Full-Time
Principal Field Application Engineer FPGA
Posted on 1/31/2026
Microchip Technology
10,001+ employees
Provides embedded hardware, software, tools
No salary listed
Paris, France
Hybrid
 Software Engineering (1) |
|---|
- 5+ years of relevant industry experience with FPGA-based architecture definition, design, and support, including High-Speed Serial IO, High speed DDRx/LPDDRx Memories and/or Embedded Processor
- 5+ years of experience with lab equipment such as oscilloscopes and signal analyzers
- 5+ years of experience in semiconductor applications/sales
- A Bachelor's Degree, or higher, in Electronics Engineering or Computer Science with a strong academic track record
- Must be able to speak and write in English fluently
- Provides pre-sales and post-sales technical support for the development and implementation of complex products, applications, and solutions across all Microchip product lines, with an emphasis on FPGAs
- To be an authority on all phases of programmable logic design, including requirements analysis, HDL code development and simulation, embedded hard and soft processor system design, synthesis optimizations, place and route constraints, timing closure, board-level schematic reviews, and FPGA hardware development and debug tools
- Advise on the implementation of innovative ideas and solutions for assigned clients
- Utilize engineering design skills, techniques, and knowledge to help clients decrease time to market, reduce overall system cost and improve end-product performances, reliability and security
- Utilize the Microchip Client Engagement Process to drive design wins to revenue at assigned clients
- Use insight and influencing skills to offer clients unique perspectives on technology that links to Microchip solutions
- Identify key client stakeholders and coach them to build consensus for Microchip solutions within their organization
- Contribute and participate within a global team environment to successfully develop and implement strategies for assigned clients across all global locations
- Communicate effectively with Microchip Business Units for technical assistance and provide quantifiable feedback to measure ROI in assigned client investments (solutions and products)
- Coach, mentor, and train other FAEs as needed
- Assist launches of new product introductions
- Familiarity with aerospace products and designs are a bonus
- Embedded Linux knowledge is a plus
- Competencies: Strategic/Critical Thinking—Systematically solves problems and hypothesizes possible client pain points, expectations, and implicit needs; brainstorms with team members to devise solutions to solve complex client challenges.
- Competencies: Communication—Tailors communication to the client’s needs with authority; effectively delivers presentations and has strong verbal and written communication skills.
- Competencies: Interpersonal Influence—Uses rational and emotional drivers that would appeal to clients to drive conversations to elements of value for both parties.
- Competencies: Networking—Identifies the right client stakeholders and builds connections quickly to drive consensus for design wins; works cooperatively with a wide range of internal stakeholders for success.
- Competencies: Ownership—Goes out of his or her way to complete a task and has a relentless drive to achieve results; be independent, self-directed, and taking initiative.
- Competencies: Workflow/Project Management—Sets clear, realistic, and time-bound objectives that align to business growth; breaks each objective into tasks and process steps that can be achieved within a realistic timeframe.
- Competencies: Adaptability – Ability to manage multiple customer engagements simultaneously, and work with client design teams across a variety of markets and applications. Identify and communicate Microchip product differentiators targeting specific customer products.
Microchip Technology provides embedded system solutions by selling hardware components like microcontrollers, FPGAs, silicon carbide devices, and analog parts, along with software and development tools. Its products work as configurable silicon paired with software and toolchains that engineers use to design and implement embedded systems in domains such as automotive, industrial, consumer electronics, aerospace, and telecom. The company differentiates itself through a broad product portfolio, a strong education and support ecosystem (including Microchip University), and direct B2B sales and services that help customers develop and deploy solutions. Its goal is to be a leading provider of end-to-end embedded system solutions, generating revenue from hardware, software licenses, development tools, and related services.
Company Size
10,001+
Company Stage
IPO
Headquarters
Chandler, Arizona
Founded
1989
Simplify's Take
What believers are saying
- 3.3 kV mSiC modules target AI data-center solid-state transformers.
- LAN878x and LAN888x PHYs address secure automotive and industrial Ethernet.
- PIC32CM PL10 and EX-423 extend Microchip into upgrade and reliability niches.
What critics are saying
- Automotive Ethernet competition from NXP and STMicroelectronics can pressure LAN878x wins.
