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Broadcom

Designs chips and software for data centers

Mechanical Engineer Supporting ASIC Test

Full-TimePosted on 10/23/2026Deadline 4/20/27
$121.9k - $195k/yr+ Discretionary annual bonus + New-hire equity grant + Annual equity awards
Senior, Expert
Bachelor's, Master's
San Jose, CA, USA+1 moreMore locations: Fort Collins, CO, USA
In Person
Mechanical EngineeringThermal & Fluids Engineering

About the job

Requirements
  • Bachelor's degree in Mechanical Engineering and 8+ years of experience, or a master's degree and 6 years of experience, developing semiconductor socket and cooling solutions.
  • In-depth experience using SolidWorks.
  • Experience using Ansys Icepak and/or SolidWorks Flow thermal analysis and simulation software.
  • Experience using Ansys mechanical simulation software.
  • Experience managing vendors in the test hardware manufacturing process.
  • Strong mechanical prototyping skills.
  • Familiarity with socketing and cooling very large, high-power, high-ball-count ASIC devices.
  • Experience with pogo-pin and elastomeric integrated circuit socket solutions.
  • Mechanical debugging intuition and comfort using basic hand tools, micrometers, and calipers.
  • Basic knowledge of automatic test equipment test hardware mechanical configurations.
  • Familiarity with Keyence profilometry equipment.
  • Ability to manipulate large data sets using Excel or Python scripts.
Responsibilities
  • Collaborate with PCB electrical design engineers to provide robust ASIC socket and thermal solutions for their designs.
  • Perform mechanical component design and design verification using SolidWorks.
  • Perform 3D mechanical extractions from Allegro PCB design software.
  • Interface with device package designers and generate device warpage profiles for socket designs from raw simulation data.
  • Measure actual device warpage using high-precision profilometry equipment to validate warpage profile simulations.
  • Manage socket hardware vendors, review and provide feedback on designs, and approve designs.
  • Troubleshoot mechanical and electrical contact issues in laboratory and test-floor environments.
  • Design and review cooling solutions, including air, liquid, and cold-plate solutions, for test hardware.
  • Evaluate and manage procurement of mechanical and test hardware, such as thermal control units and socket resistance measurement platforms.
  • Use 3D printing to address usability issues.

About the company

Broadcom designs chips and sells infrastructure software for the companies that run large data centers, telecom networks and corporate IT. Its custom AI processors, built with cloud companies, and its Ethernet switch chips move and process data inside the computer clusters that train AI models. The chip business also makes parts for broadband, wireless, storage and industrial equipment, sold to device makers and cloud operators, while VMware software lets businesses run private clouds and is sold by subscription. Broadcom took its current form in 2016, when Avago Technologies, formed in 2005 from Agilent's chip unit, bought Broadcom Corporation, and it is based in Palo Alto, California.

Company Size

10,001+

Company Stage

IPO

Headquarters

Palo Alto, California

Founded

2005

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Simplify Jobs

Simplify's Take

What believers are saying

  • AI demand is surging: AI chip sales more than tripled to $16.7 billion in the quarter ended August 2026.
  • Big orders are booked ahead: Anthropic agreed in April 2026 to take 3.5 gigawatts of Broadcom-built TPU capacity from 2027.
  • Jobs sit on deep profits: Broadcom converts almost half its revenue into free cash, 46% in the August 2026 quarter.

What critics are saying

  • Jobs hinge on one channel: a single distributor bought 32% of Broadcom's fiscal 2025 revenue, up from 28%.
  • Regulators face pressure to act: in July 2026 European cloud firms urged EU antitrust chiefs to pause VMware partner cuts.
  • Software customers resent the pricing: Broadcom swapped VMware's permanent licenses for subscriptions, angering many corporate buyers.

What makes Broadcom unique

  • Broadcom builds chips that customers design: it turns Google's TPU AI processor designs into finished silicon.
  • Broadcom also runs a big software arm: infrastructure software, led by VMware, made 30% of quarterly revenue in August 2026.
  • Broadcom grows by buying: it acquired CA Technologies in 2018, Symantec's enterprise unit in 2019 and VMware in 2023.

