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Micron Technology

Makes memory and storage chips for AI and PCs

Advanced DRAM Cell & Device Technology Intern

Hardware EngineeringConfirmed live in the last 24 hours
InternshipBoise, ID, USANo salary listed

About the Job

Requirements

  • Currently pursuing an M.S. or Ph.D. in Electrical Engineering, Materials Science, Applied Physics, Chemical Engineering, or a related technical field, and must not graduate before September 2027.
  • Demonstrated understanding of semiconductor fundamentals, including device physics, materials science, characterization techniques, and concepts relevant to advanced memory technologies.
  • Experience with electrical characterization, device testing, statistical analysis, and interpretation of experimental or simulation data sets.
  • Familiarity with DRAM operational concepts, including activation, sensing, retention, and disturb mechanisms.
  • Proficiency with data analysis and scripting tools such as Python, MATLAB, JMP, or similar platforms, along with familiarity with AI-assisted engineering and data analysis tools.

Responsibilities

  • Support evaluation of DRAM access devices, capacitors, and cell stack elements through characterization, data analysis, and assessment of new device architectures, materials systems, and integration schemes.
  • Design and implement silicon experiments; perform electrical, physical, and materials characterization along with statistical analysis to identify opportunities for device, process, and design improvements.
  • Analyze device- and array-level behavior, including sensing margins, activation characteristics, disturb mechanisms, retention performance, leakage behavior, and read/write operation interactions.
  • Collaborate with modeling, design, process integration, and manufacturing teams to understand device behavior, support technology optimization, and contribute to technology development activities.
  • Apply AI-assisted and generative AI tools, where appropriate, to enhance data analysis, workflow efficiency, and technical decision-making.

Desired Qualifications

  • Experience in DRAM or NAND device development, characterization, or technology research.
  • Hands-on experience with semiconductor materials characterization, process development, thin film engineering, interface engineering, TCAD simulation, and/or advanced memory technology research.
  • Knowledge of semiconductor fabrication processes, advanced BEOL integration, reliability mechanisms, and device variation analysis.
  • Experience conducting independent research projects and effectively communicating technical results to diverse audiences.
  • Experience using AI, large language models, AI-enabled analytics, or AI-supported engineering workflows to improve research productivity and technical insights.

About the Company

Micron Technology

Makes memory and storage chips for AI and PCs

Micron Technology designs and manufactures memory and storage chips, mainly DRAM and NAND flash, used in data centers, PCs, phones, cars and industrial equipment. It is one of only three companies that make HBM, the stacked high-bandwidth memory placed beside processors in AI servers, and it is the largest memory chipmaker based in the United States. Unlike chip designers that outsource production, Micron runs its own fabs and assembly sites in the United States and across Asia. It earns money by selling chips, memory modules and solid-state drives to cloud providers, device makers and distributors. Micron was founded in 1978 and is headquartered in Boise, Idaho.

Company size
10,001+
Company stage
IPO
Headquarters
Boise, ID
Founded
1978

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