- SiC rivals Infineon and Texas Instruments can squeeze Microchip's power-module margins.
- High valuation leaves shares vulnerable if demand recovery or inventory normalization stalls.
What makes Microchip Technology unique
- Microchip offers microcontrollers, FPGAs, analog, timing, and SiC power devices.
- Its embedded-control platform pairs hardware with software, tools, and technical support.
- Microchip serves automotive, industrial, aerospace, communications, computing, and defense customers.
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Benefits
Health Insurance
401(k) Retirement Plan
Stock Options
Performance Bonus
Employee Stock Purchase Plan
Company News
Microchip introduces its 3,3 kV HV-D3 mSiC(R) power modules for solid-state transformers in AI data centers. May 26th 2026 The new silicon carbide modules offer the thermal performance and efficiency needed for SSTs to supply more power to token generation Microchip Technology today announced the availability of its new HV power modules-D3 mSiC(R) 3,3 kVDesigned to facilitate and accelerate the adoption of solid-state transformers (SSTs) in hyperscale AI data centers and other high-voltage power applications, the new modules integrate mSiC MOSFETs.(R) 3,3 kV silicon carbide (SiC) and Schottky diodes in a standard 62 mm package for efficient and direct power supply from the medium voltage network to the server rack. AI data centers continue to expand rapidly, but token generation is limited by available power supply; at the same time, efficiency is a primary factor for return on investment. Traditional architectures based on bulky, low-frequency transformers add complexity, increase losses, and limit flexibility. solid-state transformers They represent a significant turning point for power supplies, as they reduce the number of conversion stages and allow for increased system efficiency. The adoption of distributed DC power in the rack at higher voltages in next-generation AI centers further increases the value of SSTs, whose purpose was to supply regulated DC directly from the medium-voltage grid with fewer conversion stages. Microchip's HV-D3 mSiC modules are specifically designed to meet these requirements. These modules utilize Microchip's mSiC MOSFET technology, which offers excellent R stability.[DS(on)] Regarding temperature, the encapsulation provides 6 kV insulation, incorporates CTI 600 rated materials, and extends the creepage distances, designed to allow for safe high-voltage series connection. The silicon nitride (Si[3]N[4]) substrate improves thermal connectivity and its ability to withstand power cycling, thus helping engineers increase power density with less aggressive cooling. "AI data centers continue to increase the demands on power delivery between the electrical grid and the GPU, making solid-state transformers increasingly important," said Clayton Pillion, vice president of Microchip's High Power Solutions business unit. "Our 3,3 kV HV-D3 mSiC power modules allow designers to reduce the number of devices connected in series by about half compared to other lower-voltage SiC devices when connected to 13,8 kV or 34,5 kV networks. These devices also fill a critical gap in the industrial market for 100-300 A products by integrating discrete SiC devices and much larger power modules." The HV-D3 mSiC power modules are available in half-bridge and common-source configurations, with and without antiparallel Schottky diodes, for applications in the 100-300A range. Microchip's mSiC MOSFET technology offers balanced switching losses for both hard and soft switching topologies, making these devices well-suited for SST designs and other high-frequency, high-voltage systems. While optimized for solid-state transformers in AI data centers, HV-D3 mSiC power modules also address a wide range of applications, including megawatt charging infrastructure for heavy vehicles, auxiliary power supplies for rail and heavy transport, medium-voltage motor drives, and industrial and defense power systems. These markets benefit from the same combination of high insulation, thermal robustness, and efficient power conversion. Microchip has over 20 years of experience developing, designing, manufacturing, and supporting SiC power devices and solutions to help customers adopt SiC easily, quickly, and confidently. The company's mSiC products and solutions are designed to reduce system costs, shorten time to market, and minimize risk. Microchip offers a broad and flexible range of SiC diodes, MOSFETs, and gate drivers. For more information, visit [website address]. www.microchip.com/sic. Development tools The 3,3 kV power modules are supported by a application notes, a design guide, and device and simulation models for rapid prototype development. Microchip also provides global technical support, design services, and on-site application engineering support. Prices and availability 3,3 kV mSiC power modules are now available acquire in production quantities, either directly to Microchip or through a sales representative or authorized distributor from Microchip. High-resolution images are available on Flickr or by editorial contact (free publication):
Microchip Technology has partnered with Sunny Smartlead, a global automotive camera module supplier and subsidiary of Sunny Optical Technology Group, to expand the Automotive SerDes Alliance Motion Link (ASA-ML) ecosystem. Sunny Smartlead is introducing Advanced Driver-Assistance Systems camera modules built on Microchip's VS700 family of ASA-ML devices. The collaboration combines Microchip's ASA-ML serialiser technology with Sunny Smartlead's camera expertise to help automotive manufacturers develop standardised ADAS camera solutions for Software-Defined Vehicles. ASA-ML technology features integrated security and timing capabilities, including link-layer authentication and precision time synchronisation across sensors. The partnership aims to create a production-ready, multi-vendor camera ecosystem around ASA-ML, offering an alternative to proprietary technologies. Sunny Smartlead's camera modules integrate Microchip's VS775S serialiser to support development within the ASA-ML ecosystem.