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Benefits

  • Health Insurance
  • Dental Insurance
  • Vision Insurance
  • 401(k) Retirement Plan
  • 401(k) Company Match
  • Employee Stock Purchase Plan
  • Employee Assistance Program
  • Paid Vacation
  • Paid Sick Leave
  • Paid Holidays

Growth & Insights and Company News

6 month growth

10%

1 year growth

11%

2 year growth

10%
Traders Union
Oct 26th, 2026
Blackstone unveils $63B Broadcom financing deal with BofA, Citi and Morgan Stanley

Blackstone has announced a $63 billion financing deal with Broadcom and a group of banks that includes Bank of America, Citi, and Morgan Stanley. Its shares edged higher on the day, trading at $119.06. The asset manager has a market value near $136.61 billion. Fifty of 93 analysts rate the stock a buy, with a median price target of $138, about 15.9% above the current level. Shares sit at support around $118.74 and trade below their 50-day and 200-day moving averages. A close above $125.04 would signal buyers are following through, while a drop below $118.74 would suggest the move is fading.

Yahoo Finance
Oct 22nd, 2026
Nvidia, Broadcom, TSMC, Micron: AI stocks to buy in 2027 as Broadcom targets $115B AI revenue

AI stocks are sliding after a hot inflation report raised the prospect of an interest rate rise. One Motley Fool columnist argues the sell-off is short-sighted and names four stocks to buy for 2027: Taiwan Semiconductor Manufacturing (TSMC), Micron Technology, Nvidia, and Broadcom. Nvidia expects 70% revenue growth next year. Broadcom expects AI semiconductor revenue to rise to $115 billion, up from about $65 billion this year. TSMC, which makes chips for nearly all big tech firms, reported fast third-quarter revenue growth. Micron expects memory chip shortages to worsen in 2027 and 2028, even as new capacity arrives in mid-2027. Its stock trades at 5 times this fiscal year's earnings.

Yahoo Finance
Oct 19th, 2026
Broadcom stock is down 31.5% from its June peak: is $328.75 cheap enough?

Broadcom shares closed at $328.75 on October 16, 2026, 31.5% below their highest close of the past year, set on June 2. Shareholders lost 5.7% over twelve months, while the S&P 500 returned 16.2%. The stock now trades at 43.7 times trailing earnings, down from 82.1 a year earlier. That is still higher than at 19 of the 35 earlier quarter ends since late 2017. Diluted earnings per share doubled from $3.92 to $7.83, and operating margin rose to 48.5% from 39.0%. AI semiconductor revenue hit $16.7 billion in fiscal Q3 2026, or 56% of the total. Management guided fiscal Q4 revenue to $34.8 billion, up 93%, while analysts expect about $35.6 billion. Broadcom is expected to report on or around December 9, 2026.

Yahoo Finance
Oct 17th, 2026
Broadcom's $29B lease backstop: how far does $13.7B quarterly cash flow cover it?

Broadcom has backed a customer's five-year compute lease obligations, with maximum potential liability of about $29 billion after full deployment, according to its quarterly filing for the period ended August 2. No payments had been made, and the recorded fair value was immaterial. In a default, the liability would reflect 85% of outstanding covered amounts less equipment proceeds. Exposure rises as racks are deployed and falls as lease payments arrive. The filing also describes conditional financing through customer convertible notes of up to $42 billion, none of which had been issued. Broadcom generated $13.665 billion of free cash flow in the quarter, and held $23.975 billion in cash. The maximum backstop equals about 2.12 quarters of that free cash flow. AI semiconductor revenue reached $16.7 billion.

Yahoo Finance
Oct 16th, 2026
Broadcom CEO says capital, not chips, may be AI's biggest constraint as chip stocks slide

Broadcom chief executive officer Hock Tan says access to capital, not chips, memory or electricity, could become the biggest constraint on AI expansion. Speaking at the DBS Asia Future Forward Conference in Singapore on Monday, he said supply bottlenecks have repeatedly emerged and eased over the past two years. Demand still outstrips supply, Tan said, and the gap could last through 2029 and possibly into 2030. He warned that many investors "have no clue what they are investing in." He noted that OpenAI's annualised revenue nears $50 billion, but said that does not prove lasting profit given high training costs. Intel chief executive officer Lip-Bu Tan also pointed to the cost of capital and the need to show returns. Global chip stocks fell, and Broadcom shares traded lower in premarket trading on Thursday.