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Micron Technology

Makes memory and storage chips for AI and PCs

Principal Engineer - HIG-HBM Product Engineering, Media Health Manufacturing

Process EngineeringUpdated on Nov 4
Full-timeSingaporeNo salary listed

About the Job

Requirements

  • A Bachelor's or Master's degree in Electrical and Electronics Engineering and 8+ years of experience in the semiconductor industry are required.
  • Strong leadership and technical skills are required, especially problem-solving, root-cause understanding, and solution development through in-depth circuit analysis.
  • Knowledge of statistics, data analysis tools, and scripting is required.
  • The candidate must be dedicated and highly motivated, and adaptable to different roles in a dynamic working environment, from leading the team to leading technical programs.
  • A proven track record of collaborative work within and across teams to address sophisticated business and engineering problems is required.
  • A strong sense of responsibility and accountability toward the assigned role, with a professional work ethic, is required.
  • Excellent communication and presentation skills are required.
  • The candidate must be passionate about people leadership and ongoing learning and development in this area.
  • The role requires working on site in Singapore and international travel to the United States, Taiwan, and Japan.

Responsibilities

  • Spearhead and develop a high-performing team responsible for Media Health Manufacturing activities for next-generation HBM products across DRAM, Interface die, and stacked products.
  • Lead a portfolio of next-generation HBM products focused on quality, cost, cycle time, and scale.
  • Lead manufacturing test-flow development and validation.
  • Improve device and stacked-product yield and reliability through in-depth circuit debugging, test-coverage optimization, strategy innovation, manufacturing-flow test-time improvement, and DFT strategy development.
  • Ensure optimized test coverage across current and future HIG HBM design architectures and process nodes for high-volume manufacturing.
  • Develop, validate, characterize, and qualify next-generation HBM products, ensuring reliability and readiness for market.
  • Support design verification and in-depth circuit analysis of new products using CAD tools and Verilog simulations.
  • Improve manufacturing test yields related to DRAM, Interface, and stacked-die issues, reduce test time, and resolve yield-related problems.
  • Find root causes and resolve manufacturing test-flow, qualification, and RMA device issues.
  • Promote innovation and drive changes that provide a technical advantage.
  • Develop and mentor others.
  • Develop project-management skills within the team to support efficient execution and timely delivery of technological solutions.
  • Make final decisions on risk analysis and project prioritization.
  • Collaborate with Fab, HBM Technology Development, HBM Design, System Development, and Quality/Reliability teams to develop and ship end products.
  • Identify, test, and share AI-enabled enhancements within the scope of work as part of continuous improvement.

Desired Qualifications

  • Product Engineering experience is preferred.

About the Company

Micron Technology

Makes memory and storage chips for AI and PCs

Micron Technology designs and manufactures memory and storage chips, mainly DRAM and NAND flash, used in data centers, PCs, phones, cars and industrial equipment. It is one of only three companies that make HBM, the stacked high-bandwidth memory placed beside processors in AI servers, and it is the largest memory chipmaker based in the United States. Unlike chip designers that outsource production, Micron runs its own fabs and assembly sites in the United States and across Asia. It earns money by selling chips, memory modules and solid-state drives to cloud providers, device makers and distributors. Micron was founded in 1978 and is headquartered in Boise, Idaho.

Company size
10,001+
Company stage
IPO
Headquarters
Boise, ID
Founded
1978

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