Everspin Technologies expands on-shore MRAM manufacturing capacity. Strategic manufacturing agreement with Microchip Technology to expand production capacity and strengthen long-term supply. Everspin Technologies Inc. announced its strategic manufacturing agreement with Microchip Technology, Inc. to expand production capacity and strengthen long-term supply.The company has entered into an initial 10-year agreement, that can be extended in 2-year increments, with Microchip Technology to augment its onshore manufacturing capacity for MRAM and Tunnel Magnetoresistive (TMR) sensor products. The firm will establish a copy exact (plus) MRAM line to manufacture MRAM and TMR sensor products currently produced at its line in Chandler, AZ. "Everspin is expanding its manufacturing footprint to support the next phase of MRAM adoption, as customers look for both long-term supply stability and higher-density, more capable solutions," says Sanjeev Aggarwal, president and CEO. "Our partnership with Microchip adds the production scale to support demand while continuing to advance our MRAM roadmap." Under the agreement, Everspin will stand up its industry magnetic technology and manufacturing process at a Microchip fabrication facility in Oregon. The company will retain ownership of the intellectual property and manufacturing process while utilizing Microchip's foundry services capacity. This expanded capacity will leverage Everspin's strong balance sheet and partnerships. "Microchip is pleased to collaborate with Everspin and provide foundry services from its large and expandable manufacturing capacity in our Oregon Fab," said Michael Finley, SVP, fab operations, Microchip'. The agreement will provide Everspin and its customers with several strategic benefits: * Increased wafer capacity to support growth plans * On-shore second source for MRAM and TMR sensor products * Continuity of supply lasting well into the next decade * Additional opportunities for Everspin to continue R&D programs advancing MRAM capabilities for next-gen use cases and workloads * International Traffic in Arms Regulations (ITAR) wafer processing capabilities The company will continue to manufacture MRAM and TMR sensor wafers in its Chandler, AZ facility co-located at NXP. The company plans to leverage its 20 years of MRAM production experience from Everspin's Chandler operation as a benchmark for process bring up at Microchip ensuring a timely and seamless process installation. The company expects the first products to ship from the Everspin-Microchip collaboration in the 2nd half of 2027. Read also: 64Mb xSPI STT-MRAM completes production qualification, and 128Mb and 256Mb xSPI STT-MRAM advancing through final qualification phases Read bandwidth of up to 400MB/s and write bandwidth of approximately 90MB/s, over 400 times faster than NOR flash, and write endurance up to 10 times higher than typical NOR AEC-Q100 Grade 1 MRAM delivers 10-year data retention at 125°C, 48-hour burn-in, and unlimited endurance for mission-critical systems Integrating Everspin's MRAM technologies with Quintauris' reference architectures and real-time platforms
Reference platform targets robust 10BASE-T1S Ethernet design. New Products | April 4, 2026 By Jens Nickel A new system-level reference design platform aims to accelerate adoption of Single-Pair Ethernet (SPE) in industrial and building automation applications. Developed through a collaboration between Arrow, Microchip, Bourns and Amphenol, the REF_SPE_T1S platform provides a practical evaluation environment for engineers transitioning from legacy fieldbus technologies to Ethernet at the edge. The platform addresses a key challenge in SPE deployment: ensuring signal integrity and electromagnetic compatibility (EMC) in electrically noisy environments. It also highlights the growing importance of magnetics design in achieving reliable Ethernet communication beyond the PHY layer. Magnetics design drives SPE performance The REF_SPE_T1S platform is built around Microchip's LAN8670 10BASE-T1S PHY and an IEC 63171-6 compliant SPE connector from Amphenol. At its core is an integrated magnetics solution from Bourns, combining an isolation transformer and common-mode choke (CMC) in a single component. The design demonstrates how the magnetic interface between PHY and cable plays a critical role in overall SPE performance. According to the developers, integrated transformer-based isolation significantly improves common-mode