B

Broadcom

Designs chips and software for data centers

Mechanical Engineer

Design Engineering +1Confirmed live in the last 24 hours
Full-timeSan Jose, CA, USAIn-person

About the Job

Requirements

  • A bachelor's degree in Mechanical Engineering or a related field and 8+ years of experience in enclosure design and thermal test validation are required.
  • Proficiency in PTC Creo and Windchill Product Lifecycle Management is required.
  • A strong background in heatsinks, heat pipes, vapor chambers, and liquid cooling systems is required.
  • Hands-on experience with thermal measurement technologies, sensors, and laboratory instrumentation is required.
  • Knowledge of datacenter rack standards, including EIA-310 and OCP, is required.
  • Familiarity with EMI/EMC shielding and compliance design considerations is required.
  • Exposure to compliance and reliability testing, including NEBS, shock and vibration, and thermal cycling, is required.
  • Experience working with global contract manufacturers and suppliers to bring products from prototype to volume production is required.
  • Experience with high-speed cabling design and routing, including OSFP copper, optical, and internal cables, bend-radius management, cable retention features, and serviceability within dense rack enclosures, is required.

Responsibilities

  • Lead thermo-mechanical laboratory operations, including liquid cooling infrastructure, BGA socket thermal validation, and system-level testing.
  • Own thermo-mechanical system component validation and troubleshooting, driving solutions from concept through production.
  • Develop and qualify advanced thermal solutions, including heatsinks, vapor chambers, liquid cooling, and manifolds, through vendor collaboration.
  • Conduct system-level thermal tests and correlate results with simulations.
  • Define and execute thermal test plans, including documentation and data reporting.
  • Design rack-mount enclosures and system components based on production requirements, collaborating with electrical engineering, thermal, compliance, and manufacturing teams.
  • Manage vendor relationships for thermal solution components, including heatsinks, manifolds, fans, and cooling hardware.
  • Troubleshoot and resolve system-level thermal issues in high-power prototypes.

About the Company

Broadcom

Designs chips and software for data centers

Broadcom designs chips and sells infrastructure software for the companies that run large data centers, telecom networks and corporate IT. Its custom AI processors, built with cloud companies, and its Ethernet switch chips move and process data inside the computer clusters that train AI models. The chip business also makes parts for broadband, wireless, storage and industrial equipment, sold to device makers and cloud operators, while VMware software lets businesses run private clouds and is sold by subscription. Broadcom took its current form in 2016, when Avago Technologies, formed in 2005 from Agilent's chip unit, bought Broadcom Corporation, and it is based in Palo Alto, California.

Company size
10,001+
Company stage
IPO
Headquarters
Palo Alto, CA
Founded
2005

Recently Posted Jobs

Explore more opportunities at Broadcom

See more jobs