join our team, you should be excited to
Lead the development and implementation of wet clean processes tailored to 2D materials (e.g., graphene) and novel device architectures
Own key fab startup activities, including tool installation, acceptance testing, recipe validation, and ramp-up
Evaluate and define process specifications; collaborate with internal stakeholders and vendors to select and qualify batch and single-wafer cleaning tools
Establish and maintain Process of Record (POR) for critical clean steps; define ramp-to-production protocols
Work with facility and equipment teams to ensure proper chemical infrastructure integration for delivery, return, and waste systems
Implement and manage SPC systems, drive continuous improvement via data-driven methodologies
Provide technical mentorship to junior engineers and fab technicians as the organization scales
Your Qualifications
Minimum 5 years of hands-on experience in semiconductor process engineering with a focus on wet cleaning
Deep understanding of contamination control, surface preparation, and post-process cleaning challenges
Proven experience working with cleaning chemistry and hardware, including single-wafer and batch wet clean tools
Practical exposure to 2D material preparation and integration is a strong plus
Experience in fab startup, pilot line development, or technology ramp-up environments is highly desirable
Familiarity with chemical delivery, return, and waste management infrastructure in a fab environment
Strong analytical and problem-solving skills, including RCA and corrective action planning
Excellent communication and collaboration skills in a fast-paced, multidisciplinary team setting
Bachelor’s, Master’s, or Ph.D. in Engineering or a related technical field is required
Our work culture
People Over Processes. At Black Semiconductor, flexibility is key—we ensure work adapts to life, not the other way around. We champion work-life harmony, where careers are meaningful and enriching. Our processes are human-centric, allowing you to focus on what matters
Let’s grow together. Your potential is our priority. We provide the autonomy to make a lasting impact and nurture your growth through a culture of continuous learning. We invest in your journey for professional and personal development
Your Health and Future Matter. Your well-being is paramount. We offer a comprehensive benefits package with outstanding insurance, pension and virtual stock options for your mental, physical, and financial health. Your peace of mind is our priority - in the present and future
We Live Openness. Collaboration and inclusivity are the cornerstones of our culture. We practice openness, fostering trust and respect. Individuality is our collective strength, fueling innovation and driving us forward
We connect chips – and people. We encourage qualified individuals from any background to apply. We foster an inclusive and supportive work environment that values collaboration, innovation, and growth. Join our team and be part of an organization dedicated to making a difference in the industry
Can you picture yourself in this Role and our Company? Let’s connect
If your application results in an employment relationship, your Applicant Data will be transferred to our personnel records and processed in accordance with applicable legal requirements; otherwise, your Applicant Data will be retained for up to six (6) months after completion of the recruitment process. Read more about our privacy policy here.
Graphene photonics enable optical chip interconnects
Black Semiconductor develops graphene-based photonics that integrate optical components into the outer layers of CMOS-like chips, enabling direct optical chip-to-chip communication. It works by using graphene as a translator to convert electronic signals to optical signals and back, so electrons on silicon can talk to photons through integrated photonic interconnects. This approach differs from traditional silicon photonics or pure electronic interconnects by being CMOS-compatible, wafer-scale, and capable of linking multiple chips as a single high-performance unit while reducing production steps by about 60%. The company aims to move from pilot production to mass manufacturing, building a 300mm wafer facility (FabONE) in Aachen, with pilot production by 2027 and mass production by 2031, backed by a large European funding round and investors.
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