noise rejection and galvanic isolation, particularly at low frequencies - an area where capacitor-only isolation approaches can fall short. This enhanced noise suppression helps maintain signal integrity and stable connections in harsh industrial environments, where conducted and radiated interference can degrade communication reliability. The approach also improves emissions margins, supporting compliance with EMC requirements. Supporting the shift from fieldbus to Ethernet As industrial systems migrate away from legacy communication standards such as CAN and RS-485, SPE is emerging as a key enabler for Ethernet connectivity down to sensor and actuator level. The REF_SPE_T1S platform is positioned as a tool to support this transition by providing measurable insights into network robustness. The USB-powered evaluation board allows engineers to compare transformer-based isolation with capacitor-based designs in real time. It supports both point-to-point and multidrop 10BASE-T1S configurations, enabling validation of network stability and channel performance before finalising product designs. Target applications include industrial automation, HVAC and building control systems, as well as embedded edge devices requiring reliable, low-speed Ethernet connectivity. By offering a reference schematic and live testing environment, the platform is intended to reduce design risk and accelerate time-to-market for SPE-enabled products. Overall, the REF_SPE_T1S highlights how careful optimisation of the physical layer - including magnetics and isolation strategy - remains critical as Ethernet continues to expand into increasingly demanding edge environments. At the Arrow webpage developers can apply for samples. Linked Articles
Arrow, Microchip, Bourns, and Amphenol produce reference design for SPE. Arrow, Microchip, Bourns, and Amphenol have come up with an evaluation platform - the 10BASE-T1S REF_SPE_T1S reference design board. The design assists engineers in adopting Single Pair Ethernet (SPE) by addressing the magnetic connection that links data to the physical cable and enables system-level evaluation of signal integrity, EMC behaviour, and noise immunity in real-world applications. SPE performance is defined not only by the PHY but by the quality of the magnetic interface that connects it to the cable. Built around Microchip's LAN8670 10BASE-T1S PHY and IEC 63171-6 compatible Amphenol's SPE connector, this design demonstrates how Bourns integrated isolation transformer and common-mode choke (CMC) magnetics (Model SM91081AL) play a critical role at the physical layer. By significantly improving common-mode noise rejection and galvanic isolation especially at low frequencies, the board helps maintain signal integrity and connection stability in electrically noisy industrial and building-automation environments. As industries transition away from legacy systems like CAN or RS-485, there is an increasing requirement for reliable Ethernet connectivity at the "edge," including sensors and actuators. By utilizing an integrated transformer design instead of traditional capacitor-only isolation approaches, this evaluation board offers improved signal clarity and connectivity, particularly through superior low-frequency noise attenuation and enhanced immunity to conducted and radiated interference. This approach provides a necessary margin for error against the electrical noise common in industrial settings and supports improved EMC and emissions performance, helping design engineers to meet regulatory compliance requirements more efficiently. Whether intended for factory automation, HVAC systems, or building controls, this SPE USB-powered platform provides a live demonstration of network robustness. Engineers can directly compare transformer-based isolation against capacitor isolation, observe common-mode noise suppression behaviour, and evaluate EMC and emissions performance. Arrow provides this tool as a reference schematic solution for new designs which also allows designers to measure network stability in both point-to-point and multidrop 10BASE-T1S configurations, validating network stability and SPE channel performance before a final product design is finalized. Advanced technical support and customization services are available from Arrow's engineering solutions center (ESC). The 10BASE-T1S REF_SPE_T1S reference design is available now through Arrow. For more information, please visit https://www.arrow.com/