Senior Engineer 1
Kulicke & Soffa
Senior Engineer 1
Kulicke & Soffa
Manufactures semiconductor packaging equipment and tools
The candidate will present K&S technically and professionally to ensure that K&S equipment is installed, maintained and repaired, aiming at customers’ satisfaction through reliability and proactive on-site support.
• Day-to-Day activities include:
• On site installation of equipment including new equipment, upgrades and also system relocation
• Providing troubleshooting for both hardware and software.
• Providing responsive telephone and email support, ensuring customers' successful use of equipment
• Developing buy-off receipts
• Instructing and Training customers in the use of the equipment
For this job, the candidate will need to have an Engineering diploma/degree/Technical Study and be familiar with the technical aspects of equipment with at least 5 years of relevant working experience. He/she should have strong K&S relevant machine knowledge and data analysis skills is a plus. He/she should also have strong problem solving and excellent communication skills.
Company overview:
Founded in 1951, Kulicke and Soffa Industries, Inc. (NASDAQ: KLIC) specialize in developing cutting-edge semiconductor and electronics assembly solutions enabling a smarter and more sustainable future. Ever-growing range of products and services supports growth and facilitates technology transitions across large-scale markets.
Please refer to the website for more details: www.kns.com.
Equal Opportunity:
Kulicke & Soffa recruits on the basis of merit (such as skills, experience or ability to perform the job), regardless of age, race, gender, religion, marital status and family responsibilities, or disability.
Manufactures semiconductor packaging equipment and tools
Kulicke & Soffa designs, manufactures, and sells capital equipment and tools for assembling semiconductor devices. Its product line includes ball bonders that ultrasonically attach fine wires to a semiconductor die, thermo-compression bonding systems for high-density interconnects, and equipment for surface-mount technology and die attach. The company differentiates itself with a long history dating back to 1951, a broad portfolio across wire bonding, advanced packaging, and die attach, and a strong Asia-Pacific presence plus an active after-market parts and services business. Its goal is to enable mass production of semiconductors by providing reliable, high-precision packaging and assembly solutions that help customers scale manufacturing and keep equipment running smoothly.
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