A

Amazon

Sells products online and rents cloud computing

Senior Thermal & Mechanical Packaging Engineer

Thermal & Fluids EngineeringConfirmed live in the last 24 hours
Full-timeAustin, TX, USAIn-person

About the Job

Requirements

  • Experience communicating with customers, technical, regulatory, business teams, and management to collect requirements, describe product features, and technical designs.
  • A master's degree in mechanical engineering or equivalent.
  • At least 5 years of industry experience in advanced packaging of semiconductors.
  • Direct experience designing and testing test vehicles to assess future packaging architectures and evaluating properties of next-generation materials.
  • Expertise optimizing packaging architectures to meet quality, performance, and cost goals.
  • At least 10 years of industry experience in mechanical design of semiconductor-based systems, including silicon, packaging, and system design.
  • Industry experience working with packaging component vendors and original design manufacturers (ODMs), and internal design teams on cross-boundary triaging, debugging, and resolving issues across organizations.
  • Proficiency with simulation tools such as ANSYS, ABAQUS, COMSOL, FLOTHERM, ICEPACK, or equivalent finite element analysis (FEA) or computational fluid dynamics (CFD) software.

Responsibilities

  • Design and build hardware systems for large-scale data centers, developing from circuit-level design through large system design, including thermal and mechanical solutions, and supporting those systems through high-volume manufacturing.
  • Provide leadership in applying new technologies to large-scale server deployments.
  • Design and optimize hardware for data centers, with work affecting hardware deployed in AWS data centers.

Desired Qualifications

  • Experience in advanced packaging metrologies for characterization and design validation of semiconductor components, packages, and platforms.
  • Hands-on experience with lab-based thermal and mechanical measurements, including instrumentation, infrared thermography, acoustic chambers, mechanical stress/strain gauges, power measurement equipment, and thermal test setups for package- and system-level characterization.
  • Strong understanding of product development lifecycles from concept through high-volume manufacturing.
  • Experience with technologies used for heatsink solutions, thermal interface materials (TIMs), and liquid cooling technologies, including cold plate design; working knowledge of fans, quick disconnects (UQDs), manifolds, and coolant distribution units (CDUs).
  • Experience developing detailed computational fluid dynamics (CFD) and compact resistance-capacitance (RC) models for system-on-chip (SoC) and package thermal analysis, correlating simulation models with experimental data, and iterating designs based on empirical findings.
  • Demonstrated ability to design, set up, and execute laboratory experiments, including building custom test fixtures, operating data acquisition systems, and performing root-cause failure analysis on hardware; experience with Design of Experiments (DOE) and Six Sigma methodologies.
  • Knowledge of hardware- and software-based thermal and power management control algorithms.
  • Experience validating thermal models through power and thermal measurements on hardware.

About the Company

Amazon

Sells products online and rents cloud computing

Amazon runs the largest online store in the United States and rents cloud computing to businesses and governments through Amazon Web Services. AWS pioneered renting computing power over the internet, and Amazon built its own delivery network to get orders to customers quickly. Shoppers buy from Amazon and from independent sellers on its store, and Prime members pay a subscription for fast free shipping, streaming video and music, and other perks. AWS rents out computing power, storage, databases, and AI tools so companies can run software without owning servers, and Amazon also makes Kindle e-readers and Echo speakers with the Alexa assistant. Jeff Bezos founded Amazon in 1994, and it is based in Seattle, Washington.

Company size
10,001+
Company stage
IPO
Headquarters
Seattle, WA
Founded
1994

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